SR10A-X3 MIL-STD Video Capture Fanless Computer with Intel i7-7820EQ

SR10A-X3 MIL-STD Video Capture Fanless Computer with Intel i7-7820EQ
SR10A-X3 MIL-STD Video Capture Fanless Computer with Intel i7-7820EQ
SR10A-X3 MIL-STD Video Capture Fanless Computer with Intel i7-7820EQ
SR10A-X3 MIL-STD Video Capture Fanless Computer with Intel i7-7820EQ

SR10A-X3 MIL-STD Video Frame Grabber Fanless Computer with Intel i7-7820EQ ,  9V to 36V DC-Input, Extended Temp. -40 ~ +60°C

  • 7th Generation Intel® Core™ i7-6820EQ 
  • RAM Up to DDR4-32GB , SSD Up to 1TB mSATA
  • HD-SDI Video Frame Grabber for Mini PCI Express
  • 8x D1 Video Frame Grabber for mini PCI Express
  • Multi-Displays by 2 x DP, 1 x DVI-I
  • 2 x PCIe Intel® Gigabit Ethernet
  • 4 x USB 3.0, 1 x COM ports (RS232/422/485)
  • 9V~36V DC-Input
  • Extended Temperature -40 to 60 °C
  • Optional unique accessory bumper design for vibration resistance
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  • Technical Profile
  • Specifications
  • CPU Performance
  • SSD Performance
  • Thermal Solution
  • Certification
Introduction

The SR10A-X3 based on Intel® Haswell QM175 chipset, is powered by Intel® 7th generation Core™ processor onboard. The SR10A-X3 can operate effectively in harsh environment under temp range from -40 to 60°C and is a perfect solution for military, transportation, factory automation and digital signage applications. SR10A-X3 is based on EBX form factor, DDR4 up to 32GB. It supports triple-display, 2 DP and 1 DVI-I, 2 GIGA LAN port, 4 USB 3.0 and 1 COM port. SR10A-X3 supplies wide power voltage from 9 to 36V DC-in.

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Frame Grabber Card (Analog to Digital / PAL )

Frame grabbers may be used in military applications. For instance, when a potential breach of abnormal signal is detected, a frame grabber captures an image or a sequence of images in digital form, and then transmits the data to pilots or command control center.  SR10A-X3 support frame grabber cards expansion to be better process data promptly to meet front line needs, to collect useful images and help pilots to react promptly on the ever-changing battlefield.

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Digital HD-SDI video input

1CH, Mini PCIe HW encode video capture card

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Analogic PAL video input

4CH, Mini PCIe Video Capture Card

3

Analogic PAL video output

1CH, Scan Converter Board

 

Unique Challenges

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MIL-STD-810G standard designed for shock and vibration

SR10 is designed to meet MIL-STD-810G standard for shock and vibration. MIL-STD-810G standard is considered the upmost principle, which guarantees the system achieves superior quality and stability when operate under extreme harsh environment. We have conducted the test with series of testing procedures for resistance to shock, vibration, dust, humidity, and extreme temperatures. What’s more to make the system more rugged is SR10A designed with EBX form factor and stackable ability. With those two features can provide maximum exceeding solidity when stacking together to prevent loose from vibration. With key components- CPU and SSD soldering on board to enhance the capability of shock and vibration. With optional Bumper design, the level of vibration resistance increased.

 

Wire Rope Vibration Isolator Design for Higher Vibration Resistance

7starlake has especially design a Wire Rope Vibration Isolator for SR10A. The Wire Rope Vibration Isolator may sustain higher vibration resistance of the product itself. 

A Wire Rope Vibration Isolator is widely apply on supporting Military equipment because it may absorb and protect the object from vibration damage in any axes simultaneously, with the protection it may extended the product life operating under long hour vibration environment and vibration shock. The isolator is long life maintenance free tool and it may unload whenever required. Besides, Wipe Rope Vibration Isolators may survive under extreme temperature, corrosion, radioactivity, extreme dry or high humidity and UV Radiation environment.

 

Accordion title 2

Accordion content 2.

 

Operating Temp.
-40°C~60°C  
System
CPU Core i7-7820EQ, 8M Cache (45W)
Chipset Intel® QM175 Chipset
Memory Type DDR4 Up to 32GB SO-DIMM
Ethernet Chipset 2 x RJ45 Intel® I210IT & i217LM GbE
Front I/O
Power Button 1 x Power
Power LED Power, HDD, LAN
USB 2 x USB 3.0
POWER 1 x Terminal Block
Rear I/O
DisplayPort 2 x 20-pin DP connector (female)
DVI-I 1 x 29-pin DVI-D connector (female)
Ethernet 2 x RJ45 ports
COM 1 x RS232/422/485 port (DB9 male)
USB 2 x USB 3.0
Display
Display Interface 2 x 20Pin DP connector (Female)
DVI-I 1 x 29Pin DVI-I connector (Female)
Mechanical and Environment
Power Requirement 9V to 36V DC-in, AT/ATX mode with power delay on/off
Dimension 262 x 149 x 69 mm
Weight 4.11 Kg(9.04 lbs)
Operating Temp. -40°C ~ 60°C (ambient with airflow)
Storage Temp. -40°C to 85°C
Relative Humidity 5% to 95%, non-condensing
Test Standard
MIL-STD-810G Test

