AV200
Intel®6th Gen. Core™i7-6820EQ NVDIA GTX950M GPU MIL-STD Fanless Rugged System
- MIL-STD 810G Compliance
- 6th Generation Intel® Core™ i7-6820EQ Skylake Processor
- Up to 32GB DDR4 SDRAM
- Onboard uSSD SATAIII 64GB
- NVIDIA GTX950M Independent Displays by 2 x DP
- 2 x mPCIe expansion slot (One supports mSATA)
- 2 x Intel® Gigabit Ethernet
- 4 x USB 3.0, 1 x COM port
- 9V to 36V DC-in
- Extended Temperature -40°C to 60°C
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- 製品概要
- Specifications
- CPU Performance
- SSD Performance
- Thermal Solution
Introduction
AV200, EBX rugged system is a powerful system that is driven by Intel® 6th generation Skylake CPU and chipset soldering onboard, integrated with Nvidia GPU GTX950M that supports 2 independent DisplayPort. Processor i7-6820EQ plus Intel® QM170 chipset supports clock speed 2.8GHz, up to 3.5GHz. Quad cores, turbo up to 8 cores to cope with enormous data computing. Apart from computing power, the system is able to survive in harsh environment from -40 to 60°C, and ruggedness for vibration and shock is proven to pass MIL-810G standard. With the combination of high CPU computing power and rich display inputs, AV200 is a perfect portable solution for rugged consoles & workstations, transportation, defense control room to share instant and accurate information on huge screen for in-time solutions.
- Thermal solution for fanless system design
-
STACKRACK designs a unique enclosure that is able to stack together both horizontally and vertically. The aluminum heat sink enclosure allows dual-sided heat dissipation. STACKRACK exclusively adopts special heat radiating material and combining with special CNC cutting, further forged into a lavish sophisticated metal. Apart from the special heat sink enclosure, AV200 innovatively adopts two kinds of copper heat spreader. The shape and the size of the spreader are tailor-made based on the heat sources placement of CPU module and graphic module. In view of the gap difference between motherboard and heat sink, STACKRACK builds two heat spreaders in different thicknesses. Combining all these exclusive thermal designs can alternatively replace traditional fan, and also ensures high reliability and stability while working under wide range temperature from -40°C to 60°C
- System main board: EBX SBC-OXY5739A
-
1. Intel® Core i7 CPU soldering onboard
AV200 is based on EBX SBC—OXY5739A, powered by Intel Skylake i7-6820EQ quad core processor plus QM170 chipset soldered onboard. With CPU soldering onboard, there is less conduction of heat and high density interconnection between the motherboard and the components, which reduces the MB from the crisis of overheating. Apart from overheating, soldering onboard also provides the best level of shock and vibration protection, removing the unnecessary concern about poor connection that CPU socket type may bring.
2. Two Independent DisplayPort
AV200 has added on NVIDIA graphic card through PCIe/104 interface, supporting 4 independent DisplayPort which is driven by GPU GTX950M. GTX950M itself has high CUDA640 points, representing its high computing performance and consumes power at 55W maximum. Connecting by PCIe/104 interface which enhance the resistance of shock and vibration as the connector allows nearly seamless connecting.
3. Wide Range DC input
For military and heavy duty vehicle applications, instable voltage always brings headaches about damaging the electric components. AV200 supports 9V to 36V DC-in, the flexible acceptance of inconsistent power input makes it capable of surviving tough engine cranks and transient over-voltage situations.
