SCH300 IEC61850-3 IEEE-1613 Cube Fanless Computer for EcoStruxure
IEC-61850-3 , IEEE-1613 Substation Fanless Computer, with Intel® Core™ 9th Gen. Coffeelake-R i7-9700TE Processor, Optional for 10 x PoE Ports, 8 x COM Ports (RS232/422/485) ,Operating Temperature -20~+60°C
- Intel® Core™ i7-9700TE
- 2 x SO-DIMM up to 64GB DDR4-2666MHz
- 2 x 2.5”Easy swap SSD Tray
- 4 x PoE ( Up to 10 PoE for Optional)
- 2 x RJ45 LAN or M12 ( 10 RJ 45 LAN for Optional)
- 4 x USB 3.0, 2 x USB 2.0 ,1 x DP, 1 x DVI
- 6 x COM RS232/422/485 ( 10 COM for Optional)
- 8-bit Isolated Digital I/O (4 x DI, 4 x DO),
- HSR/PRP Dual LAN Card for Optional
- 9V~48V DC-Input
- -20 °C~ +60°C
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- Technical Profile
- Specifications
- CPU Performance
Gateways are rugged communication devices collecting numerous data, such as metering, status, events and fault report from any protection device while sending this information upstream to a control center, transfering commands issued from the control center to other devices. One example of a particular need for gateways is in the energy industry. The energy industry requires specific types of devices using specific protocols. With PLCs/PACs becoming popular in these applications, gateways has grown into a necessary part of Substation Automation Systems, and its reliability may affect the safety of whole system at a station level.
As a leading company specialized in energy related application, 7Starlake’s experienced team designed an extremely reliable Gateway system SCH300. Powered by Intel 9th Gen. Core i7-9700TE processor, SCH300 owns highly efficient processing capability to deal with a large amount of data delivering between IEC-61850 devices and the Control Center. In advantage of other outstanding features, such as 10 x LAN port and 2 x COM (up to 16 DIO by request), SCH300 is an undoubtedly best choice for Gateway application in Substation.
- Equipped with Rugged M12 PoE Connectors
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To support optimal connectivity between the connector and the cable each combination has been matched, M12 PoE Connectors are available for SCH300. Even in extremely rough railway environments, M12 rugged connectors help providing a safe signal transfer. It’s characterized by a reliable 360 degree shielded solution, crimp flange and compact outer dimension, offering a torsion and vibration proof cable strain relief. This reduces cable breakage and makes the system tamper proof.
- Why IEC-61850 Is Necessary
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Although there are lots of protocols worldwide for substation automation, IEC-61850 is the only one that supports systems networked together to perform intelligent transmission and distribution protection, monitoring, automation, metering, and control. The standardization of IEC-61850 enables the integration of the equipment and systems from different suppliers, reducing the burden on the configuration and maintenance of these systems. The protocol also meets utilities’ requirements for long-term system expandability. Thus, there are more and more electric companies perform power-system automation by using IEC-61850 protocol with Intelligent electronic devices (IED).
| Operating Temp. | |
|---|---|
| -40 to 60°C | |
| System | |
| CPU | Intel® Core™ i7-9700TE |
| Memory Type | 2 x SO-DIMM up to 64GB DDR4-2666MHz |
| Expansion Slot | 2 x IO Expansion Slots 1 x MXM 3.1 Slot |
| Storage Device | 2 x 2.5”Easy swap SSD Tray |
| Front I/O | |
| Power Input | DC 9V~48V |
| USB | 4 x USB3.0, 2 x USB2.0 |
| Display | 1 x 20Pin DisplayPort connector (Female), resolution up to 4096x2160@60Hz |
| Ethernet | 2 x RJ45 LAN or M12 (6 or 10 RJ45 LAN for Optional) |
| USB | 2 x USB 2.0 |
| DVI | 1 x DVI |
