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HORUS330-X2 - Intel® Xeon® D 8 Cores GPUCPU Server

1.5 U Fanless Rugged GPU Server Intel® Xeon® D Processor, MXM Graphic Card, 9V to 36V DC-in, Operating Temp -20°C to 50°C. 

NVIDIA® GTX950M (CUDA Cores: 640)/GTX1050(CUDA Cores: 640)/GTX 1050 Ti(CUDA Cores: 768)/GTX1060 (CUDA Cores: 1280) GPU 

 

  • MIL-STD 810G Compliance
  • Intel® Xeon® D-1548 Processor
  • 2 x DDR4 SO-DIMM up to 32GB RAM
  • MXM Graphic Card support
  • 4 x Intel® Gigabit Ethernet
  • 2 x CAN bus
  • 4 x USB, 1 x COM
  • 9V to 36V DC-in
  • Operating Temp. -20°C~50°C
  • NVIDIA® GTX950M (CUDA Cores: 640)/GTX1050(CUDA Cores: 640)/GTX 1050 Ti(CUDA Cores: 768)/GTX1060 (CUDA Cores: 1280) GPU
  • Technical Profile
  • Specifications
  • CPU Performance
  • SSD Performance
  • Thermal Solution
 Introduction

HORUS330-X2, 1.5 U Fanless Rugged GPU Server is a powerful system driven by Intel® multi-core Processor Xeon D-1548, the 8-core CPU, supports 2.0GHz, up to 2.6GHz clock speed for high-end computing performance. Not only with outstanding CPU performance, HORUS330-X2 has integrated graphics card NVIDIA® GTX950M/GTX1050Ti to apply all sort of applications. HORUS330-X2 has provided rich I/O such as 4 x USB 3.0, 1 x COM port, 2 x DisplayPort and 4 x LAN ports. HORUS330-X2 is highlighting on rugged design and high functionality, the special dual thermal solution allows powerful system to present supreme performance under harsh environment. With rugged design, the system is suitable for the use in high-end automation and passenger information system in the field of military, transportation and so on.

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Dual thermal solution ensures supreme system performance
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With combination of high end CPU computing and graphic GPU power generate numerous heat, STACKRACK emphasizes on providing exceeding thermal design guarantee superior system performance under critical environment. HORUS330-X2 innovatively adopts dual sided thermal solution, with copper heat spreader directly touches the heat source components processor and graphic GPU to absorb the heat rapidly, heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid which can provide high efficiency heat transmission. The aluminum heat sink dissipates the heat into surrounding air promptly. One side thermal solution is mainly for Xeon® Processor D-1548 45W processor and the other side is to dissipate the heat for graphic GTX950M/GTX1050Ti GPU. With unique thermal design, HORUS330-X2 can ensure high performance and reliability while working under extended range temperature from -20°C up to 50°C.

NVIDIA GTX1050Ti GPU, Stunning Graphics
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Performance

HORUS330-X2 is installed with graphics card NVIDIA GTX1050Ti GPU (CUDA 768, Clock speed 1493MHz), allowing generate excellent resolution and supports high efficiency and fluency of image processing with competitive G3D Mark and low power consumption. The system possess great superiority for image computing utilization, including 2D/3D mapping and real-time image process for autonomous vehicle, surveillance system for control room, other navigation, radar, detection, sensor and laser systems on all maritime, ground, and aerial applications in both defense and industrial fields.

I/O Expansions

HORUS330-X2 is designed to fulfill demands of different application. Apart from standard I/O interface, HORUS330-X2 equipped with quad LAN ports, COM Port, CAN Bus and 2 display output from GTX1050Ti. With these expansions, HORUS330-X2 can be easily applied to control room or driverless vehicles application.



19"rackmount bracket

The ability of keep HORUS330-X2 inside cabinet is also an enhanced ways to keeping your server secure. Which STACKRACK has designed a 19"”"rackmount bracket allows HORUS330-X2 place inside a cabinet in order to protect from climate issue, dust and pests attack.

 

Operating Temp.

