HORUS430
2U Rugged MXM-GPU Server, NVIDIA® GTX1080 / RTX5000 and Intel 9th/11th Processor, MIL-461 18V~36V DC, Extended Temp, -20~+55 Degree
- 2U Fanless Rugged MXM-GPU Server
- Intel® 9th Coffee-Lake i7-9850HE (Up to 4.4 GHz, 6C,12 T) / 11th Tiger-Lake i7-11850HE (up to 4.7 GHz, 8C, 16T)
- NVIDIA MXM GTX1080 (CUDA2560,8 GB GDDR5) / RTX5000 (CUDA 3072, 16GB-GDDR6)
- 2x 10 GbE SFP+
- DDR4 Up to 64GB (ECC for Options)
- 2 x LAN, 4 x USB, 2 x DVI ,
- IP65 Rating with DTL-38999
- MIL-STD-461/1275 18V-36V DC-Input
- Operating Temperature -20°C to +55°C
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- Technical Profile
- Specifications
- CPU Performance
- SSD Performance
- Thermal Solution
- Introduction
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Artificial intelligence (AI) is quickly becoming one of the most crucial components to business success now and in the foreseeable future. Today, the necessity of deploying powerful computing platforms that can accelerate and cost-effectively scale their AI-based products and services has become vital for successful enterprises.
7STARLAKE is innovating to address the rapidly emerging high-throughput inference market driven by technologies such as 5G, Smart Cities and IOT devices, which are generating huge amounts of data. The combination of NVIDIA Tensor RT and the new architecture based GeForce Accelerator as the ideal combination for these new demanding and latency-sensitive workloads and are aggressively leveraging them in GPU system.
- IT Block Diagram
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- Features
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Computing Features
-Core i7-9850HE (up to 4.40 GHz),45W
-Nvidia MXM Graphic Engine support up to GTX1080 (8GB-GDDR5X,CUDA 2560)
-4 x 260 Pin DDR4 SO-DIMM 64GB
-2 x M.2 2280 M-key (SATA/PCIe 3.0x4 NVMe)
I/O and Expansion Options
-X1 : Four USB with D38999 connector
-X2 : One 10G LAN with M12 connector
-X3 : One 10G LAN with M12 connector
-X4 : One LAN with D38999 connector
-X5 : One LAN with D38999 connector
-X6 : One RS232 with D38999 connector
-X7 : One DVI with D38999 connector
-X8 : One DVI with D38999 connector
-X9 : One DC-in with D38999 connector
Environment
-MIL-STD- 461 /1275 wide range 18-36V DC power module
-MIL-STD-810, 461, 1275 compliant
-Operates up to extended temp -20°C to +55°C
- Edge AI Inference GPU System
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With more threads and more cores, 9th Gen Intel® Core™ H-series processors for IoT bring high performance and connectivity to the edge—all in an efficient package with long-life availability that’s ideal for embedded use conditions. These processors are the first in the Intel® Core™ IoT family to offer up to eight cores, delivering dramatic improvements over the previous generation. New features include integrated graphics and even more robust connectivity to support the most demanding IoT use cases—all on the latest 14 nm technology. And with TDP ranges from 25W to 65W, form factors can vary without compromising performance.
HORUS430 is installed with graphics card NVIDIA GTX1080 (CUDA 2560,8 GB GDDR5X) , allowing generate excellent resolution and supports high efficiency and fluency of image processing with competitive G3D Mark and low power consumption. The GPGPU provides a simple and easily implementable parallel software architecture paradigm using general purpose programming languages like C / C++. The entire data / signal processing task can be realized as a sequence of software activities taking the advantage of very high throughput possible with the GPUs. The system possess great superiority for image computing utilization, including 2D/3D mapping and real-time image process for autonomous vehicle, surveillance system for control room, other navigation, radar, detection, sensor and laser systems on all maritime, ground, and aerial applications in both defense and industrial fields.
Modern Radar Sensor systems are being deployed to carry out multi-tasking for detection and tracking of several objects simultaneously. Active Electronically steered phased array technology is the key element being utilized for design and development of these modern radar systems. A radar system receives digitized video data from receivers and carries out a set of highly compute intensive Data / Signal Processing activities. The GPGPU provides a simple and easily implementable parallel software architecture paradigm using general purpose programming languages like C / C++. The entire data / signal processing task can be realized as a sequence of software activities taking the advantage of very high throughput possible with the GPUs.
HORUS430, Intel® Core™ i7-9850HE Processor, the 8-Core CPU, supports 1.8 GHz, up to 3.8 GHz clock speed for high-end computing performance. Not only with outstanding CPU performance, HORUS430 has integrated graphics card NVIDIA®Quadro P5000 (CUDA2560,16GB-GDDR5X)to apply all sort of applications. HORUS430 has provided rich I/O such as 4 x LAN, 4 x USB, 2 x DVI. HORUS430 is highlighting on rugged design and high functionality, the special dual thermal solution allows powerful system to present supreme performance under harsh environment. HORUS430 is design to withstand the most challenging combat requirements with many being MIL-STD 810G certified for extreme environmental conditions. HORUS430 GPGPU platform are used by the most demanding customers including the US Military, NATO forces and among many others.
