SR10-SCH-X2 - Intel® Core i7 Microgrid Computer

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Intel® Core™ i7 Skylake Processor Fanless Rugged System 9V to 36V DC-in, Extended Temp. -40°C~60°C

  • Design for reliability under demanding
  • MIL-STD-810G Thermal conditions
  • 6th Gen Intel®Core™ i7 Skylake processor (BGA)
  • Memory Up to DDR4 32GB
  • Onboard uSSD SATAIII 64 GB
  • Multi-Displays by 2 x DP, 1 x DVI-I
  • 4 x USB 3.0, 1 x COM ( RS232/422/485 )
  • 1 x Line-out / MIC-in
  • 9V~36V DC-in
  • Extended Temperature -40°C to 60 °C
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  • Technical Profile
  • Specifications
  • CPU Performance
  • SSD Performance
  • Certification

 Introduction

SR10-SCHX2, which is based on EBX SBC OXY5739A, powered by Intel Skylake i7-6820EQ quad core processor plus QM170 chipset soldered onboard. With CPU soldering onboard, there is less conduction of heat and high density interconnection between the motherboard and the components, which reduces the MB from the crisis of overheating. Apart from overheating, soldering onboard also provides the best level of shock and vibration protection, removing the unnecessary concern about poor connection that CPU socket type may bring. OXY5739A can take the advantages of key components soldering onboard and extended operating temperature from -40 to 85℃ to ensure ultimate durability, utmost resistance to shock & vibration.



SR10-SCHX2 highlights its 6th Generation Skylake Core™ i7 Fanless System with optional easy accessible with SSD storage tray, rugged XR-DIMM RAM, rich I/O with 4 USB 3.0, 1 Com Port (optional with 4 Com Ports), 2 LANs (optional with 4 LANs) and 3 Video outputs. SR10-SCHX2 can operate effectively in harsh environment under temp range from -40 to 70°C and is a perfect solution for military, transportation, factory automation and digital signage applications.

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Wide Range DC input

For military and heavy duty vehicle applications, instable voltage always brings headaches about damaging the electric components. SR10-SCHX2 could supporting 9V to 36V DC-in, the flexible acceptance of inconsistent power input makes it capable of surviving tough engine cranks and transient over-voltage situations.

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Advanced Thermal Technology and Rapid Heat-Dissipation

SR10-SCHX2's thermal solution designed with copper plus aluminum heat sink and 4 copper vacuum tube liquid-vapors (Heat-Pipe) which have high efficiency for heat dissipation. The rugged mechanical structure improves the cooling efficiency to secure SR10-SCHX2 maintains superior computing performance as customers desired.

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MIL-STD-810G Certified

MIL-STD-810 standard is a Military Standard established by United States Department of Defense ( DoD ) considered the utmost principle for military ruggedness request. It provides a series of testing procedures for resistance to water proof, shock, vibration, dust, humidity, and extreme temperatures and SR10-SCHX2 is designed to comply to the series of tests concerning on sustainable in such harsh environment.

System main board: EBX SBC-OXY5739A

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1. Intel® Core i7 CPU soldering onboard

SR10-SCHX2 is based on EBX SBC—OXY5739A, powered by Intel Skylake i7-6820EQ quad core processor plus QM170 chipset soldered onboard. With CPU soldering onboard, there is less conduction of heat and high density interconnection between the motherboard and the components, which reduces the MB from the crisis of overheating. Apart from overheating, soldering onboard also provides the best level of shock and vibration protection, removing the unnecessary concern about poor connection that CPU socket type may bring.

2. Wide Range DC input

For military and heavy duty vehicle applications, instable voltage always brings headaches about damaging the electric components. SR10-SCHX2 supports 9V to 36V DC-in, the flexible acceptance of inconsistent power input makes it capable of surviving tough engine cranks and transient over-voltage situations

