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AV700 - Mission Computer with Intel 6th Gen and MIL-DTL 38999 Connectors

MIL-STD Fanless Rugged Computer with Intel® Core™i7-6822EQ Processor, IP65 protection, MIL-STD D38999 Connectors, 9V to 36V DC-in, Wide Temp. -40°C to +70°C

  • Design for reliability under demanding MIL-STD-810G Thermal, Shock, Vibration, Humidity
  • MIL-STD 461F/704F/1275E compliant by request
  • Intel®Core™ i7-6822EQ Processor 
  • Up To 32GB DDR4 Memory
  • 1 x VGA, 2 x Gigabit Ethernet,2 x USB, 2 x COM
  • Rugged MIL-DTL-38999 connectors
  • 9V~36V DC-in
  • Optional military-grade DC/DC 12-40V DC-In (Compliant with MIL461/1275/704)
  • Extended Temperature -40°C to +70°C
  • Available GPGPU on PCI Express x16 Gen3
  • Technical Profile
  • Specifications
  • Thermal Solution

 Introduction

AV700 is driven by Intel 6th generation Skylake-H i7-6822EQ Processor soldering onboard which is an extremely compact Core I-based fanless rugged system. Skylake-H processor supports outstanding CPU and graphics performance, providing 4 cores 2.8GHz clock speed while consuming low power consumption 25W. AV700 highlight on its rugged design and high functionality, the system especially installed MIL-STD Amphenol type connector and full IP65 protection allow system withstand in any kind of harsh environment. AV700 supports extended temperature from -40°C to 70°C and wide range 9V~36V DC input (optional MIL-STD-1275/704/461 Power supply) can protect system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself.

NEW_STYLE_products_AV710_03NEW_STYLE_products_AV710_03

CPU Full Speed over Wide Range Temperature

Intel 6th generation Skylake-H series processors are primarily targeted towards ultimate mobile performance, mobile workstations, and performance embedded devices. Featuring 64-bit dual-core SoC , Skylake-H series processors improve cost, power consumption, and heat dissipation, which are desirable for embedded systems. Thus, equipped with Intel® Skylake-H i7-6822EQ , AV700 provides leading performance while cosuming lower power. In addition, STACKRACK’s patented thermal dissipation design ensures CPU to run at full speed under extended temperature ranging from -40 to 70°C.

 

Patented Thermal Solution

STACKRACK designs a unique enclosure that is able to stack together both horizontally and vertically. The aluminum heat sink enclosure of AV700 secures top heat dissipation. It’s well-known that fanless method relies heavily on the precise calculation of the efficiency of each heat dissipating component. STACKRACK exclusively adopts special heat radiating material and combining with special CNC cutting, further forged into a lavish sophisticated metal. Superior fanless design guarantees silent operation that enhances the flexibility of mobility and prevents the intrusion of dust and debris. Achieving ultimate reliability and stability, AV700 can operate under extended temperature ranging from -40 to 70°C.

 

Full IP65 Anti-water / dust protection

AV700 has complete resistance to dust and water, making it even more ruggedized and reliable. With the water and dust protection up to IP65 rating, AV700 can stand against the intrusion of dust, accidental contact, and water. Not just commercial grade waterproof and dustproof, it can reach Dust Tight level, which guarantees complete protection against ingression. Even the strong power of water jet won't pose a threat to it, , which means it’s true ruggedness embodied.

 

Rugged D38999 Series connectors

MIL-DTL-38999 is a high-performance cylindrical connector family designed to withstand the extreme shock, exposure and vibration that are commonplace in Defense and aerospace applications. D38999 connectors are lightweight and can stand up to environmental challenges. Made with removable crimp or fixed hermetic solder contacts, these connectors provide high-vibration characteristics and are suitable for severe wind and moisture problem areas. Equipped with MIL-38999 4/10/22 pin connectors TV07RW-11-54P, TV07RW-13-98S, and TV07RW-13-35S, AV700 is undoubtedly durable and ruggedized enough despite operating in the harsh environment.

 

Video over Ethernet

Power over Ethernet (POE) is a technology that lets network cables carry electrical power. For instance, a digital security camera normally requires two connections—a network and a power connection with isolated cables. However, a POE technology only needs one network cable, which can get network connection while carrying electrical power. Without being tethered to an electrical outlet, devices can be located wherever they are needed most, and repositioned easily if required. To meet our customers’ needs, AV700 offers optional POE delivery on D38999 connectors, which are extremely reliable and useful in outdoor applications.

