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AV600-THT

Military IP65 Mission GPU Computer

  • MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
  • IP65 Chassis with D38999 connectors
  • Intel® 11th Gen. Tiger Lake(H) W-11865MRE Processors, up to 8 cores
  • Up to 96 GB DDR4 SO-DIMM, non-ECC and ECC
  • NVIDIA RTX™ A4500 8GB/16GB GDDR6 memory 5888 CUDA cores
  • Soldered 64 GB NVMe
  • IP65 2 x 2.5” SATA SSD Easy Swap Tray
  • MIL-STD 461 18V~36V DC-Input (Options for MIL-704/1275)
  • Extreme Temperature : -40°C to 70°C
  • Dimensions : 246(L) x 313.5 (W) x 100 (H) mm
  • Technical Profile
  • Specifications
  • Certification
Introduction

helicopterAV600X-THT is driven by Intel® 11 Gen. Tiger Lake-H Processors, integrated Intel® UHD Graphics (Xe architecture). Tiger Lake H processor is built on 10nm SuperFin Technology, up to 8 CPU cores and 4.7 GHz frequency. It is high computing performance and flexibility for heavier IoT workloads, the platform posts significant performance gains gen-over-gen with up to 32 percent gain in single-thread performance. It also features in high-bandwidth, high speed I/Os for expansion and peripherals.

AV600X-THT highlights on its rugged design and high functionality, the system especially installed MIL-STD Amphenol type connector and full IP66 protection allow system withstand in any kind of harsh environment. AV600X-THT supports extended temperature from -40°C to 70°C and MIL-STD-461 18V~36V DC-input Power supply which can protect system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself.

ARINC

Block Diagram

blcok diagram

Appearance

THT

CE Verification

CE

 

System

CPU

Intel® 11 Gen. Tiger Lake-H Processors, up to 8 cores, integrated Intel® UHD Graphics

Intel® Xeon® W-11865MRE, 2.6(4.7) GHz, 24MB, 45W(35W cTDP), 8C/16T

Memory type

Up to 96GB DDR4 SO-DIMM, non-ECC and ECC

CHIPSET

Intel® RM590E (support ECC, with Xeon CPU) /QM580E

GPU

NVIDIA RTX™ A4500 GA104-955 GPU

8GB/16GB GDDR6 memory, 5888 CUDA cores

On Board Storage Soldered 64 GB NVMe

Expansion Slot

2 x Full-size mini PCIe (1 with mSATA supported)

-1 with mSATA/USB2.0/PCIeX1 support

-1 with SIM/USB2.0/PCIeX1 support

1 x 2280 M key (SATA only)

Storage

SATA

2 x 2.5” SSD, Hot Swappable SSD/HDD slot

M.2

1 x 2280 M key (SATA only)

Front I/O

X1

1 x DVI + 2 x COM +USB2.0 , with D38999 connector 

X2

4 x Giga LAN , with D38999 connector 

X3

1 x USB3.0 , with D38999 connector  

X4

1 x USB3.0 , with D38999 connector  

X5

1 x DC-in , with D38999 connector   

LED

1 x SSD/HDD LED indicator

switch

1 x IP65 power button , with LED indicator

SSD

2 x 2.5”Easy swap SSD Tray

Power

Power input

MIL-STD-461 18V~36V DC-Input

Operating System

OS

Windows® 10 64-bit / Linux (support by request)

Physical

Dimension

246(L) x 313.5 (W) x 100 (H)mm

Weight

11 KG

Chassis

Aluminum Alloy

Heatsink

Heatsink Aluminum Alloy, Corrosion Resistant

Environmental

Green Product

RoHS, WEEE compliance

Operating Temp.

-20°C to 55°C

Storage Temp.

-40°C to 85°C

Relative Humidity

5% to 95%, non-condensing

MIL-STD-810 Specifications (Operating)

Method 502.5

Low Temperature

-20°C, 4 hours, ±3°C

Procedure 2

Method 501.5

High Temperature

+55°C, 4 hours, ±3°C

Procedure 2

Method 507.5

Humidity

85%-95% RH without condensation, 24 hours/ cycle, conduct 10 cycles.

Method 514.6

Vibration

5-500Hz, Vertical 2.20Grms, 40mins x 3axis.

Method 516.6

Shock

20 Grms, 11ms, 3 axes.

MIL-STD-810 Specifications (None-Operating)

Method 502.5

Low Temperature Storage

 

-33°C, 4 hours, change rate:≦20°C/ Hour

-15°C, 72hours (By request)

Procedure 1

Method 501.5

High Temperature Storage

+71°C, 4 hours, change rate:≦20°C/ Hour

+63°C, 240 hours (By request)

Procedure 1

Method 514.6

Vibration

5-500Hz, Vertical 2.20Grms, 40mins x 3axis.

Method 516.6

Shock

20 Grms, 11ms, 3 axes.

MIL-STD-461 Test
Conducted Emissions CE102 basic curve 10kHz – 30MHz
Power Leads
Conducted Emissions RE102-4 1.5HMz - 30MHz – 5GHz
Electric Field
Radiated Susceptibility RS103 1.5 MHz – 3GHz, 50 V/m equal for all frequencies
2MHz – 80MHz, 50 V/m equal for all frequencies
Electric Field 80MHz – 3GHz, 50 V/m equal for all frequencies
3GHz – 5GHz, 50 V/m equal for all frequencies
Electrostatic Discharge EN 61000-4-2 Air DISCHARGE: 8 Kv, Contact discharge : 6kV
Electromagnetic compatibility EN61000-4-4 Signal and DC Net: 1 kV
Electromagnetic compatibility EN61000-4-5 Lead vs. ground potential 1Kv, ignal und DC Net: 1 kV
Radio disturbance EN55022 Class A
Electromagnetic compatibility EN61000-4-3 10V/m
Electromagnetic compatibility EN 61000-4-5 Lead vs. ground potential 1Kv, ignal und DC Net: 0.5 kV
Designed to Meet Items ( Options )
CS101, CS114, CS115, CS116
CE106, RE103, RS101  
MIL-STD-1275 Steady State 20V-33V
  Surge Low 18V/500ms
  Surge High 100V/500ms