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AV200 - Intel i7-7820EQ, NVIDIA 1050Ti GPU Server

AV200 - NVIDIA GTX1050Ti GPU Server

Intel®7th Gen. Core™i7-7820EQ NVIDIA GTX 1050 Ti GPU MIL-STD Fanless Rugged System

  • MIL-STD 810G Compliance
  • 7th Generation Intel® Core™ i7-7820EQ Kabylake Processor
  • Up to 32GB DDR4 SDRAM
  • Onboard uSSD SATAIII 64GB
  • NVIDIA GTX 1050 Ti Independent Displays by 2 x DP
  • 2 x mPCIe expansion slot (One supports mSATA)
  • 2 x Intel® Gigabit Ethernet
  • 4 x USB 3.0, 1 x COM port
  • 9V to 36V DC-in
  • Extended Temperature -40°C to 60°C
  • Technical Profile
  • Specifications
  • CPU Performance
  • SSD Performance
  • Thermal Solution

 Introduction

AV200, EBX rugged system is a powerful system that is driven by Intel® 7th generation Kabylake CPU and chipset soldering onboard, integrated with Nvidia GPU GTX1050Ti that supports 2 independent DisplayPort. Processor i7-7820EQ plus Intel® QM175 chipset supports clock speed 3.0GHz, up to 3.7GHz. Quad cores, turbo up to 8 cores to cope with enormous data computing. Apart from computing power, the system is able to survive in harsh environment from -40 to 60°C, and ruggedness for vibration and shock is proven to pass MIL-810G standard. With the combination of high CPU computing power and rich display inputs, AV200 is a perfect portable solution for rugged consoles & workstations, transportation, defense control room to share instant and accurate information on huge screen for in-time solutions.

AV200_0.png

 

Thermal solution for fanless system design

1090205_ AV200 _動態3D爆炸圖_有材質版本.89-1.png

STACKRACK designs a unique enclosure that is able to stack together both horizontally and vertically. The aluminum heat sink enclosure allows dual-sided heat dissipation. STACKRACK exclusively adopts special heat radiating material and combining with special CNC cutting, further forged into a lavish sophisticated metal. Apart from the special heat sink enclosure, AV200 innovatively adopts two kinds of copper heat spreader. The shape and the size of the spreader are tailor-made based on the heat sources placement of CPU module and graphic module. In view of the gap difference between motherboard and heat sink, STACKRACK builds two heat spreaders in different thicknesses. Combining all these exclusive thermal designs can alternatively replace traditional fan, and also ensures high reliability and stability while working under wide range temperature from -40°C to 60°C

System main board: EBX SBC-OXY5740A

1. Intel® Core i7 CPU soldering onboard

AV200 is based on EBX SBC—OXY5740A, powered by Intel Kabylake i7-7820EQ quad core processor plus QM175 chipset soldered onboard. With CPU soldering onboard, there is less conduction of heat and high density interconnection between the motherboard and the components, which reduces the MB from the crisis of overheating. Apart from overheating, soldering onboard also provides the best level of shock and vibration protection, removing the unnecessary concern about poor connection that CPU socket type may bring.

2. Four Independent DisplayPort

AV200 has added on NVIDIA graphic card through PCIe/104 interface, supporting 4 independent DisplayPort which is driven by GPU GTX1050Ti. GTX1050Ti itself has 768 CUDA Cores, representing its high computing performance and consumes power at 75W maximum. Connecting by PCIe/104 interface which enhance the resistance of shock and vibration as the connector allows nearly seamless connecting.

3. Wide Range DC input

For military and heavy duty vehicle applications, instable voltage always brings headaches about damaging the electric components. AV200 supports 9V to 36V DC-in, the flexible acceptance of inconsistent power input makes it capable of surviving tough engine cranks and transient over-voltage situations.

 

Operating Temp.

