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EN236A - Intel® Core™ i7-3517UE - EN50155 Railway Embedded Computer

1U Rackmount Fanless System with 3rd Gen. Intel® Core™ Processor,

EN50155 Certified, 33.6V to 62.4V DC-in, Smart UPS, Extended Temp. -40°C~70°C

  • Intel® Ivy Bridge Processor BGA Type i7
  • 1 x DDR3 SO-DIMM up to 8 GB
  • 2 x 2.5" SATA III Storage
  • Dual GbE LAN ports (M12 connector)
  • 2x USB2.0, 1 x VGA
  • 33.6V~62.4V DC-in
  • Extended Temperature -40°C to 70°C
  • EN50155 compliant
  • Technical Profile
  • Specifications
  • CPU Performance
  • SSD Performance
  • Thermal Solution
  • Certification

 Introduction

EN236A is 19" 1U Rack-mount Fanless rugged System, suitable for application such as railway, high-end automation etc. Powered by Intel® Ivy Bridge i7 CPU and HM76 chipset, the BGA type CPU i7-3517UE with dual cores performance has only 17W power consumption. The fanless design ensures silent operation and eliminates the possibility of gathering dust and external debris inflow which may cause system failure over time. EN236A integrates wide range DC input from 33.6V to 62.4V with extended temperature operation up to 70°C without CPU throttling. Moreover, being EN50155-certified, EN236A possesses high performance under various power supply conditions, especially in rolling stock equipment and railway application.

EN235A_01

 

 

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Unique Features

EN50155 Compliant

EN50155 is an international standard covering electronic equipment used on rolling stock for railway applications. The standard covers aspects of this electronic equipment, including temperature, humidity, shock, vibration, and other parameters. EN236A is compliant with the essential sections of EN50155. Meet with most critical EN50155 Tx Class, EN236A can withstand environmental from -40°C to 70°C internal cubicle temp., cooling test -40°C for 2 hours, dry heat test 70°C for 6 hours. On vibration, 5 to 150 Hz 5 hours / axis (0.5 g) for non-operation, 5 to 150 Hz 10 mins / axis (0.1 g) for operation; Shock is test by Half Sine wave 50 m / s2 30ms on longitudinal, transverse and vertical make it a suitable solution for a variety of railway application, such as content server, passenger infotainment etc.

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Internal Back up Battery Set and UPS

While facing main power sudden shut down, EN236A is proven to be strong enough to self-supply power due to internal battery set and UPS function. Build-in five 10V/2500mA batteries that can support maximum 30~31W by testing; together with UPS board allows EN236A to support up to extra 30 minutes in full loading (5 hours in idle mode). This is the most promising feature allows users to have enough time to shut down the system properly or back up the systems when facing unexpected interruption of power supply.

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Removable SSD Tray

EN236A is designed to fulfill demands of different application. In order to have more flexibility and be more user-friendly, EN236A equipped 2 removable SSD trays. For applications which require frequent changes on storage of system, such as passenger infotainment, content server etc, EN236A is the best solution.

EN236A main board: 3.5" SBC - OXY5336A
EN236A_03

 

1.  Intel Core i7 CPU soldering onboard

EN236A is based on 3.5" SBC—OXY5336A, powered by Intel Ivy Bridge i7-3517UE plus HM76 chipset soldered onboard. The processor supports 1.7GHz dual core but consumes only 17W which is relatively low power consumption. With CPU soldering onboard, there is less conduction of heat and high density interconnection between the motherboard and the component, which reduces the MB from the crisis of overheating. Apart from overheating, soldering onboard also provides the best level of shock and vibration protection. Generally speaking, it is rare to find 1U rackmount system that is driven by Intel core i7 processor since it is hard to completely dissipate the heat generated by Intel core i7 CPU. Therefore, EN236A is comparatively valuable with its high computing power but fanless solutions.

