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Intel® QM170 MIL-STD Fanless Rugged System with Intel® Core i7-6820EQ Skylake Processor, NVIDIA GTX950M GPU, 4 Independent DisplayPort, 9V to 36V DC-in, Wide Temp. -40 to 60°C

  • MIL-STD 810G Compliance
  • 6th Generation Intel® Core i7-6820EQ Skylake Processor
  • Up to 32GB DDR4 RAM
  • Onboard uSSD SATAIII up to 64 GB
  • NVIDIA GTX950M Independent Displays by 2 x DP
  • 2 x mPCIe expansion slot (One Co-Layout with mSATA)
  • 2 x Intel® Gigabit Ethernet
  • 4 x USB 3.0, 1 x COM port
  • 9V to 36V DC-in
  • Extended Temperature -40~+60°C


SR200-X2, EBX rugged system is a powerful system that is driven by Intel® 6th generation Skylake CPU and chipset soldering onboard, integrated with Nvidia GPU GTX950M that supports 2 independent DisplayPort. Processor i7-6820EQ plus Intel® QM170 chipset supports clock speed 2.8GHz, up to 3.5GHz. Quad cores, turbo up to 8 cores to cope with enormous data computing. Apart from computing power, the system is able to survive in harsh environment from -40 to 60°C, and ruggedness for vibration and shock is proven to pass MIL-810G standard. With the combination of high CPU computing power and rich display inputs, SR200-X2 is a perfect portable solution for rugged consoles & workstations, transportation, defense control room to share instant and accurate information on huge screen for in-time solutions.

Thermal solution for fanless system design

STACKRACK designs a unique enclosure that is able to stack together both horizontally and vertically. The aluminum heat sink enclosure allows dual-sided heat dissipation. STACKRACK exclusively adopts special heat radiating material and combining with special CNC cutting, further forged into a lavish sophisticated metal. Apart from the special heat sink enclosure, SR200-X2 innovatively adopts two kinds of copper heat spreader. The shape and the size of the spreader are tailor-made based on the heat sources placement of CPU module and graphic module. In view of the gap difference between motherboard and heat sink, STACKRACK builds two heat spreaders in different thicknesses. Combining all these exclusive thermal designs can alternatively replace traditional fan, and also ensures high reliability and stability while working under wide range temperature from -40 up to 60°C

System main board: EBX SBC-OXY5739A

(1) Intel® Core i7 CPU soldering onboard
SR200-X2 is based on EBX SBC—OXY5739A, powered by Intel Skylake i7-6820EQ quad core processor plus QM170 chipset soldered onboard. With CPU soldering onboard, there is less conduction of heat and high density interconnection between the motherboard and the components, which reduces the MB from the crisis of overheating. Apart from overheating, soldering onboard also provides the best level of shock and vibration protection, removing the unnecessary concern about poor connection that CPU socket type may bring.
  (2) Two Independent DisplayPort
SR200-X2 has added on NVIDIA graphic card through PCIe/104 interface, supporting 4 independent DisplayPort which is driven by GPU GTX950M. GTX950M itself has high CUDA640 points, representing its high computing performance and consumes power at 55W maximum. Connecting by PCIe/104 interface which enhance the resistance of shock and vibration as the connector allows nearly seamless connecting.
  (3) Wide Range DC input
For military and heavy duty vehicle applications, instable voltage always brings headaches about damaging the electric components. SR200-X2 supports 9V to 36V DC-in, the flexible acceptance of inconsistent power input makes it capable of surviving tough engine cranks and transient over-voltage situations.