HORUS422A
2U 19" Rugged Rackmount with Intel. Core i7-6700TE, 12 Bays 2.5" SSD/HDD, RAID supported, Operating Temperature 5°C~50°C
NVIDIA® GTX950M (CUDA Cores: 640)/GTX1060(CUDA Cores: 1280)/GTX1080 (CUDA Cores: 2560) GPU
- MIL-STD 810G Compliance
- Intel® 6th Gen. Core i7-6700TE
- 4 x DDR4 XR-DIMM up to 64GB
- RocketRAID 840A RAID Card
- 4 x RJ45 LAN, 6 x USB, 1 x RS232 Console
- 12 x 2.5" Easy swap SSD/HDD Tray
- Extended Temperature 5°C~50°C
- NVIDIA® GTX950M (CUDA Cores: 640)/GTX1060(CUDA Cores: 1280)/GTX1080 (CUDA Cores: 2560) GPU
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- 製品概要
- Specifications
- CPU Performance
- SSD Performance
- Thermal Solution
Introduction
HORUS422A is designed with Intel 6th generation Skylake i7-6700TE processor, Skylake i7-6700TE processor presents outstanding CPU performance with quad cores up to 3.4GHz clock speed. System especially builds in Highpoint RocketRAID 840A SATA RAID Card supports up to 12 SATA/SSD drives.
HORUS422A highlights on it rugged design and high functionality, system especially designed with dual sided thermal solution, allow powerful system presents supreme performance under harsh environment.
Dual sided thermal solution ensures supreme system performance
With combination of high end CPU computing and high bandwidth PCIe bus power generate numerous heat, STACKRACK emphasizes on providing exceeding thermal design guarantee superior system performance under critical environment. HORUS422A innovatively adopts dual sided thermal solution, with copper heat spreader directly touches the heat source components processor and RAID card to absorb the heat rapidly, heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid which can provide high efficiency heat transmission. The aluminum heat sink dissipates the heat into surrounding air promptly. One side thermal solution is mainly for Core i7-6700TE 35W processor and the other side is to dissipate the heat for RocketRAID 840A RAID card. With unique thermal design, HORUS422A can ensure high performance and reliability under harsh environment.
Maximizes SATA SSD Storage Performance
RAID 5 Performance Up to 6,000 MB/s!
RocketRAID 800 host bus adapters are the industry's fastest SATA RAID Controllers. The PCIe Generation 3.0 host interface and dedicated 6Gb/s SATA channels work in tandem to deliver uncompromised transfer performance for up to 16 SSD's or hard disks.
- System main board: ATX AB20
-
1. Intel Skylake Core i7-6700TE powerful processor
HORUS422A is based ATX formfactor AB20 motherboard, powered by Intel 6th generation Skylake Core i7-6700TE, Skylake processor presenting superior CPU and graphics performance, providing quad cores up to 3.4 GHz clock speed over compact size 2U rackmount.
2.Rich I/O interface
AB20 equips extensive I/O interface to fulfill different application requirements. The board supports four XR-DIMM RAM up to 64 GB, it offers 4x LAN, 10x USB and 6x COM for device connects ability, with 4x Mini PCIe slot, 1x PCIex8 and1x PCIex4 can add on extra feature for different demands. With MXM slot can integrate with graphic card for image processing usage.
Operating Temp. |
|
|---|---|
|
5°C to 50°C |
|
System |
|
|
CPU |
Intel® Core i7-6700TE Processor |
|
Chipset |
Q170 |
|
Memory Type |
4 x DDR4 XR-DIMM up to 64GB |
|
BIOS |
AMI® SPI BIOS |
|
Expansion Slot |
4 x mPCIe (two support with mSATA) |
|
Storage Device |
12 x 2.5" (7mm) Esay Swap HDD / SSD Tray |
Display |
|
|
Chipset |
Intel® HD Graphics 500 Series |
|
Display Type |
1 x DisplayPort ; 1 x HDMI |
Ethernet |
|
|
Chipset |
3 x Intel® I210-IT ; 1 x I219-LM GbE LAN |
|
WOL |
Yes |
|
Boot from LAN |
Yes for PXE |
Rear I/O |
|
|
Ethernet |
4 x RJ45 Gigabit Ethernet LAN Interfaces |
|
Display |
1 x HDMI ; 1 x DisplayPort |
|
USB |
4 x USB3.0 standard-A connectors |
|
AC-IN |
IEC C14 AC-IN |
Front I/O |
|
|
Button |
1 x System On/Off, 1 x System FAN On/Off |
|
Indicator LED |
1 x HDD LED |
|
COM |
1 x DB9 |
|
USB |
2 x USB2.0 standard-A connectors |
|
2.5" SSD / HDD Tray |
12 ( 7mm height SSD / HDD only ) |
OS support list |
|
|
Windows |
Windows 7 x32 / x64、Windows 8 x32 / x64、Windows 8.1 x32 / x64、Windows 10 x32 / x64 |
|
Linux |
Fedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04 |
Mechanical and Environment |
|
|
Form Factor |
ATX |
|
Power Type |
AC to DC 100-240V 400W FLEX ATX Switch Power Supply with fan |
|
Dimension |
430 x 396 x 88 mm ( W x D x H ) |
|
Operating Temp. |
5°C to 50°C |
|
Storage Temp. |
-20°C to 70°C |
|
Relative Humidity |
5% to 95%, non-condensing |
The HORUS422A offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers' extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.
