CPT330B-8C8P-G1660

CPT330B-8C8P-G1660
CPT330B-8C8P-G1660
CPT330B-8C8P-G1660
CPT330B-8C8P-G1660

Intel® Coffee Lake-R 9th Xeon/Core i , Autonomous Driving GPU-Computer, 8x Gigabit PoE, 8x CAN BUS, 4x LAN, 2 x 2.5'' SSD, 9V to 48V DC-IN, Nvidia GTX1660S/RTX2060Ti Graphics Card supported

  • Intel® Coffee Lake-R 8/9th  Xeon/Core i Processor
  • Nvidia GTX1660S Graphics Card supported(RTX2060 Optional)
  • DDR4-2666 SO-DIMM up to 64G (Xeon SKU support ECC)
  • Rich I/O support multi sensors: Lidar, Radar, Camera
  • 6 x USB3.0, 2 x USB2.0, 12 x LAN(include 8 x POE) , 8 x CANBUS, 1 x PS/2, 1 x Mic-in/Line-out
  • Hot SWAP 2.5'' SSD Tray
  • Multi Display : HDMI/DVI-I/DP
  • System Power Wide Range DC-IN 9V~48V
  • GPU Power DC-IN 12V
  • Operating Temperature -20°C to 60°C
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  • Technical Profile
  • Specifications
  • CPU Performance
  • Thermal Solution
Introduction

Redesign Long-haul Trucking Logistic

Long-haul trucking continues to play a major role in today’s supply chains. There are plenty of challenges that the trucking logistics are facing now. The most important issue is making the long-haul trucking sustainability. Due to the size and weight of most long-haul trucks, mean this sector is likely to decarbonize slower than most others. In order to improving the efficiency and traffic safety while realizing the sustainability, the fleet management becomes a popular discussion in recent years.

truck edm

 

 

How Autonomous Vehicle Works

Sensors are key components to make a vehicle driverless. Camera, radar, ultrasonic and LiDAR enable an autonomous vehicle to visualize its surroundings and detect objects. Cars today are fitted with a growing number of environmental sensors that perform a multitude of tasks. The control system integrated sensors for AV encompasses three parts: perception, decision and execution.

Truck_2

01. PERCEPTION LAYER

Perception enables sensors to not only detect objects, but also acquire and eventually classify and track objects surround.

02. DECISION LAYER

Decision-taking is one of the most challenging tasks that AVs must perform. It encompasses prediction, path planning, and obstacle avoidance. All of them performed on the basis of previous perceptions.

03.EXECUTION LAYER

Execution layer consists of interconnection between accelerator, brakes, gearbox and so forth. Driven by Real-Time Operating System (RTOS), all these devices can carry out commands issued by Driving Computer.

33

 

Required High Performance Computing Power

7StarLake GPGPU Series

An automated-driving control unit is the core controller of autonomous vehicles. 7Starlake has designed high performance GPGPU computer to EASYMILE to achieve the most advanced driverless shuttle – EZ10 . EZ10 has been launched in 2015 and operated over 26 countries and up to 200 sites, including Asia, Middle East , North America and Europe. EZ10 has no steering wheel, gas pedal or brake pedal, being 100% driverless. Relative to normal cars, hardware accelerators, such as GPUs , CPU and FPGAs are extremely important to autonomous vehicles for handling computation-intensive tasks.

CPT330B

 

High Performance NVIDIA Graphic card

Nvidia designs powerful graphics processing units (GPUs)for gaming and highly professional market for transportation, energy, medical analyse, and public sector. Nowadays, Nvidia has diversified its business focusing on four markets: Gaming, professional visualization, data canter, and artificial intelligence. When it mentioned to typically generation developed by NVDIA, series of GeForce ,RTX graphics cards and  computer systems are powered by NVIDIA Turing™.

Turing is the code name for a graphics processing unit (GPU) microarchitecture developed by Nvidia. Featuring concurrent execution of floating point and integer operations, adaptive shading technology, Turing shaders enable awesome performance increases on better performance. Get more power efficiency over previous generation for a faster, cooler and quieter gaming experience that take advantage of Turing’s advanced graphics features.

01NOVDIA

 

 

Expansion Module

I.   Ethernet Expansion Module

Option 1: 4 x Gigabit Ethernet (RJ45)

Option 2: 2 x Gigabit Ethernet (RJ45)

Option 3: 8 x Gigabit PoE (RJ45)

Option 4: 4 x Gigabit PoE (RJ45)

II. COM Expansion Module

2 x RS232/422/485 with isolated DIDO (4 x DI, 4 x DO)

8 x CANBUS

CPT330B module

 

 

I/O
FRONT

 

Back

 

 

 

System

CPU

8/9th Gen Intel®Coffee Lake-R Xeon LGA1151 Socket Processor, 6 core TDP Max.80W

8/9th Gen Intel®Coffee Lake-R Core i7/i5/i3 LGA1151 Socket Processor, 6 core TDP Max.65W