EN235A

 

2. Wide range temperature support

Following STACKRACK wide temp principal, OXY5336A is designed to fulfill running full speed in harsh environment from -40°C to 85°C. Not only the board is designed with truly wide temp industrial component, the BGA type CPU can also help to achieve better heat dissipation. OXY5336A is truly a rugged SBC ideal for high-end Automation, heavy-duty railway, drilling and energy applications.

 

Operating Temp.

-40°C~70°C

System

CPU

Intel® Ivy Bridge 22nm Core™ i7/i5/i3, BGA type
Intel® Core™ i7-3517UE (2C x 1.7 GHZ), 4M L2 cache (17W)
Intel® Core™ i5-3610ME (2C x 2.7 GHZ), 3M L2 cache (35W)
Intel® Core™ i3-3217UE (2C x 1.66 GHZ), 3M L2 cache (17W)

Chipset

Intel® HM76 Express Chipset (Intel® BD82HM76 PCH)
Intel® QM77 Express Chipset (Intel® BD82QM77 PCH) by request

Power System

EN50155 standard 48V solution (33.V to 62.4V DC in)
OpenUPS Uninterruptible Power Supply Board
CYCLON Battery Set supply 10V 2.5A for 1 hour

Memory type

1 x 204-pin SO-DIMM DDR3 1333/1600 MHz up to 8GB

Expansion Slot

1 x Mini PCIe

Storage Device

2 x 2.5" SATA HDD/SSD (Easy Swap 2.5" HDD cage)

Front I/O

Power Button

1

LED Indicator

1 x Power LED
1 x HDD LED

Ethernet

2 x M12 Connectors Extended from Front Window

Power Input

1 x M12 Power Connectors

Front Window

VGA

1 x 15-pin VGA connector (female)

Ethernet

Intel® 82579LM & 82574IT GbE LAN (support 10/100/1000 Mbps for x2 RJ45 ports)

COM

1 x RS232/422/485 with 5V/12V selectable

USB

2 x USB 3.0

Rear I/O

2.5" HDD/SSD Tray

2

GND Screw

1

OS support list

Windows

Windows 10 32/64bit

Linux

Fedora 20, Ubyntu 13.10, Ubuntu 14.04

Mechanical and Environment

Power Requirement

33.6V to 62.4V DC-in

Dimension

440 x 44 x 360 mm (17.32" x 1.73" x 14.17")

Weight

7.90 kg (17.4 lbs)

Operating Temp.

-40°C to 70°C (ambient with air flow)

Storage Temp.

-40°C to 85°C

Relative Humidity

10% to 95%, non-condensing

Test standard

EMC

CE, FCC Class A

Railway

EN50155 Compliant

 

The whole thermal solution of EN236A consist of three heat transfer methods, heat conduction, heat convection and water circulation. For heat conduction, the solution utilizes a copper heat spreader directly contact with the processor and chipset. Further comes to water circulation that formed in heat pipe, the working fluid indirectly brings away the heat to dual side aluminum heat sink for faster heat dissipation. By adopting high efficiency thermal solution guarantees the system to operate smoothly under harsh environment -40°C to 70°C.

EN236A_01

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Device Model
EN236A
Tester
Ian Huang
Tester Result Pass
Test Temperature High 0°C~70°C / Low -40°C~0°C
Test Time 15 Hours/3 Hours
Test Standard Reference IEC60068-2
Test Software Burning test v7.1, Crystal DiskMARK 3.03, Intel Extreme Tuning Utility
Criteria

After testing, system can't halt.

 

Test Configuration

Device 

Configuration 

CPU Type 

 Intel Core i7-3517UE 1.7GHz 

PCH

 Intel® HM76

Memory

 2GB DDR3 1333 MHz SODIMM 

Test Software 

Burnin test v7.1、Crystal DiskMARK3.03,

Intel Extreme Tuning Utility Iperf , AS SSD

 Chamber 

KSON THS-b4t-150 Chipeng SMO-3

Thermal Measurement

STACKRACK provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performanceunder high temperature, thus PERFECTRON conducts long time experiments tomake sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, STACKRACK is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 12.5 hours which at each temperature point we burn in EN236A for two hours, from 40°C to 70°C.