-20°C~50°C (ambient with air flow)

System

CPU

Intel® Xeon® D Processor
Intel® Xeon® Processor D-1548 2.6 GHz (12M Cache, 45W)

Memory Type

2 x DDR4 SO-DIMM up to 32GB

Expansion Slot

1 x 2280 M.2 (SATA signal)

Storage Device

2 x 2.5"Easy swap HDD/SSD Tray

Front I/O

Power Button

1 with LED backlight

HDD LED

1

2.5" SSD/HDD Tray

2

Handle

2

Rear I/O

USB

4 x USB 3.0

DisplayPort

2 x DisplayPort (From NVIDIA GeForce GTX 950M/1050TI)

VGA

1 x VGA (Only on GTX950M Model)

Ethernet

4 x RJ45 GbE

Serial Port

1 x DB9 connector (RS-232/422/485)
{ 2 x DB9 connector (RS-232/422/485) Only on GTX1050TI Model }

CAN bus

2 x DB9 connector

DC-IN

2 x 4P Rugged Terminal connector

OS support list

Windows

Windows 10

Linux

Fedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04

Mechanical and Environment

Power Requirement

9V to 36V DC-in
Additional 12V DC-in for MXM Graphic Card if necessary

Dimension (WxDxH)

342.0 x 228.4 x 83.6 mm

Weight

>6.20 kg

Operating Temp.

-20°C to 50°C (ambient with air flow)

Storage Temp.

-40°C to 85°C

Relative Humidity

10% to 90%, non-condensing

Test Standard

EMC

CE, FCC compliant

Green Product

RoHS, WEEE compliance

 The HORUS330-X2 offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers' extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.

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Device Model
HORUS330-X2
Tester
Robin Chang
Test Result
Pass
Test Temperature
High 0°C~50°C / Low -20°C~0°C
Test Time
8 Hours / 1.5 Hours
Test Standard
Reference IEC60068-2
Test Software
Burnin test v6.0
Criteria
After testing, system can’t halt.

 

Test Configuration
Device
Configuration

CPU

Intel® Xeon® D-1548 Processor 2.6 GHz

Memory DIMM

Innodisk 8GB DDR4 SODIMM

SATA Port1

Innodisk 3ME4 2.5" SATA SSD 64GB

SATA Port2

Innodisk 3MG2 2.5" SATA SSD 512GB

Graphic Card

Aetina MXM GeForce GTX 1050 Ti

LAN1

Intel® I210 Gigabit Network

LAN2

Intel® I210 Gigabit Network

Test Software

Burnin test v7.1AS SSD
Intel Extreme Tuning Utilityiperf

Chamber

KSON THS-b4t-150

Thermal Measurement

STACKRACK provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus STACKRACK conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, STACKRACK is able to analyses the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5.5 hours which at each temperature point we burn in HORUS330-X2 for two hour, from 40°C to 50°C.

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Horus330-X2 CPU Performance

Point
-20°C
0°C
25°C
40°C
50°C
CPU T-J 31 53 82 90 98
CPU Die 23.5 45.8 74.3 82.8 93.5
CPU Heatsink 9.5 31.8 60.3 67.1 76.6
CPU Frenquency (GHz) 2.3 2.3 2.3 2.3 2.3

 

HORUS330X2

Test Result

SR100Innodisk 2.5" SATA SSD 64GB ( Read MB/s )

NEW_STYLE_products_SR100_SSD03Innodisk 2.5" SATA SSD 64GB ( Write MB/s )

Horus330-X2 System - IO Performance

Point

-20°C

0°C

25℃ Room temperature

55°C

60°C

Innodisk 2.5" SATA SSD 64GB ( Read MB/s) 518.9 516.2 513.5 519.1 519.9
Innodisk 2.5" SATA SSD 64GB ( Write MB/s) 192.3 195.4 198.9 197.7 199.3

Effective cooling solution for maximum heat dissipation:

STACKRACK implements unique cooling solution with copper heat spreader, pure copper heat pipe and aluminum heat sink for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of copper and aluminum, the heat spreader touches the heat source - processor and chipset and absorbs the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, HORUS330-X2 can ensure high reliability and stability while working under wide range temperature from-20°C up to 50°C.

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