- I/O Expansions
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HORUS430 is designed to fulfill demands of mission critical applications. Apart from standard I/O interface, HORUS430 equipped with 4 x LAN, 4 x USB, 2 x DisplayPorts. With these rich interfaces, HORUS430 can be easily applied to targeting & acquisition system to link with diversified sensors, such as thermal image camera, scanned array radar..etc.
- Rugged D38999 Series connectors
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D38999 connectors offer the highest performance capabilities and reliability for both general duty and severe environment applications.
This cylindrical connector family designed for cable-to-panel I/O applications in military, aerospace and other demanding hazardous situations. D38999 connectors are capable of operation within a temperature range -65 to 200°C. They are lightweight and can stand up
to environmental challenges. Made with removable crimp or fixed hermetic solder contacts, these connectors provide high-vibration characteristics and are suitable for severe wind and moisture problem areas.
- MIL-STD-810G
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HORUS430 meets MIL-STD-810G for mechanical shock and vibration, it is designed and tested to withstand extended extended temperature (-20° to +55°C). Combining critical components soldering on board and solid connection, HORUS430 is compliant to MIL-STD 810G standard, can withstand 5g vibration, 100g single shocks and 50g multiple shocks.
- 300W Military Standard DC/DC Converter Module
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SK711 is a wide input board type converter supporting input range from 18V to 36V. Possessing military standard filter for EMI avoidance, SK711 guarantees the stability of voltage and electric current for system operation, especially suitable for application in military or other harsh environment. Furthermore, with parallel design, two SK711 can be combined for double power of 300W, supporting prominent system performance. Compliant with MIL-STD 1275/461, extended operating temperature from -40 to 85°C, SK711 performs as an ideal converter module for severe environmental usage. The Cosel Hi-Rel DC/DC CONVERTER it also provides , Output Over Current Protection (OCP), Output Overvoltage Protection (OVP) and Over Temperature Protection (OTP) to made stability and safety.
- Test report
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System |
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CPU |
Intel® 9th Coffee-Lake i7-9850HE (2.7 GHz, up to 4.4 GHz, 6-cores, 12 threads) Intel® 11th Tiger-Lake i7-11850HE (2.6 GHz, up to 4.7 GHz, 8-cores, 16threads) |
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Memory Type |
DDR4-2666 Up to 64GB (ECC for Options) |
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GPU |
NVIDIA MXM Graphic Card support up to GTX1080 (8GB GDDR5X, CUDA 2560) NVIDIA MXM Graphic Card support up to RTX5000 (16GB GDDR6, CUDA 3072) |
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Display |
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Display Port |
4 x DisplayPort 1.4 digital video outputs (DP++), 1 x HDMI, 2 x DVI, 1x eDP | |
Storage |
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HDD/SSD | 2 x mSATA, up to 1TB | |
Ethernet |
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LAN | 2 x Intel I350-AM2 Gigabit LAN Interfaces ( 10/100/1000Mbps) | |
10GbE | 2 x 10GbE supported | |
Front I/O |
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X1 |
1 x USB x 4 MIL-38999 22Pin connector (Amphenol TV07RW-13-S) |
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X2, X3 |
2 x 10G LAN M12 8Pin connector (X CODE Cat6) |
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X4, X5 |
2 x 1G LAN MIL-38999 10Pin connector (Amphenol TV07RW-13-98S) |
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X6 | >1 x RS232 MIL-38999 10Pin connector (Amphenol TV07RW-13-98S) | |
X7, X8 | 2 x DVI MIL-38999 22Pin connector (Amphenol TV07RW-13-S) | |
Power Requirement |
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Power Input | 18V to 36V DC-DC 300W | |
Mechanical and Environment | ||
Dimension (WxDxH) |
480 x 400 x 88 mm | |
Chassis | Aluminum Alloy, Corrosion Resistant | |
Finish | Anodic aluminum oxide (Color Iron gray) | |
Cooling | Natural Passive Convection/Conduction. No Moving Parts | |
Ingress Protection | IP65 | |
Applications, Operating System |
