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F1-30M - PCIe/104 Airborne Computer System

Core i7 Rugged Military Airborne Computer -

Small Form Factor (SFF) with PCIe/104 Architecture GPUCPU Open Structure


  • Rugged COTS computer with Intel®5th generation Core- i7 processor
  • NVIDIA®GPU GT950M/GTX 1050 Ti supports CUDA 684/CUDA 768 independent displays by 4 x DP
  • Modular rugged chassis with stackable PCIe/104 I/O card expansion.
  • 28V DC MIL-STD-1275/704 Power supply with Voltage transient protections
  • Design for reliability under demanding MIL-STD-810G/461F Thermal Shock, Vibration, Humidity/EMI/EMC conditions
  • Rugged IP65 aluminum chassis with Amphenol MIL-DTL-38999 connectors or M12 Phoenix Contact
  • Operating temperature range : -40°C to +75°C
  • Technical Profile
  • Specifications
  • Thermal Solution


The purpose of PCIe/104 is to provide a System level Stack-Up Only approach. Specification adopts PCI-Express, Ethernet, SATA, USB as well as LPC, SPI, Field Buses and Common Power Connector to the any stacked architecture.

StackPC Specification defines StackPC, FPE, StackPWR connectors relative position and stacked systems organization common approach. Also specification describes using stack modules in COM applications.

Specification is targeted not only for traditional stackable systems with all boards of the same form factor, but also for other stackable architectures like COM applications (mezzanine Computer-On-Module in conjunction with base board) and SBC expansion (expansion bus for Single Board Computers of various form factors).

PCI Express was chosen because of its performance, scalability and wide market acceptance. Ethernet was chosen as the most popular long distance data interconnect, which is inevitable in modern computer based environments. SATA was chosen as the storage interconnect because of wide acceptance and bandwidth scalability. LPC bus, SPI and other signaling interfaces were chosen because of their capabilities to provide support for legacy devices and to expand host processor functionality in simple and cost effective way.

Avionics Modular PCIe/104 Computer

Additionally specification describes adoption StackPC to popular standards such as PC/104, 3.5 inch, EPIC and EBX. This adoption is as result of StackPC and PCIe/104 compatibility with Bank1 signals (same connector and similar pinout).

StackPC specification is designed to deal with challenges caused by modern point-to-point high speed serial interfaces to stackable architecture which used to rely on traditional parallel bus interfaces. New specification is suitable for using for SBC expansion and fully opens Computer On Module like area of applications. It also paves the way for using even higher speed interfaces which are just emerging on embedded arena.

Compared to past years systems, modern embedded solutions require support for greater number of input/output interfaces. With each year, new processor modules support more and more input/output interfaces integrated in system logic. This makes necessary to place additional interface connectors on processor and peripheral modules. Compactness of Small Form Factor modules is an impediment to placement of necessary components and sufficient number of input/output connectors. It should be noted, that stackable modules are mostly designed for harsh environments and require installation inside an enclosure to protect them from mechanical impact or corrosive substances. Hence, embedded systems manufacturers have to resort to various tricks to bring out all interfaces to connectors on the front panel of the enclosure using flat cables.

One of the solutions can be to aggregate the main set of input/output interfaces at the stack connectors. This allows to avoid some interface connectors (usually pin headers) and to provide more space on the module for placement of necessary components. This, in turn, leads to reduction of manufacturing cost and adds flexibility in terms of using the module in applications requiring limited functionality. Reducing cabling inside the enclosure improves convection, reduces magnetic noise pickup, and consequently, increases system effectiveness. Interfaces aggregated at the stack connectors can be led out of the enclosure using inexpensive and efficient solution – terminal interface module carrying the necessary set of standard interface connectors.

One of rather important requirements to the new specification is compatibility with family of PC/104 standards. The support for existing and field proven PC/104, PC/104-Plus, PCI/104, PCIe/104 and PCI/104-Express modules is provided. Details about compatibility between StackPC and PC/104 standards can be found in Appendix B.