Operating Temp
-40°C~60°C 
System
Model SR10-SCHX2
CPU Intel® 6th Gen Core™ i7-6820EQ (Frequency 2.8GHz, Turbo Boost up to 3.5GHz),
Quad-Core, 8 Thread Support, 8MB SmartCache. Build-in HD Graphics 530 for excellent 3D,
Turbo Boost Technology 2.0, VPro and Hyper-Threading support.
Memory 1 x DDR4 XR-DIMM, 1 x DDR4 SO-DIMM Total up to 32 GB
Chipset Intel® QM170 Chipset supporting 6th generation Intel® Core™ processor families.
Expansion Slot 1 x Full-size miniPCIe / mSATA with SIM card holder 1 x Half-size miniPCIe
Display
Display Port Resolution up to 3840 x 2160
DVI-I Resolution up to 1920 x 1200
Storage
mSATA mSATA Solid State Disk ( SSD ) - up to 512GB Capacity.
Rear I/O
DisplayPort 2 x 20Pin External connectors ( Female )
DVI-I 1 x 29Pin DVI-I connector ( Female )
Ethernet 2 x RJ45 Gigabit Ethernet LAN ( Female )
Audio 2 x 3.5mm Audio Jacks ( 1 x MIC, 1 x Line-Out )
Serial Port 1 x DB9 connector ( RS-232 / 422 / 485 )
USB Port 2 x USB3.0 standard-A connectors
DC-IN 1 x 4Pin ugged terminal block
Front I/O
Button Power Button w/cover
Indicator LED Power, HDD, LAN ( Link / Active / Speed )
USB Port 2 x USB3.0 standard-A connectors
Applications, Operating System
Applications 1 x Secure Erase Button ( SSD2 support AES Secure Erase )
1 x Power Switch with Dedicated LED
USB 2 x USB 3.0 Ports
Power Requirement
Power Input MIL-STD-1275, MIL-STD 704 and DO-160 power supply ,12 to 40V ( 150W max )
Applications, Operating System
Applications Commercial and Military Platforms Requiring Compliance to MIL-STD-810G Embedded Computing,
Process Control, Intelligent Automation and manufactur-ing applications where Harsh Temperature,
Shock, Vibration, Altitude, Dust and EMI Conditions.
Operating System Windows 8 , Windows 8.1 , Windows 10
Ubuntu14.04, Ubuntu 16.04
Physical
Dimension ( W x D x H ) 308 x 149 x 58 mm
Weight 2.96 Kg ( 6.52 lbs )
Chassis Aluminum Alloy, Corrosion Resistant.
Finish Anodic aluminum oxide ( Color Iron gray )
Cooling Natural Passive Convection / Conduction. No Moving Parts.
Environmental
Reliability No Moving Parts; Passive Cooling. Designed &
Manufactured using ISO 9001/2000 Certified Quality Program.
EMC CE and FCC compliance
Green Product RoHS, WEEE compliance

 The rugged MIL-STD compliant system, SR10-SCH-X2 is equipped with highly effectively heat conductive and heat convective thermal solutions to meet extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system via 8.0 mm copper heat pipes. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.

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Device Model SR10-SCH-X2
Tester Robin Chang
Test Result Pass
Test Temperature High 0°C~70°C / Low –40°C~0°C
Test Time 8 Hours / 1 Hour
Test Standard Reference IEC60068-2
Test Software Burnin test v8.1
Criteria After testing, system can't halt.

 

Test Configuration

Device

Configuration

Motherboard

OXY5739A

CPU

Intel® Core i7-6820EQ, 2.8Ghz (8MB, 45W)

PCH

Intel QM170 Chipset

RAM1

Inodisk 16GB (SK802) DDR4 2133

RAM2

Inodisk SODIM 16GB DDR4 2133

SATA port

Apacer onboard SSD 64GB

LAN1

Intel(R) i210 Gigabit

LAN2

Intel(R) Ethernet i219-LM

Test software

Burnin test 8.1, CPU-Z,
HW monitor 1.38, AS SSD bench

Chamber

KSON THS-b4t-150, Chipeng SMO-3
Test Configuration
Device Configuration Manufacturer Part Number
Motherboard OXY5739A Perfectron  
CPU Intel® Core i7-6820EQ, 2.8Ghz (8MB, 45W) Intel i7-6820EQ
PCH Intel QM170 Chipset Intel QM170
RAM1 Inodisk 16GB (SK802) DDR4 2133 Innodisk  
RAM2 Inodisk SODIM 16GB DDR4 2133 Innodisk  
SATA port Apacer onboard SSD 64GB Apacer  
LAN1 Intel(R) i210 Gigabit Intel i210
LAN2 Intel(R) Ethernet i219-LM Intel i219
Test software Burnin test 8.1, CPU-Z,
HW monitor 1.38, AS SSD bench		    
Chamber KSON THS-b4t-150, Chipeng SMO-3 KSON Chipeng THS-b4t-150 SMO-3
Thermal Measurement

STACKRACK provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus STACKRACK conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, STACKRACK is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 8 hours which at each temperature point we burn in SR10-SCH-X2 for one hour, from -40 to 70°C.

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SR10-SCH-X2 System - IO Performance

Point -40°C -20°C 0°C 25°C 55°C 60°C 65°C 70°C
CPU T-J 3 18 32 60 71 77 78 85
CPU Die -22.7 -4.7 13.3 53.9 65.9 73.7 77.5 84.5
Heatsink -18.5 -0.5 17.5 57.5 70.2 75.8 76.7 82.2
Δ1=(TJ-Die) 25.7 22.7 18.7 6.1 5.1 3.3 0.5 0.5
Δ2=(Die-Sink) -4.2 -4.2 -4.2 -3.6 -4.3 -2.1 0.8 2.3
CPU Frenquency (GHz) 2.8 2.8 2.8 2.8 1.6 0.8 0.8 0.8

 

 

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​​​​​Test Result

SR10-SCH-X3 64GB SSD ( Read ) MB/s

SR10-SCH-X3 64GB SSD ( Write ) MB/s

SR10-SCH-X2 MB HeatSink - IO Performance

Point -40°C -20°C 0°C 25°C 55°C 60°C 65°C 70°C
64GB SSD ( Read ) MB/s 385 388.2 392.7 372.9 369.5 400.3 399.8 361.7
64GB SSD ( Write ) MB/s 89.8 91.5 92.3 95.62 91.9 96.4 92.6 90.1