THOR100 - Amphenol M12 Connectors Mission Computer
MIL-STD IP65 Rugged System with Intel® Core™ i7-5650U Broadwell Processor, 9V to 36V DC-in, Wide Temp. -40°C to 70°C
- Intel® Broadwell BGA i7-5650U (2 cores x 2.2GHz, 15W)
- 2 x DDR3L XR-DIMM up to 16GB
- 64GB Onboard SATAIII SSD
- Amphenol M12 connector applied
- IP65 classify
- Wide range 9V to 36V DC-in
- Extended operating temperature. -40°C to 70°C
Download
- Technical Profile
- Specifications
- CPU Performance
- SSD Performance
- Thermal Solution
Introduction
THOR100 is driven by Intel 5th generation Broadwell i7-5650U processor soldering onboard which is an extremely compact Core I-based fanless rugged system. Broadwell processor supports outstanding CPU and graphics performance, providing dual cores 3.2GHz clock speed while consuming low power consumption 9.5W. THOR100 highlight on its rugged design and high functionality, the system especially installed MIL-STD Amphenol type connector and full IP65 protection allow system withstand in any kind of harsh environment. THOR100-CI supports extended temperature from -40 to 70°C and wide range 9V~36V DC input can protect system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself.
- System main board: EPIC OXY5638B SBC
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1. Intel Broadwell Core i7-5650U on board
THOR100 is based EPIC OXY5638B, powered by on Intel Broadwell Core i7-5650U and 64GB SSD on board. With CPU and SSD soldering onboard, there is less conduction of heat and high-density interconnection between the motherboard and the components, which reduces the motherboard from the crisis of overheating.
2. Wide voltage power input 9V~36V
To withstand under any kinds of application challenges, system with wide range designed is brings maximum reliability and stability. Wide voltage power input design (9~36V) can protect the system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself.
System |
|
|---|---|
| CPU | Intel® Core™ Broadwell-U Processor Intel® Core™ i5-5350U Processor (2C x 1.8/2.9 GHz), 3M Cache (15W) Intel® Core™ i7-5650U Processor (2C x 2.2/3.1 GHz), 4M Cache (15W) |
| Memory Type | 2 x XR-DIMM up to 16 GB |
| Expansion Slot | 1 x mPCIe with mSATA supported |
| Storage Device | 1 x 2.5" HDD/SSD tray |
| Ethernet Chipset | 1 x Intel® I210-IT 1 x Intel® I218-LM |
Front I/O |
|
| Power Button | Water Resistive Power Button with LED Backlight |
| X1 (COM) | 12-Pin A-code Female M12 Connector (Amphenol M12A-12PMMS-SF8001) |
| X2 (VGA) | 12-Pin A-code Female M12 Connector (Amphenol M12A-12PMMS-SF8001) |
| X3 (LAN) | 8-Pin A-code Female M12 Connector (Amphenol M12S-04BFFB-SL7001) |
| X4 (LAN) | 8-Pin A-code Female M12 Connector (Amphenol M12S-04BFFB-SL7001) |
| X5 (USB 2.0 x2) | 8-Pin A-code Female M12 Connector (Amphenol M12S-04BFFB-SL7001) |
Rear I/O |
|
| Gound Screw | 1 |
| DC-in | 4-Pin S-code Male M12 Connector (Amphenol M12S-04PMMS-SF8001) |
Display |
|
| Display Interface | VGA interface: 12-pin A-code M12 connectors(female); resolution up to 1920 x 1080@60 Hz |
| Graphics Controller | Intel® HD Graphics 6000 |
OS support list |
|
| Windows | Windows 8 x32/x64、Windows 8.1 x32/x64、Windows 10 x32/x64 |
| Linux | Fedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04 |
Mechanical and Environment |
|
| Power Requirement | 9V to 36V DC-in, AT/ATX mode |
| Dimension | 220 x 380 x 44 mm |
| Ingress Protection | IP65 |
| Weight | 5.5 kg |
| Operating Temp. | -40°C to 70°C (ambient with air flow) |
| Storage Temp. | -40°C to 85°C |
| Relative Humidity | 5% to 95%, non-condensing |
Test Standard |
|
| MIL-STD-810G Test | Method 507.5, Procedure II (Temperature & Humidity) Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock) Method 516.6 Shock-Procedure I Operating (Mechanical Shock) Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration) Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) |
| EMC | CE, FCC compliant |
| Green Product | RoHS, WEEE compliance |
The THOR100 offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers' extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.