 

System main board: SK513

AV700 is based on SK513, powered by Intel® 6th Gen Core™i7-6822EQ Processor and chipset QM170 soldering onboard. SK513 can be customized with upgradeable CPU,GPU in order to have more flexibility and be more user-friendly. SK513 is designed to fulfill demands of different applications, such as defense, marine navigation and aviation technology.

1. MXM graphics card

As a COM Express® Type 6 Carrier Board, SK513 provides a smooth transition path from legacy interfaces to modern differential signals. This includes DisplayPort, PCI Express®, USB 3.0 and Serial ATA. What’s more it supports different expansions, including Mobile PCI eXpress Module graphics card. MXM is a graphic module standard proposed by NVIDIA to enable the GPU of a mobile computer to be upgraded as easily as it is on desktop systems. It means our customers can get better GPU performance to stand out in the ever-changing world by replacing GPU without difficulties.

2. Wide Range DC Power Input

AV700 features wide range DC power input. Ranging from 9V to 36V, AV700 can operate normally despite sudden drop or surge of power. Thus, with this outstanding system, our customers don’t need to worry about the possible lightning strike while executing critical missions.

Operating Temp.
-40°C ~ 70°C
System
CPU Intel® Core™ Skylake-H Processor
Intel® Core™i7-6822EQ Processor (2.8GHz, 4 cores, 8 threads)
Memory Type 2 x SODIMMs up to 32GB DDR4 2133MHz SDRAM
Expansion Slot 1 x mPCIe (1 with mSATA supported)
Storage Device 1 x 2.5" SATAIII up to 4TB
Ethernet Chipset 1 x Intel® I210-IT
1 x Intel® I219-LM
Front I/O
Power Button Water Resistive Power Button with LED Backlight
DC-IN 1 (Amphenol TV07RW-11-54P)
Ground Screw 1 x M4 Screw
Rear I/O
X1 1 x LAN (Amphenol TV07RW-13-98S)
X2 1 x LAN (Amphenol TV07RW-13-98S)
X3 2 x USB (Amphenol TV07RW-13-98S)
X4 2 x COM (Amphenol TV07RW-13-35S)
X5 1 x VGA (Amphenol TV07RW-13-98S)
Display
Graphics Processor Intel® HD Graphics 530
Resolution Up to 1920x1080@60Hz 32bpp
OS support list
Windows Windows 10 64bit
Linux Ubuntu14.04, Fedora 20/23, RedHat Linux EL 7.1/7.2
Mechanical and Environment
Power Requirement Standard: 9V to 36V DC-in
Optional: MIL-STD-1275, MIL-STD 704 and DO-160 power supply ,
12 to 40V (150W max)
Dimension 230 x 83 x 280mm (9.06" x 3.27" x 11.02")
Ingress Protection IP65
Weight 6.0 kg
Operating Temp. -40°C to 70°C (ambient with air flow)
Storage Temp. -40°C to 85°C
Relative Humidity 5% to 95%, non-condensing
Test Standard
MIL-STD-810G Test Method 507.5, Procedure II (Temperature & Humidity)
Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6 Shock-Procedure I Operating (Mechanical Shock)
Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)
Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)
EMC compliance MIL-STD-461E :
CE102 basic curve, 10kHz - 30 MHz
RE102-4, (1.5 MHz) -30 MHz - 5 GHz
RS103, 1.5 MHz - 5 GHz, 50 V/m equal for all frequencies
EN 61000-4-2: Air discharge: 8 kV, Contact discharge: 6kV
EN 61000-4-4: Signal and DC-Net: 1 kV
EN 61000-4-5: Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV
EN 61000-4-2: Air discharge: 8 kV, Contact discharge: 6kV
EN 61000-4-4: Signal and DC-Net: 1 kV
EN 61000-4-5: Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV
EN 61000-4-2: Air discharge: 8 kV, Contact discharge: 6kV
EN 61000-4-4: Signal and DC-Net: 1 kV
EN 61000-4-5: Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV
EN 55022, class A
EN 61000-4-3: 10V/m
CE and FCC
Green Product RoHS, WEEE compliance

 

Patented Thermal Solution
STACKRACK designs a unique enclosure that is able to stack together both horizontally and vertically. The aluminum heat sink enclosure of AV700 secures top heat dissipation. It’s well-known that fanless method relies heavily on the precise calculation of the efficiency of each heat dissipating component. STACKRACK exclusively adopts special heat radiating material and combining with special CNC cutting, further forged into a lavish sophisticated metal. Superior fanless design guarantees silent operation that enhances the flexibility of mobility and prevents the intrusion of dust and debris. Achieving ultimate reliability and stability, AV700 can operate under extended temperature ranging from -40 to 70°C.

AV710_internal thermal configuration