StackPC construction example:

SK509: Multi-I/O interface

SK401: 2.5” SSD/mSATA

SK506: 4 x GbE

SK210: Nvdia GT730M

OXY5535B: Intel Core i7/onboard 32GB SSD/XR-DIMM 8GB

SK704: 9-36V DC-in

NVIDIA 730M GPU ModulePCIe/104 Storage Expansion Module

Connectors M12


During transport or in the field, unoccupied plug-in connections must be protected or closed. The screw plugs, sealing caps and closing caps made of plastic or metal are suitable for this purpose. IP65/IP67 protection as well as IP69 protection is thereby achieved.

Sealing elements with holding band or fixing chain

All IP67 interfaces can be closed tightly using the screw plugs and sealing caps in sizing M12. The holding bands are fastened on the cable or the hosing and are thus held captive. The M12 metal protective cap with fixing chain is suitable for all pin versions. It is used in harsh industrial environments or for EMC applications.

Assembly tools for actuator cables

To achieve tight plug-in connections, we recommend using assembly tools. M12 circular plug-in connectors can be assembled using a torque screwdriver and plug attachment. The benefits of the plug attachment become particularly clear when connecting the connectors to the distributor boxes. It enables quick adjustment and installation even when space is at a premium. The version for M12 connectors with hexagonal stainless steel knurl is also made from stainless steel, hence this prevents the connector knurls form being contaminated by corrosive materials. For greater flexibility, screwdrivers with adjustable torque are also available. When used in conjunction with the adapter insert, they can also be used to accommodate the available plug attachments.


M25 MIL-DTL 38999


MIL-Qualified to MIL-DTL-38999 Connector offers a lightweight, corrosion resistant connector with the same high performance features as its metal counterpart. The Composite Tri-Start Connector also includes the following features:

• Lightweight - 17% – 70% weight savings(17–40% weight savings vs. Aluminum)

(60–70% weight savings vs. Stainless steel)See Composite weight comparison chart on page 23.

• Corrosion Resistance - available in standardMIL-DTL-38999 olive drab cadmium (-65°C to 175°C) and electroless nickel plating (-65°C to 200°C), both withstanding 2000 hours of salt spray exposure. The base material is able to withstand an indefinite exposure to salt spray.

• Durability - 1500 couplings minimum (in reference to connector couplings, not contacts)

• Extended Life Contact - Mil-approved plating process which provides 1500 couplings minimum

• Qualified to BACC63CT and BACC63CU specifications


PCIe/104 & StackPC Peripherals


  • StackPC and PCIe/104 Complaint
  • Utilizes PCIe x 8 and x 4 Link
  • NVIDIA CUDA technology
  • OpenGL 4.4 support
  • OCL 1.1 support
  • NVIDIA Adaptive Vertical Sync
  • Microsoft DirectX 11 support


  • StackPC-FPE form factor
  • Utilizes PCIe x16 and PCIe x4, x1 link
  • MXM 3.0 and 3.1 graphic card support
  • Type A and Type B MXM graphic card and support
  • Operating Temp: -40°C ~ 85°C



  • PCI/104-Express, PCI & PCIe connectors (w/StackPC design)
  • PCIe/104 stackable bus structure
  • PCIe to PCI adapter function
  • COM: 4 x RS232/422/485 with 5V/12V selectable and isolation function
  • Extended Temp.: -40°C ~ 85°C



  • StackPC form factor
  • PCIe/104 stackable bus structure
  • Supports 1 x 2.5” SSD
  • Supports 2 x mSATA SSD slot, compatible with JEDEC MO-300B
  • SATAII interface supports 1.5Gbps/3.0Gbps •Reserve PCI/104 connector for different stacking criteria
  • Extended temperature -40 to 85°C



  • StackPC-FPE form factor
  • PCIe/104 stackable bus structure
  • Reliable Ethernet technology from Intel i350-AM4 controllers
  • total 6 independent LAN connections (2 from host board, 4 from Intel controllers)
  • Flexible options for Ethernets through RJ45 or 10 pin-headers
  • High-performing bridgeless design supporting PCI Express Gen 2.1 5GT/s
  • Extended temperature -40 to 85°C




