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Ultra Short Depth Rugged SFF 1U/2 Military Computer

  • Ultra Short Depth 200mm 1U Half Rugged Computer
  • Intel® 11th Tiger Lake (U) i7-1185G7E
  • Up to DDR4-32GB
  • 1 x NVMe SSD up to 2TB
  • Anti-Vibration up to 10 Grms, Shock 75G
  • IP65 Classified 
  • MIL-STD-461 EMI Filter DC-DC 18V~36V 
  • Extended operating temperature: -40°C to +70°C
  • Size : 220 x 200 x 44 mm (WxDxH)

 Intel Gold

  • Technical Profile
  • Specifications
  • CPU Performance

THOR100S-X11 is driven by Intel 11th generation Tiger Lake-up3 i7-1185G7E processor soldering onboard which is an extremely compact Core I-based fanless rugged system. Tiger Lake-up3 processor supports outstanding CPU and graphics performance, providing quad cores 4.4GHz clock speed while consuming low power consumption 12W and Max. 28W. THOR100S-X11 highlight on its rugged design and high functionality, the system especially installed MIL-STD Amphenol type but a D38999 mini DP connector and full IP65 protection allow system withstand in any kind of harsh environment. THOR100-X11 supports extended temperature from -40 to 70°C and MIL-STD-461 power wide range 18V~36V DC input can protect system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself.

thor100S X11

 Ultra - Slim Rugged SFF 1U/2 Military Computer

Robust Product Design Ready For Military Application






Intel® Core™ i7-1185G7E Processor (4 Core/ 8 Threads, 12M Cache up to 4.40 GHz), 15W/28W

Memory Type

DDR4 3200MHz / 1 x 260-pin SO-DIMM/Max.32GB (Non-ECC)

Expansion Slot

1 x M.2 2230 E-key (Wifi & BT, PCIe/USB)

1 x M.2 2242/2260/2280/3042/3052 B-key

(Storage/5G/LTE, USB2.0/PCIe x 1/SATAIII)



Intel® Iris Xe Graphics

Mini DP

Up to 5120 x 3200 @60Hz



1 x NVMe SDD - Up to 2TB Capacity



Intel® I219LM Giga LAN+I225LM 2.5G

Front I/O


Water Resistive Power Button with dual-color LED Backlight

X1 (Mini DP)

Mini DP connector (Amphenol MDPFTV7AZNF312 2D-45)

X2 (2 x LAN)

12-Pin A-code Female M12 Connector (Amphenol M12A-12PMMS-SF8001)

X3 (1 x USB2.0 + 1 x RS232/422/485)

8-Pin A-code Female M12 Connector (Amphenol M12S-04BFFB-SL7001)

X3 (1 x USB2.0 + 1 x RS232/422/485)

8-Pin A-code Female M12 Connector (Amphenol M12S-04BFFB-SL7001)


4-Pin S-code Male M12 Connector (Amphenol M12S-04PMMS-SF8001)

Rear I/O

Gound Screw


Power Requirement

Power Input

18V~36V DC-IN

Power Type

AT/ATX Mode Select by Jumper

Power Requirement, Operation System


Military Platforms Requiring Compliance to MIL-STD-810

Embedded Computing, Process Control, Intelligent Automation and manufacturing applications where Harsh Temperature, Shock, Vibration, Altitude, Dust and EMI Conditions.

Operating System

Windows® 11 64-bit, Linux(Support by request) 



220 x 200 x 44 mm


2 kg


-40°C to 70°C (ambient with air flow)

Storage Temp.

-40°C to 85°C

Relative Humidity

5% to 95%, non-condensing

Ingress Protection




MIL-STD-461 :

CE102 basic curve, 10kHz - 30 MHz

RE102-4, (1.5 MHz) -30 MHz - 5 GHz

RS103, 1.5 MHz - 5 GHz, 50 V/m equal for all frequencies

EN 61000-4-2: Air discharge: 8 kV, Contact discharge: 6kV

EN 61000-4-3: 10V/m

EN 61000-4-4: Signal and DC-Net: 1 kV

EN 61000-4-5: Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV

CE and FCC


No Moving Parts; Passive Cooling.

Designed & Manufactured using ISO 9001/2000 Certified Quality Program.


CE compliant

Green Product

RoHS, WEEE compliance

Operating Temp.

-40 to 70°C (ambient with air flow)

Storage Temp.

-40 to 85°C

Relative Humidity

5% to 95%, non-condensing.

The THOR100S-X11 offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers' extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.