| COM | 6 x COM RS232/422/485 (2 or 10 COM for Optional) |
| DIO | 8-bit Isolated Digital I/O (4 x DI, 4 x DO |
| TPM | TPM module onboard |
| Optional | |
| HSR/PRP | HSR/PRP Dual LAN Card |
| COM | 10 COM Ports Card |
| PoE | 4x PoE or 4x RJ45 LAN |
| PoE | 4x PoE or 4x M12 LAN |
| OS support list | |
| Windows | Windows 10 64Bit |
| Linux | Ubuntu14.04, Fedora 20/23, RedHat Linux EL 7.1/7.2 |
| Mechanical and Environment | |
| Power Requirement | DC 9V~48V |
| Dimension | 170 x264 x 250 mm ( W x D x H ) |
| Operating Temp. | -20 to 60°C |
| Storage Temp. | -40°C to 85°C |
| Relative Humidity | 5% to 95%, non-condensing |
| Certification | CE, FCC, MIL-STD 810G Compliance |
| System Design | Fanless |
| Mounting | Rackmount Cube |
| Test Standard | |
| MIL-STD-810G Test | Method 507.5, Procedure II (Temperature & Humidity) |
| Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock) | |
| Method 516.6 Shock-Procedure I Operating (Mechanical Shock) | |
| Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration) | |
| Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration) | |
| Method 501.5, Procedure I (Storage/High Temperature) | |
| Method 501.5, Procedure II (Operation/High Temperature) | |
| Method 502.5, Procedure I (Storage/Low Temperature) | |
| Method 502.5, Procedure II (Operation/Low Temperature) | |
| Method 503.5, Procedure I (Temperature shock) | |
| EMC | CE, FCC compliant |
| Green Product | RoHS, WEEE compliance |
| Ordering Information | |
| SCH300 | Cube Fanless Computer for EcoStruxure Computer with Intel. 9th Core i7-9700TE Processor, 2 x RJ45 LAN , RAID 0/1 support, TPM onboard, HSR/PRP for optional, 8 x COM Ports for optional, Wide range 9~48V DC-in, Operating Temperature -20~+60°C |
| SCH300-PO | Cube Fanless Computer for EcoStruxure Computer with Intel. 9th Core i7-9700TE Processor, 4 x PoE , 2 x RJ45 , RAID 0/1 support, TPM onboard, HSR/PRP for optional, 8 x COM Ports for optional, Wide range 9~48V DC-in, Operating Temperature -20~+60°C |
Intel® Core™ i7-9700TE Processor (up to 3.8 GHz, 8 cores)
Thermal Point \ Testing Temp. |
-40°C |
-20°C |
0°C |
+25°C |
+50°C |
+55°C |
+60°C |
|---|---|---|---|---|---|---|---|
|
CPU T-J |
16 |
58 |
68 |
75 |
91 |
||
|
CPU Die |
11.8 |
38.6 |
71.9 |
76 |
81.5 |
||
|
CPU Heat sink |
8.2 |
34.7 |
67.8 |
72 |
77.3 |
||
|
Δ1=(TJ-Die) |
4.7 |
5.0 |
5.0 |
7.0 |
7.0 |
||
|
Δ2=(Die-Heat Sink) |
4.7 |
5.0 |
5.0 |
6.0 |
5.0 |
||
|
CPU Frequency (GHz) |
3.15 | 3.02 |
3.02 |
2.68 |
2.57 |
2.45 |
2.41 |
Intel® Core™ i7-8700T Processor (up to 2.4 GHz, 6 cores)
Thermal Point \ Testing Temp. |
-40°C |
-20°C |
0°C |
+25°C |
+50°C |
+55°C |
+60°C |
|---|---|---|---|---|---|---|---|
|
CPU T-J |
16 |
77 |
95 |
99 |
100 |
||
|
CPU Die |
11.8 |
38.6 |
71.9 |
76 |
81.5 |
||
|
CPU Heat sink |
8.2 |
34.7 |
67.8 |
72 |
77.3 |
||
|
Δ1=(TJ-Die) |
4.7 |
5.0 |
5.0 |
7.0 |
7.0 |
||
|
Δ2=(Die-Heat Sink) |
4.7 |
5.0 |
5.0 |
6.0 |
5.0 |
||
|
CPU Frequency (GHz) |
2.83 | 2.85 |
2.66 |
2.97 |
2.26 |
2.18 |
2.19 |
Intel®i7-8700 Processor( up to 3.2 GHz,6 cores)
Test 50°C with air flow
|
Description |
System Top Sink |
CPU Die |
CPU T-j |
CPU Freq |
|---|---|---|---|---|
|
100%CPU Loading 50°C with hot air flow |
71.4 |
68.8 |
100 |
3.1 GHz |
|
100%CPU Loading 50°C with hot air flow |
70.4 |
73.2 |
100 |
3.2 GHz |
Test 60°C with air flow
|
Description |
System Top Sink |
CPU Die |
CPU T-j |
CPU Freq |
|---|---|---|---|---|
|
100% CPU Loading 60°C with hot air flow |
76.8 |
81.5 |
100 |
2.99 GHz |
|
100% CPU Loading 60°C with hot air flow |
75 |
79.6 |
100 |
3.15 GHz |
Test 50°C with no air flow
|
Description |
System Top Sink |
CPU Die |
CPU T-j |
CPU Freq |
|---|---|---|---|---|
|
100% CPU Loading 50°C without air flow |
78 |
81.1 |
100 |
3.05 GHz |
|
100% CPU Loading 50°C without air flow |
77 |
81.1 |
100 |
3.06 GHz |