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AV710-X3

IP65 MXM-GPU Server with Intel® Xeon D-1577 , NVIDIA® Quadro® RTX5000 CUDA 3072, MIL-461 EMI 18V~36V DC-In Extreme Rugged Temperature. -40°C to 60°C

  • IP65 Fanless MXM-GPU Rugged Server
  • NVIDIA Quadro® RTX5000 CUDA 3072 GDDR6-16GB 
  • Intel® Xeon D-1577 (16 x Core) Processor 
  • Up To 64GB DDR4 Memory
  • IP65 sealed enclosure with rugged external cooling for turbo mode
  • 1 x GbE, 2 x 10GbE, 1 x COM, 1 x DVI-D
  • MIL-DTL-38999 Connectors
  • MIL-461 EMI 18V~36V DC-In
  • Extreme Rugged Operating Temperature -40°C to 60°C
  • Conformal coating on electronics meets MIL-STD 810 509 Salt Fog  
  • MIL-STD 810 500.6 Low Pressure Altitude
  • Technical Profile
  • Specifications
  • Thermal Solution
Introduction

AV710-X3 is driven by Intel® Broadwell Xeon D-1577 Processor (1.3GHz, 16 Cores, 32 Threads, 24MB Cache) which is an extremely compact Core I-based fanless rugged system. Broadwell Xeon D processor and nVidia RTX5000 supports outstanding CPU and graphics performance. AV710-X3 highlight on its rugged design and high functionality, the system especially installed MIL-STD Amphenol type connector and full IP65 protection allow system withstand in any kind of harsh environment. AV710-X3 supports extended temperature from -40°C to 60°C and wide range 9V~36V DC input (optional MIL-STD-461 Power supply) can protect system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself.

AV710 I/O(Front)
AV710 I/O(Back)

 

System main board: SK515
SK515

 

SK515

1. Customized demands for different applications

AV710-X3 is based on SK515, powered by Intel® Broadwell Xeon DE D-1577 soldering onboard. SK515 can be customized with upgrade-able COMe Type 7 CPU, MXM-GPU in order to have more flexibility and be more user-friendly. SK515 is designed to fulfill demands of different applications, such as defense, marine navigation and aviation technology.

 

 

2. Rugged expansion slot brings high reliability

With stackable PCIe 104 expansion slot, SK515 brings many advantages, including fast data transfer, low cost and high reliability due to PCIe 104's inherent ruggedness, and long-term sustainability. The rugged modules are optimized for mission-critical, harsh environments where failure caused by sudden shock or unpredictable vibration is not an option.

 

NVIDIA GPU, Extraordinary Graphic Performance
SR700-SG

 

AV710-X3 is installed with NVIDIA Quadro MXM RTX5000  (3072 CUDA, 16GB GDDR6) that generates excellent resolution and supports high efficiency and fluency of image processing with competitive G3D Mark and low power consumption. Inherited the remarkable ruggedness and dual-sided thermal design of AV710-X3 can efficiently dissipate the heat generated from both CPU and GPU, maintaining the stability of solution performance. The system possess great superiority for image computing utilization, including 2D/3D mapping and real-time image process for autonomous vehicle, surveillance system for command center, other navigation, radar, detection, sensor and laser systems on all maritime, ground, and aerial applications in both defense and industrial fields.

 

CPU Full Speed over Extended Range Temperature

Intel Broadwell Xeon-DE series processors are primarily targeted towards ultimate mobile performance, mobile workstations, and performance embedded devices. Featuring 64-bit dual-core SoC , Broadwell DE series processors improve cost, power consumption, and heat dissipation, which are desirable for embedded systems. Thus, equipped with Intel® Broadwell Xeon D-1577 (16xC) , AV710-X3 provides leading performance while cosuming lower power. In addition,7STARLAKE’s patented thermal dissipation design ensures CPU to run at full speed under extended temperature ranging from -40 to 60°C.

Patented Thermal Solution

7STARLAKE designs a unique enclosure that is able to stack together both horizontally and vertically. The aluminum heat sink enclosure of AV710-X3 secures top heat dissipation. It’s well-known that fanless method relies heavily on the precise calculation of the efficiency of each heat dissipating component. 7STARLAKE exclusively adopts special heat radiating material and combining with special CNC cutting, further forged into a lavish sophisticated metal. Superior fanless design guarantees silent operation that enhances the flexibility of mobility and prevents the intrusion of dust and debris. Achieving ultimate reliability and stability, AV710-X3 can operate under extended temperature ranging from -40 to 60°C.

IP65 Sealed Enclosure Anti-water / dust protection

AV710-X3 has complete resistance to dust and water, making it even more ruggedized and reliable. With the water and dust protection up to IP65 rating, AV710-X3 can stand against the intrusion of dust, accidental contact, and water. Not just commercial grade waterproof and dustproof, it can reach Dust Tight level, which guarantees complete protection against ingression. Even the strong power of water jet won't pose a threat to it, , which means it’s true ruggedness embodied.

MIL-STD -461

MIL-STD-461 is a military standard that establishes the control of electromagnetic interference (EMI) emissions and susceptibility characteristics of electronic, electrical & electro-mechanical equipment and subsystems for military equipment. EMI encompasses any undesired signals, “noise”, generated by electronic equipment. Keeping EMI under control is crucial for military applications, because if it’s out of control, the military will be detected by the enemy and it might cause a great loss. To design a product that meets strict requirements, engineers should possess extensive knowledge of both electrical and mechanical design to avoid unintentional generation, propagation and reception of electromagnetic energy, which may cause unwanted effects, for example, physical damage in operational equipment.

