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ROC235B - Intel® QM77 Rackmount Fanless Rugged System

ROC235B - Intel® QM77 Rackmount Fanless Rugged System
ROC235B - Intel® QM77 Rackmount Fanless Rugged System
ROC235B - Intel® QM77 Rackmount Fanless Rugged System
Intel CPU_3rd

19” 1U Rack-mount Intel® QM77 Fanless Rugged System with Core i7/i5/i3 processors, 100V to 240V AC-in, Extended Temperature. -20 to 60°C

  • Intel® Ivy Bridge i7/i5/i3 CPU + Intel QM77 PCH
  • 2 x DDR3 SO-DIMM up to 16 GB
  • Rich I/O interface with 1 COM, 6 USB, 2 LAN (RJ45)
  • Multi-Display: DVI-D, HDMI, VGA
  • Dual GbE LAN ports
  • Supports 2 x 2.5’’ Easy Swap SSD
  • 100V~240V AC-in
  • Extended operating temperature. -20 to 60°C
  • Technical Profile
  • Specifications
  • CPU Performance
  • SSD Performance
  • Thermal Solution
  • Certification

Introduction

ROC235B is an industrial 19” 1U Rack-mount fanless rugged system, especially designed for demanding applications that require supreme quality and reliability. Powered by Intel® Ivy Bridge i7/i5/i3 (i7-3610QE, i5-3610ME, i3-3120ME) CPU and QM77 chipset, the power consumption is (45W for i7 and 35W for both i5 & i3), 4.1W for QM77 PCH. With 44mm of height and 380mm of depth, it’s fit for rack mount, wall mount, and standalone application. Heat pipes and heat sinks are constructed on both component and system levels. Honeycomb vents are designed on the top, sides and back to allow natural convection cooling. ROC235B’s power design is for 100V – 240V AC-in, which allows a flexible usage. ROC235B meets the demands of industrial embedded applied computing applications including the industrial PC platform, transaction, multimedia workstation, vehicle PC, and network server.

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System main board: Mini ITX INS8335A

1.Rich I/O, Infinite Possibility

ROC235B contains rich indicators including power, HDD and LAN LED in the front side. For easy integration with all sorts of systems, versatile I/O interface can be found on the rear side. It supports three display (HDMI/VGA/DVI), audio Mic-in, Line-out, 1 x COM, 2 x Ethernet LAN and 6 x USB. 2 x 2.5” Easy Swap SSD design pushes the expansion ability to the utmost.

2. AC-in Power Design

ROC235B supports 100 to 240V AC-in power, allows the system to be utilized in extensive power types. The design of wide power range keeps the system’s reliability and you can expect longer life-span as well. Sudden drop or surge of power posts absolutely no threat to this smart system.

3.Ultra Slim Size

ROC235B is a compact yet capable industrial grade fanless system. With only 380mm in depth and 44mm (1.73”) in height, this 1U size system is superior in its compact yet durable exterior design and highly functional interior structure.

 

Operating Temp

-20°C to 60°C

System

CPU

Intel® 22nm Ivy Bridge Processor (Mobile) socket(rPGA988)

Intel® Core™ i7-3610QE (4C x 3.3 GHZ), 6M L2 cache (45W)

Intel® Core™ i5-3610ME (2C x 2.7 GHZ), 3M L2 cache (35W)

Intel® Core™ i3-3120ME (2C x 2.4 GHZ), 3M L2 cache (35W)

Memory Type

2 x 204-pin SO-DIMM DDR3 1333/1600 MHz up to 16GB

Chipset

Intel® QM77 Express Chipset (Intel® BD82QM77 PCH)

Expansion Slot

2 x PCI by PCIe x 1, from PCH

1 x Mini PCIe for GEN2

Storage

HDD/SDD

2 x 2.5" SATA HDD/SSD (Easy Swap 2.5" HDD cage)
Supports RAID 0,1

Ethernet

Ethernet

Intel® 82579LM & 82574IT GbE LAN (support 10/100/1000 Mbps for x2 RJ45 ports)

Rear I/O

VGA

1 x 15-pin VGA connector (female)

DVI-D

1 x 25-pin DVI-D connector (female)

HDMI

1 x 19-pin HDMI A Type connector (female)

Audio

Mic-in, Line-out

COM

1 x RS232/422/485

Serial Signals

RS232: DCD-, RXD, TXD, DTR-, GND, DSR-, RTS-, CTS-

RS422: TX-, RX+, TX+, RX-, GND,

RS485: DATA-, DATA+, GND

USB

4 x USB 3.0

Front I/O

Power Button

1

USB

2 x USB 2.0

Power LED

1

HDD LED

1

Reset

1

OS support list

Windows

Windows 7 x32/ x64Windows 8.1 x32/ x64Windows 10 x32/ x64

Linux

Open SUSE 12.2Ubuntu 12.04

Mechanical and Environment

Power Requirement

100V to 240V AC-in

Weight 5.8Kg(12.78lbs)

Dimension

440 x 44 x 380 mm (17.32" x 1.73" x 14.96")

Operating Temp.

-20 to 60°C (ambient with air flow)

Storage Temp

-20 to 80°C

Relative Humidity

10% to 90%, non-condensing

Test Standard

EMC

CE, FCC

Test Result

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Device Model

ROC235A

Tester

Ian Huang

Test Result

Pass

Test Temperature

High 0°C~85°C / Low -40°C~0°C

Test Time

5 Hours / 2 Hour

Test Standard

Reference IEC60068-2

Test Software

Burnin test v6.0

Criteria

After testing, system can’t halt.

 Test Configuration

Device

Configuration

CPU

Intel® Core i7-3610QE 2.3GHz

PCH

Intel® QM77 Express Chipset

Memory1

Hynix DDR3 1333 SODIMM 2GB HMT125S6TFR8C-H9

Memory2

Hynix DDR3 1333 SODIMM 2GB HMT125S6TFR8C-H9

Port1 SATAIII

Innodisk 2.5” SATA SSD 3MG2-P 128GB

USB3、USB4

Passmark Loopback Plugs for USB 3.0

LAN1

Intel® 82579LM GbE LAN

LAN2

Intel® 82574IT GbE LAN

Test Software

Burnin test v6.0、HD Tune v4.01、iperf、Passmark
USB3.0 Intel Extreme Tuning Utility 4.3.0.11

Chamber

KSON THS-b4t-150 Chipeng SMO-3


PERFECTRON provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus PERFECTRON conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, PERFECTRON is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5 hours which at each temperature point we burn in INS8321B for one hour, from +50 to +85°C
Thermal Measurement

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Efficient thermal solution for maximum heat dissipation:

What composes of a perfect thermal solution? With ROCS235B, it’s all about the incorporation of different heat dissipating part to create an almighty thermal conduction power. Honeycomb dissipating vents are constructed on the top and the sides to increase the dissipating area. The honeycomb cells can achieve faster heat dissipation without occupying much space. Two heat spreaders and two heat sinks are installed to create a magnificent ventilating structure. Six heat pipes are implemented to conduct the heat to the thermal modules on the two sides of the system. This phenomenal combination can bring out the best dissipating effect.