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HORUS422A - 10 GbE RocketRaid 840 x 12 Bays Core i7 Rackmount Storage Server

2U 19" Rugged Rackmount with Intel. Core i7-6700TE, 12 Bays 2.5" SSD/HDD, RAID Card supported, Operating Temperature 5°C~50°C
NVIDIA® GTX950M (CUDA Cores: 640)/GTX 1050 Ti(CUDA Cores: 768)/GTX1060(CUDA Cores: 1280)/GTX1080 (CUDA Cores: 2560) GPU

MIL-STD 810G Compliance
Intel® 6th Gen. Core i7-6700TE
4 x DDR4 XR-DIMM up to 64GB
RocketRAID 840A RAID Card
4 x RJ45 LAN, 6 x USB, 1 x RS232 Console
12 x 2.5" Easy swap SSD/HDD Tray
Extended Temperature 5°C~50°C
NVIDIA® GTX950M (CUDA Cores: 640)/GTX 1050 Ti(CUDA Cores: 768)/GTX1060(CUDA Cores: 1280)/GTX1080 (CUDA Cores: 2560) GPU

  • Technical Profile
  • Specifications
  • CPU Performance
  • SSD Performance
  • Thermal Solution


HORUS422A is designed with Intel 6th generation Skylake i7-6700TE processor, Skylake i7-6700TE processor presents outstanding CPU performance with quad cores up to 3.4GHz clock speed. System especially builds in Highpoint RocketRAID 840A SATA RAID Card supports up to 12 SATA/SSD drives.

HORUS422A highlights on it rugged design and high functionality, system especially designed with dual sided thermal solution, allow powerful system presents supreme performance under harsh environment.




Dual sided thermal solution ensures supreme system performance

With combination of high end CPU computing and high bandwidth PCIe bus power generate numerous heat, STACKRACK emphasizes on providing exceeding thermal design guarantee superior system performance under critical environment. HORUS422A innovatively adopts dual sided thermal solution, with copper heat spreader directly touches the heat source components processor and RAID card to absorb the heat rapidly, heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid which can provide high efficiency heat transmission. The aluminum heat sink dissipates the heat into surrounding air promptly. One side thermal solution is mainly for Core i7-6700TE 35W processor and the other side is to dissipate the heat for RocketRAID 840A RAID card. With unique thermal design, HORUS422A can ensure high performance and reliability under harsh environment.

Maximizes SATA SSD Storage Performance

RAID 5 Performance Up to 6,000 MB/s!

RocketRAID 800 host bus adapters are the industry's fastest SATA RAID Controllers. The PCIe Generation 3.0 host interface and dedicated 6Gb/s SATA channels work in tandem to deliver uncompromised transfer performance for up to 16 SSD's or hard disks.

System main board: ATX AB20

1. Intel Skylake Core i7-6700TE powerful processor

HORUS422A is based ATX formfactor AB20 motherboard, powered by Intel 6th generation Skylake Core i7-6700TE, Skylake processor presenting superior CPU and graphics performance, providing quad cores up to 3.4 GHz clock speed over compact size 2U rackmount.

2.Rich I/O interface

AB20 equips extensive I/O interface to fulfill different application requirements. The board supports four XR-DIMM RAM up to 64 GB, it offers 4x LAN, 10x USB and 6x COM for device connects ability, with 4x Mini PCIe slot, 1x PCIex8 and1x PCIex4 can add on extra feature for different demands. With MXM slot can integrate with graphic card for image processing usage.


Operating Temp.

5°C to 50°C



Intel® Core i7-6700TE Processor



Memory Type

4 x DDR4 XR-DIMM up to 64GB



Expansion Slot

4 x mPCIe (two support with mSATA)
1 x PICex4

Storage Device

12 x 2.5" (7mm) Esay Swap HDD / SSD Tray



Intel® HD Graphics 500 Series

Display Type

1 x DisplayPort ; 1 x HDMI



3 x Intel® I210-IT ; 1 x I219-LM GbE LAN
( support 10 / 100 / 1000 Mbps for RJ45 port )



Boot from LAN

Yes for PXE

Rear I/O


4 x RJ45 Gigabit Ethernet LAN Interfaces


1 x HDMI ; 1 x DisplayPort


4 x USB3.0 standard-A connectors



Front I/O


1 x System On/Off, 1 x System FAN On/Off

Indicator LED



1 x DB9


2 x USB2.0 standard-A connectors

2.5" SSD / HDD Tray

12 ( 7mm height SSD / HDD only )

OS support list


Windows 8 x32 / x64、Windows 8.1 x32 / x64、Windows 10 x32 / x64


Fedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04

Mechanical and Environment

Form Factor


Power Type

AC to DC 100-240V 400W FLEX ATX Switch Power Supply with fan

Weight 13.12kg(28.92lbs)


430 x 396 x 88 mm ( W x D x H )

Operating Temp.