General Information
Model F1-30
CPU Type Intel® 5th generation Core™ i7 Processor
System Chipset Intel® i7-5650U (4M Cache, up to 3.20 GHz)
Memory type 2 x DDR3 1333/1600MHz XR-DIMM Up to 16GB
HDD/SDD support On Board 64GB Nano SSD

1 x 2.5" SSD

2 x mSATA SSD backup storage

I/O Connectors
Type A (Amphenol D38999 Connectors) Power button 1 x Waterproof Button with Backlight
DP 4
Ethernet 2
USB 2.0 2
DC-in 1
Type B (Phoenix Contact M12 Connectors) Power button 1 x Waterproof Button with Backlight
DP 4
Ethernet 2
USB 2.0 4
DC-in 1
Housing Aluminum
Weight 16 Kg (35.24 lb)
Ingress Protection IP65
Dimension (W x H x D) 189.5 x 230 x 318 mm
Power Requirement
Input Voltage

10V to 40V DC
(Compliant with MIL-STD-1275/704/461)

Optional 9V~36V DC Input

Environment Limits
Operating temperature -40°C to 75°C
Storage temperature -40°C to 85°C 
Relative Humidity Up to 95%RH @40°C, non-condensing
Ingress Protection Designed for compliance to IP65, MIL-STD-810G
Test Standard
EMI/EMC Designed to meet MIL-STD-461F
Temperature Designed to meet MIL-STD-810G
Vibration & Shock Designed to meet MIL-STD-810G
Stackable Module
SK210 Graphic module with NVIDIA 950M/1050Ti GPU supports four DP output
SK220 MXM graphic card carrier supports six miniDP output
SK303 COM port module with total four COM ports (RS232/422/485 selectable)
SK401 Carrier with one 2.5" HDD/SSD socket and 2x mPCI/e Expansions
SK506 Ethernet module with total six 10/100/1000 mbps ethernet connections

Patented Thermal Architecture

STACKRACK, being the master of advanced thermal design, has once again achieved fanless design through conduction cooling method. With each layer comes a heat plate to touch directly the heated parts, the thermal performance is of the highest level.


F1-30 機板拉線圖


NVIDIA GeForce® GT730M StackPC/PCIe104 Graphic Module, Supports Four DP outputs and 3+ Years Longevity Supply

SK210-GT730M is a high-end PCIe/104 (StackPC) graphic module featuring NVIDIA® GPU GT730M, which provides GPU clock up to 719 MHz, CUDA 384 cores and supports four independent display ports output (up to three 1080P full HD). With the excellent graphic processing ability, it equipped with 1024MB DDR3 memory so to present advanced graphic computing for multi-display, high-end graphic applications such as central room signage, high-end digital signage, navigation, defence and more.



Intel® 5th Gen. Broadwell ® Core™ i7-5650U processors , 16GB DDR3L, uSSD 64GB on board , PCIe/104 expansion, Extended Temperature -40 to 85°C

OXY5638B, a powerful rugged EPIC SBC is driven by Intel® Broadwell processor i3-5010U, i5-5350U and i7-5650U soldering onboard. Broadwell processors support outstanding graphics and CPU performance, providing quad cores 3.20GHz clock speed while consuming low power consumption. The powerful combination makes the SBC with high computing power for multi-tasking while reducing idle power consumption. OXY5638B is regarded as a rich-featured board that can be applied to cater various I/O requirements. Mission-critical applications can take the advantages of processors soldering onboard and extended operating temperature from -40 to 85°C to ensure ultimate durability, utmost resistance to shock & vibration. OXY5638B is truly a rugged SBC ideal for building rugged tablet, entry-level automation and railway infotainment applications. The Intel Core i7-5650U is an ULV (ultra low voltage) dual-core processor based on the Broadwell architecture, which has been launched in January 2015. In addition to two CPU cores with Hyper-Threading clocked at 2.2 - 3.2 GHz (2 Cores: 3.1 GHz), the chip also integrates an HD Graphics 6000 GPU and a dual-channel LPDDR3-1866/DDR3L-1600 memory controller. The Core i7 is manufactured in a 14 nm process with FinFET transistors.
Compared to the Core i7-5600U, the i7-5650U features a lower CPU base clock, but integrates a somewhat faster GPU.

PCIe/104 Modular Computer