Intel® Core i7 Broadwell Processor, 9V to 36V DC-in, Extended Temp. -40 ~ 70°C

  • Design for reliability under demanding MIL-STD-810G Thermal, Shock, Vibration, Humidity/EMI/EMC conditions
  • Heavy-duty fully IP54 Rugged aluminum chassis with M12 connectors
  • 5th Gen Intel® Broadwell-U processors Onboard
  • XR-DIMM DDR3L Up to 16GB
  • Multi-Displays by 2 x DisplayPort
  • 2 x RJ45 , 2 x M12 Rugged Ethernet connectors
  • 1 x Rugged Digital I/O
  • 2 x USB 3.0, 2 x USB 2.0, 4 x COM ports (3 x RS232, 1x RS232/422/485)
  • 9V~36V DC-in by M12 connector
  • Extended Temperature -40 to 70 °C
  • 2 optional power for EN50155 compliance

CPU Performance

The CPT10M offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers' extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.
Device Model   CPT10M
Tester   Ian Huang
Test Result   Pass
Test Temperature   High 0~70°C / Low -40~0°C
Test Time   8Hours / 1.5Hours
Test Standard   Reference IEC60068-2
Test Software   Burnin test v6.0
Criteria   After testing, system can't halt.

Test Configuration

Device   Configuration   Manufacturer   Part Number
CPU Type   Intel® Core i7-5650U Processor 3.20 GHz   Intel   i7-5650U
Memory DIMM   Swissbit 4GB EP3L SLV04G64A1BB1SA-DCRT   Swissbit   SLV04G64A1BB1SA-DCRT
SATA Port1   Innodisk FID 2.5" SATA SSD 2IE 64GB   Innodisk   DHS25-64GJ201C1EN
SATA Port2   Apacer SSD 256GB   Apacer   81.DIFU8.JKDA8
LAN1   Intel® I210 Gigabit Network   Intel   I210
LAN3   Intel® I210 Gigabit Network   Intel   I210
LAN4   Intel® I210 Gigabit Network   Intel   I210
Test Software   Burnin test v7.1、AS SSD、
Intel Extreme Tuning Utility、iperf
Chamber   KSON THS-b4t-150   KSON Chipeng   THS-b4t-150 SMO-3

Thermal Measurement

STACKRACK provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus STACKRACK conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, STACKRACK is able to analyses the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5 hours which at each temperature point we burn in CPT10M for one hour, from +50 to +85°C.

CPT10M MB HeatSink - IO Performance

Point   -40°C   25°C   40°C   45°C   50°C   55°C   60°C   65°C   70°C
CPU T-J   0   70   82   89   93   100   103   104   104
CPU Die   -28.1   55.1   58.3   63.4   69.1   74.4   79.9   83.3   86.3
Heatsink   -33.6   48.1   52.3   57.3   62.3   68.2   73.4   78.3   82.5
Δ1=(TJ-Die)   28.1   14.9   23.7   25.6   23.9   25.6   23.1   20.7   17.7
Δ2=(Die-HeatSink)   5.5   7.0   6.0   6.1   6.8   6.2   6.5   5.0   3.8
CPU Frenquency   3GHz   3GHz   3GHz   3GHz   3.02GHz   2.82GHz   2.8GHz   2.55GHz   2.19GHz