-40°C to 60°C (ambient with air flow)

System

CPU

Intel® Core™ Kabylake
Intel® Core™i7-7820EQ  up to 3.7 GHz (8M Cache, 45W)

GPU

GeForce GTX 1050 Ti

CUDA Cores 768

Memory Interface GDDR5

Standard Memory Config 4 GB

Memory Type

Up to 32GB DDR4 SDRAM

Expansion Slot

1 x Full-size mPCIe (w/ SIM card and mSATA supported)
1 x Half-size mPCIe

Storage Device

Onboard uSSD SATAIII 64GB
1 x 2.5 Easy swap HDD/SSD Tray

Front I/O

USB

2 x USB3.0

2.5" SSD/HDD Tray

1

Power button

1 x System On/Off

Indicator LED

Power, HDD, LAN (Link/Active/Speed)

Rear I/O

USB

2 x USB 3.0

Display

4 x DisplayPort
1 x DVI-I

Audio

2 x 3.5mm Audio Jacks (1 x MIC, 1 x Line-Out)

Serial Port

1 x DB9 connector (RS-232/422/485)

Ethernet

2 x RJ45

Power Input

1 x 4P Rugged Terminal connector

OS support list

Windows

Windows 10

Linux

Fedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04

Mechanical and Environment

Power Requirement

9V to 36V DC-in

Dimension (WxDxH)

315.2 x 150 x 120 mm

Weight

6 Kg (13.23 lbs)

Operating Temp.

-40°C to 60°C (ambient with air flow)

Storage Temp.

-40°C to 70°C

Relative Humidity

10% to 90%, non-condensing

Test Standard

EMC

CE, FCC compliant

EMC

CE and FCC compliance

Green Product

RoHS, WEEE compliance

 

 

AV200 - NVIDIA GTX950M GPGPU Server_CPU_01

The AV200 offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers' extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.

cpu performance 2

Device Model AV200
Tester Robin Chang
Test Result Pass
Test Temperature High 0°C~60°C / Low -40°C~0°C
Test Time 11.5Hours / 3Hours
Test Standard Reference IEC60068-2
Test Software Burnin test v6.0
Criteria After testing, system can't halt.

 

Test Configuration

Device

Configuration

CPU Type

Intel® Core i7-6820EQ 2.8 GHz

PCH

Q170

Memory

1 x DDR4 2400 XR-DIMM up to 16GB w/ECC

Memory

1 x DDR4 2400 SO-DIMM up to 16GB w/ECC

Graphic

NVIDIA GTX950M

LAN1

Intel® I219 GbE LAN

LAN2

Intel® I210 GbE LAN

Test Software

Burnin test v6.0、AS SSD、 Intel Extreme Tuning Utility、
iperf GPU-Z、FurMark v1.9.2

Chamber

KSON THS-b4t-150
Chipeng SMO-3

 

Thermal Measurement

STACKRACK provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus STACKRACK conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, STACKRACK is able to analyses the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 9 hours which at each temperature point we burn in AV200 for two hour, from 40°C to 60°C.

thermal measurement

AV200 MB HeatSink - IO Performance

Point

-40°C

-20°C

0°C

25°C

50°C

55°C

60°C

CPU T-J

0

25

47

100

100

100

100

CPU Die

-21.7

12

31.7

88

91

88

93

Heatsink

-32.5

-12

6.9

61

67

71

75

Δ1=(TJ-Die)

11.6

9.4

11

13.1

12.8

10.2

13.6

Δ2=(Die-HeatSink)

4.6

17

2.5

2.1

3.6

3.3

1.3

CPU Frequency (GHz)

3.2

3.2

3.2

3.1

2.95

2.77

2.6

GPU T-J

0

0

4

51

55

61

67

GPU Die

-34.3

-13.4

6.3

31.3

67.5

72.3

77

GPU Frequency (GHz)

0.796

0.915

0.77

0.73

0.732

0.784

0.78

SSD performance

 

Test Result

NEW_STYLE_products_SR100_SSD08 64GB SSD (Read) MB/s

NEW_STYLE_products_SR100_SSD0964GB SSD (Write) MB/s

AV200 MB HeatSink - IO Performance

Point -40°C -20°C 0°C 25°C 50°C 55°C 60°C
64GB SSD (Read) MB/s 386 389 361 389 407 423 401
64GB SSD (Write) MB/s 74 70 75 53 88 73 86

Effective cooling solution for maximum heat dissipation:

STACKRACK implements unique cooling solution with heat spreader and aluminum heat sink for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of aluminum, the heat spreader touches the heat source - processor and chipset and absorbs the heat rapidly, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, AV200 can ensure high reliability and stability while working under wide range temperature from -40 up to 60°C.

1090205_ AV200 _動態3D爆炸圖_有材質版本0309_0.png