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Applications |
manufacturing applications |
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OS |
Windows 10 64Bit Ubuntu13.04, Ubuntu13.10, Ubuntu14.04, Fedora 20 |
MIL-STD-810 Specifications (Operating) |
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Method 502.5 | Low Temperature | -20°C, 4 hours, ±3°C |
Procedure 2 | ||
Method 501.5 | High Temperature | +55°C, 4 hours, ±3°C |
Procedure 2 | ||
Method 507.5 | Humidity | 85%-95% RH without condensation, 24 hours/ cycle, conduct 10 cycles. |
Method 514.6 | Vibration | 5-500Hz, Vertical 2.20Grms, 40mins x 3axis. |
Method 516.6 | Shock | 6 Grms, 11ms, 3 axes. |
MIL-STD-810 Specifications (None-Operating) |
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Method 502.5 | Low Temperature | -33°C, 4 hours, change rate: ≦20°C/ Hour |
Storage | -15°C, 72hours (By request) | |
Method 501.5 | Low Temperature | +71°C, 4 hours, change rate: ≦20°C/ Hour |
Storage | +63°C, 240 hours (By request) | |
Method 514.6 | Vibration | 5-500Hz, Vertical 2.20Grms, 40mins x 3axis. |
Method 516.6 | Shock | 6 Grms, 11ms, 3 axes. |
MIL-STD-461 Specifications (EMC) | ||
Conducted Emissions | CE102 basic curve | 10kHz - 30 MHz |
Power Leads | ||
Conducted Emissions | RE102-4 | 1.5 MHz -30 MHz - 5 GHz |
Electric Field | ||
Radiated Susceptibility | RS103 |
1.5 MHz - 3 GHz, 50 V/m equal for all frequencies 2 MHz - 80 MHz 50 V/m equal for all frequencies 80 MHz - 3 GHz 50 V/m equal for all frequencies 3 GHz - 5 GHz, 50 V/m equal for all frequencies |
Electric Field | ||
Electrostatic Discharge | EN 61000-4-2 | Air discharge: 8 kV, Contact discharge: 6kV |
Electromagnetic compatibility | EN 61000-4-4 | Signal and DC-Net: 1 kV |
Electromagnetic compatibility | EN 61000-4-5 | Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV |
Radio disturbance | EN 55022 | Class A |
Electromagnetic compatibility | EN 61000-4-3 | 10 V/m |
Electromagnetic compatibility | EN 61000-4-5 | Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV |
Conducted Susceptibility | *CS101 | 30HZ to 150KHZ |
Power Leads | ||
Conducted Susceptibility | *CS114 | 10kHz to 200MHz |
Bulk Cable Injection | ||
Conducted Susceptibility | *CS115 | 50 V/m |
Bulk Cable Injection | ||
Conducted Susceptibility | *CS116 | 50 V/m |
Damped Sinusoidal Transients | ||
Radiated Susceptibility | *RS101 | 30 Hz to 100 kHz |
Magnetic Field | ||
Radiated Susceptibility | *RS103 | 5 GHz to 18 GHz, 50 V/m equal for all frequencies |
Electric Field | ||
Radiated Emissions | *RE103 | 10 kHz to 40 GHz |
Antenna Spurious and Harmonic Outputs | ||
Conducted Emissions | *CE106 | 10 kHz to 40 GHz |
Antenna Terminal | ||
* Option Test item : CS101/CS114/CS115/CS116/RS101/RS103/RE103/CE106 * Test item for Antenna system : RE103/CE106 |
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MIL-STD-1275 Specifications |
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Steady State | 20V to 33V | |
Surge Low | 20V to 33V | |
Surge High | 18V/500ms |
HORUS430 (i7-9700HE processor) CPU Performance
Point |
-20℃ |
-10℃ | 0℃ | 50℃ | 55℃ | 60℃ |
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CPU Frequency(GHz) | 3.4 | 3.7 | 3.5 | 2.8 | 2.8 | 2.5 |
CPU T-J(℃) | 47 | 53 | 64 | 99 | 100 | 100 |
GPU Frequency(GHz) | 1.9 | 1.9 | 1.9 | 1.6 | 1.5 | 1.2 |
CPU T-J(℃) | 28 | 34 | 45 | 90 | 90 | 90 |
CPU | 21 | 27 | 35.8 | 80.1 | 82.8 | 85 |
- Order Information
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Model Name
Description
HORUS430-X1
GPGPU-based radar subsystem with Intel® 9th Gen Core i7-9850HE, GTX1080 MXM, IP65 , 18V-36V, support MIL-STD-461, MIL-STD-810G. with MIL-DTL-D38999 Connectors, Operating Temp. -40 to +55°C
HORUS430-X2
GPGPU-based radar subsystem with Intel® 11th Gen Core i7-11850HE, RTX5000 MXM, IP65 , 18V-36V, support MIL-STD-461, MIL-STD-810G. with MIL-DTL-D38999 Connectors, Operating Temp. -40 to +65°C
Thermal Solution : Conduction cooling
The conduction cooling passive solutions don’t require moving components, meaning high reliability, less wear and tear, and low maintenance. It guarantees that our products are made in accordance with your requirements on wide temperature range, compact design, durability, high performance and extended lifecycle. We implement a design principle that uses wide temperature grade components, optimal power circuits, constructed cooling; thermal design, and wideband extended temperature testing.