5°C to 50°C

Storage Temp.

-20°C to 70°C

Relative Humidity

5% to 95%, non-condensing

 The HORUS422A offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers' extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.



Device Model HORUS422A
Tester Marc
Test Result Pass
Test Temperature High 0°C~50°C / Low 0°C~5°C
Test Time 8.5 Hours
Test Standard Reference IEC60068-2
Test Software Burn in test 8.0 AS SSD 1.9
Criteria After testing, system can't halt.


Test Configuration




Intel® Core™ i7-6700TE Processor 2.4 GHz


Intel Q170


Innodisk 16GB SOD DDR4 2133

Test Software

Burnin test v8、、IntelBurnTest 1.9


KSON THS-b4t-150 Chipeng SMO-3

Thermal Measurement

STACKRACK provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus STACKRACK conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, STACKRACK is able to analyses the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5.5 hours which at each temperature point we burn in HORUS422 for two hour, from +40 to +50°C.


HORUS422A System - IO Performance

Point 5°C 15°C 25°C 40°C 50°C
CPU T-J 43 52 65 75 86
CPU Die 26.4 28.1 39.5 57.5 71
Heatsink 24.2 26.9 32.7 47.3 68
Δ1=(TJ-Die) 16.6 23.9 25.5 17.5 15
Δ2=(Die-Sink) 2.2 1.2 6.8 10.2 3
CPU Frenquency (GHz) 2.9 2.9 2.9 2.86 2.86



Test Result

SR100Apacer Msata 128G ( Read ) MB/s

NEW_STYLE_products_SR100_SSD03Apacer Msata 128G ( Write ) MB/s

NEW_STYLE_products_SR100_SSD08_02Innodisk 64GB SSD ( Read ) MB/s

NEW_STYLE_products_SR100_SSD09_02Innodisk 64GB SSD ( Write ) MB/s

 HORUS422A MB HeatSink - IO Performance

Point 5°C 15°C 25°C 40°C 50°C
Apacer Msata 128G ( Read ) MB/s 279 277 275 274 270
Apacer Msata 128G ( Write ) MB/s 130 129 127 119 114
Innodisk 64GB SSD ( Read ) MB/s 522.57 504.98 504.14 517 505.52
Innodisk 64GB SSD ( Write ) MB/s 190.27 191.7 191.81 194.23 192.76

Effective cooling solution for maximum heat dissipation:

STACKRACK implements unique cooling solution with copper heat spreader, pure copper heat pipe and aluminum heat sink for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of copper and aluminum, the heat spreader touches the heat source - processor and chipset and absorbs the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, HORUS422 can ensure high reliability and stability while working under wide range temperature from 5°C up to 50°C.


Patent Designed Aluminum Heat Sink

The heat sink is made by heat radiating material, which is aim to lowering the temperature by dissipating heat into the surrounding air. 96 % of aluminum.

Heat spreader

Heat spreader directly touches the power source area, which can absorb heat rapidly and transfer to heat pipe and allow the high efficiency heat pipe further bring out heat to upper heat sink enclosure.


Pure Copper Heat Pipe

The heat pipes are embedded in the heat sink to ensure 100% tight integration for superior heat dissipation. Especially adopts U shape copper heat pipe to fulfill utmost thermal conductivity, copper heat pipe transfers heat from the heat sources (e.g. CPU, chipset) to the heat sink over relatively long distance. Two-phase heat transfer involves the liquid-vapor phase change of a working fluid.




COM Express carrier + CPU Module is in the middle of the system as a cutoff point, dividing segmentation type thermal design into upper and lower module.

Upper thermal module is applied to cool down the heat generated from graphic card and processor.



Heat spreader

Copper heat spreader directly touches the heat source- processor and chipset, which absorb heat rapidly.