Operating Tests

 

 

Low Temperature

Method 502.4 Procedure 2

-20°C (Cold Boot) -40°C (Continue Operating)

High Temperature

Method 501.4 Procedure 2

+55°C

Humidity

Method 507.4

5 x 48 hour cycles

Vibration

Method 514.5 Category 4

10—500Hz 1.04Grms

Shock

Method 516.5

40G 11mSec TPS 3 axis

Altitude

Method 500.5 Procedure 2

-1,000m to +12,000m

Non-Operating Tests

 

 

Shock

Method 516.5

40G 11ms TPS 3 axis

Low Temperature Storage

Method 501.4

-40°C

High Temperature Storage

Method 502.4 Procedure 1

+75°C

Vibration

Method 514.5 Category 24 fig 514.5C-17

20 to 1000Hz @ 0.02g²/Hz falling @ -6dB to 2000Hz

Altitude

Method 500.5 Procedure 2

-1,000m to +12,000m
EMC CE and FCC certificated
Green Product RoHS, WEEE compliance

The rugged MIL-STD compliant system, SR10A-X3 is equipped with highly effectively heat conductive and heat convective thermal solutions to meet extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system via 8.0 mm copper heat pipes. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.

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2

 

Test Standard
3

 

Thermal Measurement

The rugged MIL-STD compliant system, SR10A-X3 is equipped with highly effectively heat conductive and heat convective thermal solutions to meet extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system via 8.0 mm copper heat pipes. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.

3

 

SR10A-X3  IO Performance

Point -40°C -20°C 25°C 40°C 45°C 50°C 55°C 60°C 65°C 70°C
CPU T-J 2 20 98 100 100 100 100 100 100 100
CPU Die -9.7 8.5 81.5 84.2 92.1 93.5 95.5 97.3 97.7 100.6
Heatsink -33.7 -16.2 61.3 64.3 69.4 72.4 76.2 79.8 83.5 87.2
Δ1=(TJ-Die) 11.7 11.5 16.5 15.8 7.9 6.5 4.5 2.7 2.3 -0.6
Δ2=(Die-Sink) 24 24.7 20.2 19.9 22.7 21.1 19.3 17.5 14.2 13.4
CPU Frenquency (GHz) 2.79 2.79 2.69 2.59 2.49 2.19 2.00 1.70 1.20

 

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SR10A-X3  IO Performance

Point -40°C -20°C 25°C 40°C 45°C 50°C 55°C 60°C 65°C 70°C
On board SSD (Read) MB/s 257.63 254.78 254.37 262.22 254.9 254.97 255.05 255.32 256.13 261.31
On board SSD (Write) MB/s 132.99 128.61 94.96 127.99 125.3 127.96 126.09 121.98 121.34 125.34
mSATA (Read) MB/s 188.6 201.8 199.7 192.5 198.6 200.6 206.6 193.5 199.4 199.8
mSATA (Write) MB/s 155.3 160.2 159.7 160.6 147.52 152.3 160.4 149 151.5 14

Effective cooling solution for maximum heat dissipation:

7starlake implements unique cooling solution with copper heat spreader, pure copper heat pipe and aluminum heat sink for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of copper and aluminum, the copper heat spreader touches the heat source - processor and chipset and absorbs the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, SR10A-X3 can ensure high reliability and stability while working under wide range temperature from -40°C to 60°C

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Patent Designed Aluminum Heat Sink

The heat sink is made by heat radiating material, which is aim to lowering the temperature by dissipating heat into the surrounding air. 96 % of aluminum, 21 mm height and weighs 1039 g

 

Pure Copper Heat Pipe

The heat pipes are embedded in the heat sink to ensure 100% tight integration for superior heat dissipation. Especially adopts U shape copper heat pipe to fulfill utmost thermal conductivity, copper heat pipe transfers heat from the heat sources (e.g. CPU, chipset) to the heat sink over relatively long distance. Two-phase heat transfer involves the liquid-vapor phase change of a working fluid.



• 8.0 mm diameter heat pipe, 225 mm length of each heat pipe, 99.9% purity of copper

• High heat conductivity coefficient up to 5000

 

Copper Heat spreader

Copper heat spreader directly touches the power source area, which can absorb heat rapidly and transfer to heat pipe and allow the high efficiency heat pipe further bring out heat to upper heat sink enclosure



• 99.9% purity of copper, weigh 470 g

 

Wire Rope Vibration Isolator design may sustain higher vibration resistance of the product itself.



• 10Grms Vibration and 75Grms Vibration Shock proof with Wipe Rope Vibration Isolator.