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EN235A CPU Performance

Point
-40°C
-20°C
25°C
40°C
45°C
50°C
55°C
60°C
65°C
70°C
CPU T-J 2 21 58 66 75 77 84 86 96 97
CPU Die -9.6 11.6 47.0 52.9 62.2 66.8 70.4 74.8 81.3 86.5
Heatsink -14.2 -5.4 44.5 50.8 58.6 63.5 69.1 72.2 80.0 83.5
Δ1=(TJ-Die) 11.6 9.4 11 13.1 12.8 10.5 13.6 11.2 14.7 10.5
Δ2=(Die-HeatSink) 4.6 17.0 2.5 2.1 3.6 3.3 1.3 2.6 1.3 3.0
CPU Frenquency (GHz) 2.59 2.56 2.54 2.59 2.60 2.54 2.58 2.56 2.59 2.58

 

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Test Result

SR100Innodisk 2.5" SATA SSD 3ME 32GB (Read) MB/s

NEW_STYLE_products_SR100_SSD03Innodisk 2.5" SATA SSD 3ME 32GB (Write) MB/s

NEW_STYLE_products_SR100_SSD08_02ADATA 2.5" SATA SSD 128GB (Read) MB/s

NEW_STYLE_products_SR100_SSD09_02ADATA 2.5" SATA SSD 128GB (Write) MB/s

EN236A Performance

Point

-40°C

-20°C

25°C

40°C

45°C

50°C

55°C

60°C

65°C

70°C

Innodisk 2.5" SATA SSD 3ME 32GB (Read) MB/s

242.51

254.18

340.60

342.83

382.64

347.82

370.23

251.37

238.62

237.37

Innodisk 2.5" SATA SSD 3ME 32GB (Write) MB/s

27.14

42.11

31.03

35.04

33.44

34.90

40.97

33.66

32.76

37.03

ADATA 2.5" SATA SSD 128GB (Read) MB/s

273.02

273.36

270.45

267.98

281.42

270.68

275.04

274.06

288.02

273.92

ADATA 2.5" SATA SSD 128GB (Write) MB/s

21.85

61.99

89.25

62.36

56.25

60.03

55.77

62.16

56.97

53.97

To meet the demands of customer's extended temperature requirements, the whole thermal solution of EN236 consist of three heat transfer methods, heat conduction, heat convection and water circulation. For heat conduction, the solution utilizes a copper heat spreader directly contact with the processor and chipset. Further comes to water circulation that formed in heat pipe, the working fluid indirectly brings away the heat to dual side aluminum heat sink for faster heat dissipation. By adopting high efficiency thermal solution guarantees the system operate smoothly under harsh environment -40°C to 70°C.

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Honeycomb Dissipating Vents

The honeycomb vents are pre-drilled in rigid aluminum frames to fasten thermal convection and the airflow that will astonishingly enhances ventilation. The enclosure features large, open honeycomb vents on the top, instead of fan solution that allows natural convection cooling that gather dust easily.

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Internal battery set and UPS function

EN236A equipped internal battery set and UPS function, this feature support power delay off up to 20~30 minutes which allow users to have enough time to shut down the system properly or back up the systems when facing unexpected interruption of power supply.

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Copper heat pipes

Heat pipe transfers heat from the heat sources to the heat sink over relatively long distance. Two-phase heat transfer involves the liquid-vapor phase change of a working fluid.



• 8.0 mm diameter heat pipe, 99.9% purity of copper

• High heat conductivity coefficient up to 5000!

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Aluminum heat sink

Dual sided aluminum heat sink transfer heat from copper heat pipe and dissipate rapidly to surrounding air.

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OXY5336A

3.5” OXY5336A SBC, powered by Intel Ivy Bridge i7-3517UE and HM76 chipset soldered onboard. The processor supports 1.7 GHz dual core but consumes only 17 W which is relatively low power consumption.