 

Block diagram of MIL-STD-461 test configuration

Block diagram of MIL-STD-461 test configuration

Rugged D38999 Series connectors

MIL-DTL-38999 is a high-performance cylindrical connector family designed to withstand the extreme shock, exposure and vibration that are commonplace in Defense and aerospace applications. D38999 connectors are lightweight and can stand up to environmental challenges. Made with removable crimp or fixed hermetic solder contacts, these connectors provide high-vibration characteristics and are suitable for severe wind and moisture problem areas. Equipped with MIL-38999 4/10/22 pin connectors TV07RW-11-54P, TV07RW-13-98S, and TV07RW-13-35S, AV710 is undoubtedly durable and ruggedized enough despite operating in the harsh environment. 

Power Over Ethernet

Power over Ethernet (POE) is a technology that lets network cables carry electrical power. For instance, a digital security camera normally requires two connections—a network and a power connection with isolated cables. However, a POE technology only needs one network cable, which can get network connection while carrying electrical power. Without being tethered to an electrical outlet, devices can be located wherever they are needed most, and repositioned easily if required. To meet our customers’ needs, AV710-X3 offers optional POE delivery on D38999 connectors, which are extremely reliable and useful in outdoor applications.

NVIDIA QUADRO MXM-GPU Series

Powered by NVIDIA, CUDA® is a parallel computing platform and programming model developed by NVIDIA for general computing on graphical processing units (GPUs). With CUDA, developers are able to dramatically speed up computing applications by harnessing the power of GPUs. In GPU-accelerated applications, the sequential part of the workload runs on the CPU – which is optimized for single-threaded performance – while the compute intensive portion of the application runs on thousands of GPU cores in parallel.

MXM GPU

 

 

System

Processor

Intel® Xeon® D-1577 Processor, 16Cores, 32Threads, Base Frequency 1.3GHz, Turbo Frequency up to 2.1GHz, 24M Cache

Memory type

2 x SODIMM up to 32GB DDR4 2133MHz

GPU

Graphics Card

NVIDIA Quadro RTX 5000 MXM (16GB GDDR6, 3072 CUDA Cores)

Storage

HDD/SDD

1 x 2.5" SSD

Front I/O

DC-In

1 (Amphenol TV07RW-11-54P)

Power Button

1 x Power Button with LED backlight

Waterproof valve

1

Rear I/O

X1

1 x GbE LAN (Amphenol TV07RW-13-98S)

X2

1 x 10GbE Copper LAN (Amphenol TV07RW-13-98S)

X3

1 x 10GbE Copper LAN (Amphenol TV07RW-13-98S)

X4

1 x DVI-D (Amphenol TV07RW-13-35S)

X5

1 x COM (Amphenol TV07RW-13-98S)

Power Requirement

Power Input

Standard: 9V~36V DC-In

Optional : MIL-STD-461 EMI power supply, 18V~36V DC-In (300W)

Applications,

Applications

Military Platforms Requiring Compliance to MIL-STD-810G

Embedded Computing and applications subject to Harsh Temperature, Shock, Vibration,Altitude, Dust and EMI Conditions.

Operating System

Operating System

Windows 10 64Bit, Linux by request.

Mechanical and Environment

Dimension (W x D x H)

280 x 230 x 122 (mm) (11.02" x 9.05" x 4.8")

Weight

10.50KGS

Chassis

Aluminum Alloy, Corrosion Resistant

Finish

Anodic aluminum oxide (Color Iron gray)

Cooling

Natural Passive Convection/Conduction. No Moving Parts

Environmental

MIL-STD-810G Test

Method 500.5, Procedures I and II (Altitude, Operation):

12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia)

Method 500.5, Procedures III and IV (Altitude, Non-Operation):

15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia)

Method 501.5, Procedure I (Storage/High Temperature)

Method 501.5, Procedure II (Operation/High Temperature)

Method 502.5, Procedure I (Storage/Low Temperature)

Method 502.5, Procedure II (Operation/Low Temperature)

Method 503.5, Procedure I (Temperature shock)

Method 507.5, Procedure II (Temperature & Humidity)

Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24,Vibration)

Method 514.6, Vibration Category 20/Operating (Category 20 & 24,Vibration)

Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock)

Method 516.6, Shock-Procedure I Operating (Mechanical Shock)

Reliability

No Moving Parts; Passive Cooling.

Designed & Manufactured using ISO 9001 Certified Quality Program.

EMC

MIL-STD-461E :

CE102 basic curve, 10kHz - 30 MHz

RE102-4, (1.5 MHz) -30 MHz - 5 GHz

RS103, 1.5 MHz - 5 GHz, 50 V/m equal for all frequencies

EN 61000-4-2: Air discharge: 8 kV, Contact discharge: 6kV

EN 61000-4-3: 10V/m

EN 61000-4-4: Signal and DC-Net: 1 kV

EN 61000-4-5: Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV

CE and FCC

Operating Temp.

-40 to +60°C (ambient with air flow)

Storage Temp.

-40 to +85°C

Relative Humidity

5% to 95%, non-condensing.

 Patented Thermal Solution

7STARLAKE designs a unique enclosure that is able to stack together both horizontally and vertically. The aluminum heat sink enclosure of AV710-X3 secures top heat dissipation. It’s well-known that fanless method relies heavily on the precise calculation of the efficiency of each heat dissipating component. 7STARLAKE exclusively adopts special heat radiating material and combining with special CNC cutting, further forged into a lavish sophisticated metal. Superior fanless design guarantees silent operation that enhances the flexibility of mobility and prevents the intrusion of dust and debris. Achieving ultimate reliability and stability, AV710-X3 can operate under extended temperature ranging from -40 to 60°C.

AV710-X3