Operating Temp. |
|
---|---|
-40°C to 60°C (ambient with air flow) |
|
System |
|
CPU |
Intel® Core™ Skylake-H |
Memory Type |
Up to 32GB DDR4 SDRAM |
Expansion Slot |
1 x Full-size mPCIe (w/ SIM card and mSATA supported) |
Storage Device |
Onboard uSSD SATAIII 64GB |
Front I/O |
|
USB |
2 x USB3.0 |
2.5" SSD/HDD Tray |
1 |
Power button |
1 x System On/Off |
Indicator LED |
Power, HDD, LAN (Link/Active/Speed) |
Rear I/O |
|
USB |
2 x USB 3.0 |
Display |
4 x DisplayPort |
Audio |
2 x 3.5mm Audio Jacks (1 x MIC, 1 x Line-Out) |
Serial Port |
1 x DB9 connector (RS-232/422/485) |
Ethernet |
2 x RJ45 |
Power Input |
1 x 4P Rugged Terminal connector |
OS support list |
|
Windows |
Windows 10 |
Linux |
Fedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04 |
Mechanical and Environment |
|
Power Requirement |
9V to 36V DC-in |
Dimension (WxDxH) |
315.2 x 150 x 120 mm |
Weight |
6 Kg (13.23 lbs) |
Operating Temp. |
-40°C to 60°C (ambient with air flow) |
Storage Temp. |
-40°C to 70°C |
Relative Humidity |
10% to 90%, non-condensing |
Certifications |
|
EMC |
CE, FCC compliant |
EMC |
CE and FCC compliance |
Green Product |
RoHS, WEEE compliance |
The AV200 offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers' extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.
Device Model | AV200 |
Tester | Robin Chang |
Test Result | Pass |
Test Temperature | High 0°C~60°C / Low -40°C~0°C |
Test Time | 11.5Hours / 3Hours |
Test Standard | Reference IEC60068-2 |
Test Software | Burnin test v6.0 |
Criteria | After testing, system can't halt. |
- Test Configuration
-
Device Configuration Manufacturer CPU Type Intel® Core i7-6820EQ 2.8 GHz Intel PCH Q170 Intel Memory 1 x DDR4 2400 XR-DIMM up to 16GB w/ECC Innodisk Memory 1 x DDR4 2400 SO-DIMM up to 16GB w/ECC Innodisk Graphic NVIDIA GTX950M NVIDIA LAN1 Intel® I219 GbE LAN Intel LAN2 Intel® I210 GbE LAN Intel Test Software Burnin test v6.0、AS SSD、 Intel Extreme Tuning Utility、
iperf GPU-Z、FurMark v1.9.2Chamber KSON THS-b4t-150
Chipeng SMO-3KSON Chipeng
- Thermal Measurement
-
STACKRACK provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus STACKRACK conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, STACKRACK is able to analyses the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 9 hours which at each temperature point we burn in AV200 for two hour, from 40°C to 60°C.
AV200 MB HeatSink - IO Performance
Point -40°C -20°C 0°C 25°C 50°C 55°C 60°C CPU T-J 0 25 47 100 100 100 100 CPU Die -21.7 12 31.7 88 91 88 93 Heatsink -32.5 -12 6.9 61 67 71 75 Δ1=(TJ-Die) 11.6 9.4 11 13.1 12.8 10.2 13.6 Δ2=(Die-HeatSink) 4.6 17 2.5 2.1 3.6 3.3 1.3 CPU Frenquency (GHz) 3.2 3.2 3.2 3.1 2.95 2.77 2.6
Test Result
64GB SSD (Read) MB/s
64GB SSD (Write) MB/s
AV200 MB HeatSink - IO Performance
Point | -40°C | -20°C | 0°C | 25°C | 50°C | 55°C | 60°C |
64GB SSD (Read) MB/s | 386 | 389 | 361 | 389 | 407 | 423 | 401 |
64GB SSD (Write) MB/s | 74 | 70 | 75 | 53 | 88 | 73 | 86 |
Effective cooling solution for maximum heat dissipation:
STACKRACK implements unique cooling solution with heat spreader and aluminum heat sink for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of aluminum, the heat spreader touches the heat source - processor and chipset and absorbs the heat rapidly, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, AV200 can ensure high reliability and stability while working under wide range temperature from -40 up to 60°C.
Patent Designed Aluminum Heat Sink
The heat sink is made by heat radiating material, which is aim to lowering the temperature by dissipating heat into the surrounding air. 96 % of aluminum.
Heat spreader
Heat spreader directly touches the power source area, which can absorb heat rapidly.
OXY5739A
STACKRACK QM170 EBX SBC is installed in the middle of the system as a cutoff point, dividing segmentation type thermal design into upper module. Upper thermal module is applied to cool down the heat from CPU module.
Heat spreader
Heat spreader directly touches the heat source- processor and chipset, which absorb heat rapidly.
Patent Designed Aluminum Heat Sink
The heat sink is made by heat radiating material, which is aim to lowering the temperature by dissipating heat into the surrounding air. 96 % of aluminum.