9th Gen Intel®Coffee Lake-R Core i9 LGA1151 Socket Processor, 8 core TDP Max.35W

Chipset

Intel® C246 

Memory type

DDR4 - 2666MHz SO-DIMM up to 64G(Xeon SKU support ECC)
Storage Device 2 x 2.5" SATAIII HDD/SSD SWAP Tray

Display

 

Graphics Card

NVIDIA GTX1660S supported

Rear I/O

 

COM

2 (RS232/422/485)

Ethernet

4 x RJ45(Optional : 2 x RJ45)

USB

4 x USB3.0, 2 x USB2.0

PS/2

1
Display Play 1

DVI-I

1

Terminal

1 x 2Pin Terminal Block Remote Power ON/OFF

1 x 2Pin Terminal Block Remote Reset

1 x 4Pin Terminal Block External FAN Connector
AUDIO 1 x Mic-in, 1 x Line-out
SSD Tray 2
GPU External Display

1 x GPU GTX1660S(3 x DP + 1 x HDMI)

1 x GPU RTX2060(3 x DP + 1 x HDMI)
GPU External Power DC-IN 12V
System Power DC-IN 9~48V

Front I/O

Power Button

1 x (with LED indicator)

PWR LED

1

HDD LED

1

DIO LED

1

ACT LED

2

SPEED LED

2

HDMI

1

CANBUS

8
POE 8
   

Power Requirement

 
GPU Power Input DC-IN 12V

System Power Input

DC-IN 9 to 48V

Applications, Operating System

Operating System

Windows 10 64Bit

Ubuntu20.04

Physical

 

Dimension (W x D x H)

250x150x264.2mm (WxHxD)

Operating Temperature

-20°C to 60°C

Storage Temperature

-40°C to +85°C
Relative Humidity 5% to 95%, non-condensing

 

 

Intel® Core™ i7-9700TE Processor (up to 3.8 GHz, 8 cores)

Thermal Point \ Testing Temp.
-40°C
-20°C
0°C
+25°C
+50°C
+55°C
+60°C

CPU T-J

0

17

16

58

68

75

91

CPU Die

-10.4

8.8

11.8

38.6

71.9

76

81.5

CPU Heat sink

-13.8

4.7

8.2

34.7

67.8

72

77.3

Δ1=(TJ-Die)

10.4

8.2

4.7

5.0

5.0

7.0

7.0

Δ2=(Die-Heat Sink)

3.4

4.1

4.7

5.0

5.0

6.0

5.0

CPU Frequency (GHz)

3.15

3.02

2.66

2.68

2.57

2.45

2.41

GPU T-J

    

19

57

71

82

88

GPU Die

    

31.5

62.6

85.5

87

89.3

GPU Frequency (GHz)

    

1.5

0.84

0.675

1.125

0.96

Intel® Core™ i7-8700T Processor (up to 2.4 GHz, 6 cores)

Thermal Point \ Testing Temp.
-40°C
-20°C
0°C
+25°C
+50°C
+55°C
+60°C

CPU T-J

 0 20

16

77

95

99

100

CPU Die

 -10 8.2

11.8

38.6

71.9

76

81.5

CPU Heat sink

 -15.7 2.2

8.2

34.7

67.8

72

77.3

Δ1=(TJ-Die)

 10 11.8

4.7

5.0

5.0

7.0

7.0

Δ2=(Die-Heat Sink)

 5.7 6

4.7

5.0

5.0

6.0

5.0

CPU Frequency (GHz)

 2.83 2.85

2.66

2.97

2.26

2.18

2.19

Intel®i7-8700 Processor( up to 3.2 GHz,6 cores)

Test 50°C with air flow

Description

System Top Sink

CPU Die

CPU T-j

CPU Freq

100%CPU Loading

with Graphic

50°C with hot air flow

71.4

68.8

100

3.1 GHz

100%CPU Loading

without Graphic

50°C with hot air flow

70.4

73.2

100

3.2 GHz

Test 60°C with air flow

Description

System Top Sink

CPU Die

CPU T-j

CPU Freq

100% CPU Loading

with Graphic

60°C with hot air flow

76.8

81.5

100

2.99 GHz

100% CPU Loading

without Graphic

60°C with hot air flow

75

79.6

100

3.15 GHz

Test 50°C with no air flow

Description

System Top Sink

CPU Die

CPU T-j

CPU Freq

100% CPU Loading

with Graphic

50°C without air flow

78

81.1

100

3.05 GHz

100% CPU Loading

without Graphic

50°C without air flow

77

81.1

100

3.06 GHz

Patented Thermal Solution

7STARLAKE designs a unique enclosure that is able to stack together both horizontally and vertically. The aluminum heat sink enclosure of CPT330B secures top heat dissipation. It’s well-known that fanless method relies heavily on the precise calculation of the efficiency of each heat dissipating component. 7STARLAKE exclusively adopts special heat radiating material and combining with special CNC cutting, further forged into a lavish sophisticated metal. Superior fanless design guarantees silent operation that enhances the flexibility of mobility and prevents the intrusion of dust and debris. Achieving ultimate reliability and stability, CPT330B can operate under extended temperature ranging from -20 to 60°C.

Patented Thermal Solution