| Device Model | THOR100 |
| Tester | Ian Huang |
| Test Result | Pass |
| Test Temperature | High 0°C~70°C / Low -40°C~0°C |
| Test Time | 15 Hours / 3 Hours |
| Test Standard | Reference IEC60068-2 |
| Test Software | Burnin test v6.0 |
| Criteria | After testing, system can't halt. |
- Test Configuration
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Device
Configuration
CPU Type
Intel® Core™ i7-5650U Processor 3.20 GHz
Memory DIMM
Swissbit 4GB EP3L SLV04G64A1BB1SA-DCRT
LAN1
Intel® I210 Gigabit Network
LAN2
Intel® I210 Gigabit Network
Test Software
Burnin test v7.1、AS SSD、
Intel Extreme Tuning Utility、iperfChamber
KSON THS-b4t-150
- Thermal Measurement
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STACKRACK provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus STACKRACK conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, STACKRACK is able to analyses the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 12.5 hours which at each temperature point we burn in THOR100 for two hours, from +40 to +70°C.
THOR100 MB HeatSink - IO Performance
Point -40°C 25°C 40°C 45°C 50°C 55°C 60°C 65°C 70°C CPU T-J 0 70 82 89 93 100 103 104 104 CPU Die -28.1 55.1 58.3 63.4 69.1 74.4 79.9 83.3 86.3 Heatsink -33.6 48.1 52.3 57.3 62.3 68.2 73.4 78.3 82.5 Δ1=(TJ-Die) 28.1 14.9 23.7 25.6 23.9 25.6 23.1 20.7 17.7 Δ2=(Die-HeatSink) 5.5 7.0 6.0 6.1 6.8 6.2 6.5 5.0 3.8 CPU Frenquency (GHz) 3.00 3.00 3.00 3.00 3.02 2.82 2.8 2.55 2.19
Test Result
Innodisk SSD 64GB (Read) MB/s
Innodisk SSD 64GB (Write) MB/s
Apacer SSD 256GB (Read) MB/s
Apacer SSD 256GB (Write) MB/s
THOR100 MB HeatSink - IO Performance
| Point | -40°C | 25°C | 40°C | 45°C | 50°C | 55°C | 60°C | 65°C | 70°C |
| Innodisk 64GB SSD (Read) | 217.35 | 216.64 | 193.77 | 219.71 | 219.83 | 195.13 | 223.32 | 220.43 | 212.68 |
| Innodisk 64GB SSD (Write) | 42.5 | 38.37 | 45.67 | 40.74 | 44.35 | 56.51 | 39.34 | 38.99 | 37.56 |
| Apacer 256G SSD (Read) | 291.52 | 291.42 | 291.62 | 290.27 | 291.71 | 291.16 | 291.35 | 290.61 | 280.4 |
| Apacer 256G SSD (Write) | 401.35 | 408.02 | 403.91 | 406.17 | 403.92 | 408.47 | 405.52 | 393.58 | 386.54 |
Effective cooling solution for maximum heat dissipation:
STACKRACK implements unique cooling solution with copper heat spreader, pure copper heat pipe and aluminum heat sink for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of copper and aluminum, the copper heat spreader touches the heat source - processor to absorbs the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, THOR100 can ensure high reliability and stability while working under wide range temperature from -40°C to 70°C
Patent Designed Aluminum Heat Sink
The heat sink is made by heat radiating material, which is aim to Lowering the temperature by dissipating heat into the surrounding air. Aluminum material AL6063, 39 mm height and weighs 3300 g
Pure Copper Heat Pipe
The heat pipes are embedded in the heat sink to ensure 100% tight integration for superior heat dissipation. Copper heat pipe transfers heat from the heat sources CPU to the heat sink over relatively long distance. Two-phase heat transfer involves the liquid-vapor phase change of a working fluid. 8.0 mm diameter heat pipe, 99.9% purity of copper High heat conductivity coefficient up to 5000
Copper Heat spreader
Copper heat spreader directly touches the heat source area, which can absorb heat rapidly and transfer to heat pipe and allow the high efficiency heat pipe further bring out heat to upper heat sink enclosure, 99.9% purity of copper
Rugged SBC
Rugged Intel Broadwell SBC is installed in the middle of the system, dividing segmentation type thermal design into upper and lower module.
Amphenol M12 Type
THOR100 all applied by rugged M12 type connectors. A waterproof power button is also incorporated for comprehensive military grade I/O protection.
• Fieldwireable M12 connectors boast its convenience in reduction in wiring time. No extra tools are required for extra secure connection.
• M12 connectors highlight on robust joint, compact size, and reliability. Screw lock mechanism pushes security and reliability to the extreme.
Aluminum Heat Sink
The heat sink is made by heat radiating material, Which is aim to lowering the temperature by dissipating heat into the surrounding air. Aluminum material AL6063, 5 mm height