| Device Model | HORUS422A |
| Tester | Marc |
| Test Result | Pass |
| Test Temperature | High 0°C~50°C / Low 0°C~5°C |
| Test Time | 8.5 Hours |
| Test Standard | Reference IEC60068-2 |
| Test Software | Burn in test 8.0 AS SSD 1.9 |
| Criteria | After testing, system can't halt. |
- Test Configuration
-
Device Configuration Manufacturer Part Number CPU Intel® Core™ i7-6700TE Processor 2.4 GHz Intel i7-6700TE PCH Intel Q170 Intel Q170 Memory Innodisk 16GB SOD DDR4 2133 Innodisk M4XS-AGS1050J-BD26 Test Software Burnin test v8、、IntelBurnTest 1.9
XTU CPU STRESS,FU MARKChamber KSON THS-b4t-150 Chipeng SMO-3 KSON Chipeng THS-b4t-150 SMO-3
- Thermal Measurement
-
STACKRACK provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus STACKRACK conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, STACKRACK is able to analyses the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5.5 hours which at each temperature point we burn in HORUS422 for two hour, from +40 to +50°C.
HORUS422A System - IO Performance
Point 5°C 15°C 25°C 40°C 50°C CPU T-J 43 52 65 75 86 CPU Die 26.4 28.1 39.5 57.5 71 Heatsink 24.2 26.9 32.7 47.3 68 Δ1=(TJ-Die) 16.6 23.9 25.5 17.5 15 Δ2=(Die-Sink) 2.2 1.2 6.8 10.2 3 CPU Frenquency (GHz) 2.9 2.9 2.9 2.86 2.86
Test Result
Apacer Msata 128G ( Read ) MB/s
Apacer Msata 128G ( Write ) MB/s
Innodisk 64GB SSD ( Read ) MB/s
Innodisk 64GB SSD ( Write ) MB/s
HORUS422A MB HeatSink - IO Performance
| Point | 5°C | 15°C | 25°C | 40°C | 50°C |
| Apacer Msata 128G ( Read ) MB/s | 279 | 277 | 275 | 274 | 270 |
| Apacer Msata 128G ( Write ) MB/s | 130 | 129 | 127 | 119 | 114 |
| Innodisk 64GB SSD ( Read ) MB/s | 522.57 | 504.98 | 504.14 | 517 | 505.52 |
| Innodisk 64GB SSD ( Write ) MB/s | 190.27 | 191.7 | 191.81 | 194.23 | 192.76 |
Effective cooling solution for maximum heat dissipation:
STACKRACK implements unique cooling solution with copper heat spreader, pure copper heat pipe and aluminum heat sink for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of copper and aluminum, the heat spreader touches the heat source - processor and chipset and absorbs the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, HORUS422 can ensure high reliability and stability while working under wide range temperature from 5°C up to 50°C.
Patent Designed Aluminum Heat Sink
The heat sink is made by heat radiating material, which is aim to lowering the temperature by dissipating heat into the surrounding air. 96 % of aluminum.
Heat spreader
Heat spreader directly touches the power source area, which can absorb heat rapidly and transfer to heat pipe and allow the high efficiency heat pipe further bring out heat to upper heat sink enclosure.
Pure Copper Heat Pipe
The heat pipes are embedded in the heat sink to ensure 100% tight integration for superior heat dissipation. Especially adopts U shape copper heat pipe to fulfill utmost thermal conductivity, copper heat pipe transfers heat from the heat sources (e.g. CPU, chipset) to the heat sink over relatively long distance. Two-phase heat transfer involves the liquid-vapor phase change of a working fluid.
SK513
COM Express carrier + CPU Module is in the middle of the system as a cutoff point, dividing segmentation type thermal design into upper and lower module.
Upper thermal module is applied to cool down the heat generated from graphic card and processor.
Heat spreader
Copper heat spreader directly touches the heat source- processor and chipset, which absorb heat rapidly.
