ROC235B - Intel® QM77 Fanless Rugged System

19” 1U Rack-mount Intel® QM77 Fanless Rugged System with Core i7/i5/i3 processors, 100V to 240V AC-in, Extended Temperature. -20 to 60°C

Intel® Ivy Bridge i7/i5/i3 CPU + Intel QM77 PCH
2 x DDR3 SO-DIMM up to 16 GB
Rich I/O interface with 1 COM, 6 USB, 2 LAN (RJ45)
Multi-Display: DVI-D, HDMI, VGA
Dual GbE LAN ports
Supports 2 x 2.5’’ Easy Swap SSD
100V~240V AC-in
Extended operating temperature. -20 to 60°C

Download

Get A Quote

製品概要
Specifications
CPU Performance
SSD Performance
Thermal Solution

Introduction

ROC235B is an industrial 19” 1U Rack-mount fanless rugged system, especially designed for demanding applications that require supreme quality and reliability. Powered by Intel® Ivy Bridge i7/i5/i3 (i7-3610QE, i5-3610ME, i3-3120ME) CPU and QM77 chipset, the power consumption is (45W for i7 and 35W for both i5 & i3), 4.1W for QM77 PCH. With 44mm of height and 380mm of depth, it’s fit for rack mount, wall mount, and standalone application. Heat pipes and heat sinks are constructed on both component and system levels. Honeycomb vents are designed on the top, sides and back to allow natural convection cooling. ROC235B’s power design is for 100V – 240V AC-in, which allows a flexible usage. ROC235B meets the demands of industrial embedded applied computing applications including the industrial PC platform, transaction, multimedia workstation, vehicle PC, and network server.

System main board: Mini ITX INS8335A

1.Rich I/O, Infinite Possibility

ROC235B contains rich indicators including power, HDD and LAN LED in the front side. For easy integration with all sorts of systems, versatile I/O interface can be found on the rear side. It supports three display (HDMI/VGA/DVI), audio Mic-in, Line-out, 1 x COM, 2 x Ethernet LAN and 6 x USB. 2 x 2.5” Easy Swap SSD design pushes the expansion ability to the utmost.

2. AC-in Power Design

ROC235B supports 100 to 240V AC-in power, allows the system to be utilized in extensive power types. The design of wide power range keeps the system’s reliability and you can expect longer life-span as well. Sudden drop or surge of power posts absolutely no threat to this smart system.

3.Ultra Slim Size

ROC235B is a compact yet capable industrial grade fanless system. With only 380mm in depth and 44mm (1.73”) in height, this 1U size system is superior in its compact yet durable exterior design and highly functional interior structure.

Operating Temp
-20°C to 60°C
System
CPU	Intel® 22nm Ivy Bridge Processor (Mobile) socket(rPGA988) Intel® Core™ i7-3610QE (4C x 3.3 GHZ), 6M L2 cache (45W) Intel® Core™ i5-3610ME (2C x 2.7 GHZ), 3M L2 cache (35W) Intel® Core™ i3-3120ME (2C x 2.4 GHZ), 3M L2 cache (35W)
Memory Type	2 x 204-pin SO-DIMM DDR3 1333/1600 MHz up to 16GB
Chipset	Intel® QM77 Express Chipset (Intel® BD82QM77 PCH)
Expansion Slot	2 x PCI by PCIe x 1, from PCH 1 x Mini PCIe for GEN2
Storage
HDD/SDD	2 x 2.5" SATA HDD/SSD (Easy Swap 2.5" HDD cage) Supports RAID 0,1
Ethernet
Ethernet	Intel® 82579LM & 82574IT GbE LAN (support 10/100/1000 Mbps for x2 RJ45 ports)
Rear I/O
VGA	1 x 15-pin VGA connector (female)
DVI-D	1 x 25-pin DVI-D connector (female)
HDMI	1 x 19-pin HDMI A Type connector (female)
Audio	Mic-in, Line-out
COM	1 x RS232/422/485
	Serial Signals
	RS232: DCD-, RXD, TXD, DTR-, GND, DSR-, RTS-, CTS-
	RS422: TX-, RX+, TX+, RX-, GND,
	RS485: DATA-, DATA+, GND
USB	4 x USB 3.0
Front I/O
Power Button	1
USB	2 x USB 2.0
Power LED	1
HDD LED	1
Reset	1
OS support list
Windows	Windows 7 x32/ x64、Windows 8.1 x32/ x64、Windows 10 x32/ x64
Linux	Open SUSE 12.2、Ubuntu 12.04
Mechanical and Environment
Power Requirement	100V to 240V AC-in
Dimension	440 x 44 x 380 mm (17.32" x 1.73" x 14.96")
Operating Temp.	-20 to 60°C (ambient with air flow)
Storage Temp	-20 to 80°C
Relative Humidity	10% to 90%, non-condensing
Certifications
EMC	CE, FCC

Test Result

NEW_STYLE_products_ROC235B_04

Device Model	ROC235A
Tester	Ian Huang
Test Result	Pass
Test Temperature	High 0°C~85°C / Low -40°C~0°C
Test Time	5 Hours / 2 Hour
Test Standard	Reference IEC60068-2
Test Software	Burnin test v6.0
Criteria	After testing, system can’t halt.

Test Configuration

Device	Configuration	Manufacturer
CPU	Intel® Core i7-3610QE 2.3GHz	Intel
PCH	Intel® QM77 Express Chipset	Intel
Memory1	Hynix DDR3 1333 SODIMM 2GB HMT125S6TFR8C-H9	Innodisk
Memory2	Hynix DDR3 1333 SODIMM 2GB HMT125S6TFR8C-H9	Innodisk
Port1 SATAIII	Innodisk 2.5” SATA SSD 3MG2-P 128GB	Innodisk
USB3、USB4	Passmark Loopback Plugs for USB 3.0
LAN1	Intel® 82579LM GbE LAN	Intel
LAN2	Intel® 82574IT GbE LAN	Intel
Test Software	Burnin test v6.0、HD Tune v4.01、iperf、Passmark USB3.0 Intel Extreme Tuning Utility 4.3.0.11
Chamber	KSON THS-b4t-150 Chipeng SMO-3	KSON Chipeng

Thermal Measurement

PERFECTRON provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus PERFECTRON conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, PERFECTRON is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5 hours which at each temperature point we burn in INS8321B for one hour, from +50 to +85°C

NEW_STYLE_products_ROC235B_05

NEW_STYLE_products_ROC235B_06

Efficient thermal solution for maximum heat dissipation:

What composes of a perfect thermal solution? With ROCS235B, it’s all about the incorporation of different heat dissipating part to create an almighty thermal conduction power. Honeycomb dissipating vents are constructed on the top and the sides to increase the dissipating area. The honeycomb cells can achieve faster heat dissipation without occupying much space. Two heat spreaders and two heat sinks are installed to create a magnificent ventilating structure. Six heat pipes are implemented to conduct the heat to the thermal modules on the two sides of the system. This phenomenal combination can bring out the best dissipating effect.