SR10B - Intel® Core™ i7 MIL-STD Fanless Rugged Vibration Proof System
Intel® QM87 MIL-STD Fanless Rugged Vibration Proof System with Intel® Core™ i7 Haswell Processor, SSD easy swap cage, mPCIe expansion 9V to 36V DC-in, Wide Temp. -40°C~70°C
- 4th Generation Intel® Core™ i7 Haswell processors (BGA)
- DDR3 Up to 8GB XR-DIMM
- mSATA Up to 512GB
- Multi-Displays by 2 x DP, 1 x DVI-I
- 1 x mPCIe Expansion slot
- 4 x Intel® Gigabit Ethernet
- 4 x USB 3.0, 4 x COM ports (2x RS232/422/485, 2 x RS232)
- 9V~36V DC-in with power delay on/off
- Extended Temperature -40°C to 70°C
- Optional unique accessory bumper design for vibration resistance
Download
- Technical Profile
- Specifications
- CPU Performance
- SSD Performance
- Thermal Solution
Introduction
The SR10B based on Intel® Haswell QM87 chipset, is powered by Intel® 4th generation Core™ i7/i5/i3 processor onboard. The SR10B can operate effectively in harsh environment under temp range from -40°C to 70°C and is a perfect solution for military, transportation, factory automation and digital signage applications. SR10B is based on EBX form factor, Swissbit XR-DIMM up to 8GB. It supports triple-display, 2 DP and 1 DVI-I, 4 GIGA LAN port, 4 USB 3.0 and 4 COM port. SR10B supplies wide power voltage from 9 to 36V DC-in.
- Unique Features
-
MIL-STD-810G standard designed for shock and vibration
SR10B is designed to meet MIL-STD-810G standard for shock and vibration. MIL-STD-810G standard is considered the upmost principle, which guarantees the system achieves superior quality and stability when operate under extreme harsh environment. We have conducted the test with series of testing procedures for resistance to shock, vibration, dust, humidity, and extreme temperatures. What’s more to make the system more rugged is SR10B designed with EBX form factor and stackable ability. With those two features can provide maximum exceeding solidity when stacking together to prevent loose from vibration. With key components- CPU and SSD soldering on board to enhance the capability of shock and vibration. With unique Wipe Rope Vibration Isolator design, the level of vibration resistance increased.
Wire Rope Vibration Isolator Design for Higher Vibration Resistance
STACKRACK has especially design a Wire Rope Vibration Isolator for SR10B. The Wire Rope Vibration Isolator may sustain higher vibration resistance of the product itself. A Wire Rope Vibration Isolator is widely apply on supporting Military equipment because it may absorb and protect the object from vibration damage in any axes simultaneously, with the protection it may extended the product life operating under long hour vibration environment and vibration shock. The isolator is long life maintenance free tool and it may unload whenever required. Besides, Wipe Rope Vibration Isolators may survive under extreme temperature, corrosion, radioactivity, extreme dry or high humidity and UV Radiation environment.
- System main board
-
1. Intel® Core i7 CPU soldering onboard
OXY5737A is based on EBX rugged single board computer, powered by Intel Ivy Bridge i7-4700EQ quad core processor plus QM87 chipset soldered onboard. With processor soldering on board can enhance the resistance of shock and vibration to allow product operates under every possible condition. With processor solder on board would lower resistance and inductance at the connection enhance effective transmission that could guarantee better and more high frequency performance for the system.
2. 2.5" SATA Easy Storage Accessible Tray
Easy Storage Accessible tray allow customer to access the Storage without disassemble the system. It may let the user remove, replace and carry out the HDD easily. With this feature, SR10 may widely apply in surveillance, data storage and infotaiment purpose due to occasionally or daily storage reload is required.
3. Wide range DC input from 9V~ 36V
For certain application such like transportation and military always challenge the risk of unstable power that might cause damage to the system. Wide range DC input becomes an indispensable element for those applications. SR10B supports Wide range 9V~ 36V DC-in to protect system from damage caused by sudden surge or peak voltage. This feature guarantees the system increasing migration path flexible and eliminates redesign of existing power architecture.
Operating Temp. |
|
|---|---|
| -40°C~70°C | |
System |
|
| CPU | Intel® Core™ i7 Haswell , BGA type Intel® Core i7-4700EQ (4C x 3.4/2.4 GHz GHz), 6M Cache (47W) |
| Chipset | Intel® QM87 Chipset (Intel® DH82QM87 PCH) |
| Memory Type | 1 x DDR3 1600 XR-DIMM up to 8 GB with ECC |
| Expansion Slot | 2 x mPCIe (1 x colay with mSATA) for GEN2 |
| Storage Device | 1 x mSATA up to 512GB 1 x Easy Swap 2.5" Cage |
| Ethernet Chipset | Intel® I210IT & i217LM GbE |
Front I/O |
|
| Power Button | 1 with backlight |
| Power LED | 1 |
| HDD LED | 1 |
| LAN LED | 2 sets |
| USB | 2 x USB 3.0 |
| COM | 2 x RS232 Serial Signals RS232: DCD-, RXD, TXD, DTR-, GND, DSR-, RTS-, CTS- |
| POWER | 1 x Terminal Block |
Rear I/O |
|
| DisplayPort | 2 x 20-pin DP connector (female) |
| DVI-I | 1 x 29-pin DVI-D connector (female) |
| Ethernet | 4 x RJ45 ports |
| COM | 2x RS-232/422/485 ports, Jumper-selectable (DB9 male) Serial Signals RS232: DCD-, RXD, TXD, DTR-, GND, DSR-, RTS-, CTS- RS422: TX-, RX+, TX+, RX-, GND RS485- 4W: TxD+, TxD-, RxD+, RxD-, GND RS485- 2W: DATA-, DATA+, GND |
| USB | 2 x USB 3.0 |
Display |
|
| Display Interface | DVI-I interface x 1: 29-pin DVI-I connectors(female); resolution up to 1920 x 1200@60 Hz; DisplayPort interface x 2: 20-pin DisplayPort connectors (female); resolution up to 3840 x 2160@60 Hz |
| Graphics Controller | Onboard Intel® HD 4600 graphics |
OS support list |
|
| Windows | Windows 8 x32/x64, Windows 10 x32/x64 |
| Linux | Fedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04 |
Mechanical and Environment |
|
| Power Requirement | 9V to 36V DC-in, AT/ATX mode with power delay on/off |
| Dimension | 250 x 149 x 69 mm |
| Weight | 4.11 Kg (9.05lbs) |
| Operating Temp. | -40°C to 70°C(ambient with air flow) |
| Storage Temp. | -40°C to 85°C |
| Relative Humidity | 5% to 95%, non-condensing |
Test Standard |
|
| MIL-STD-810G Test | Method 507.5, Procedure II (Temperature & Humidity) Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock) Method 516.6 Shock-Procedure I Operating (Mechanical Shock) Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration) Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) |
| EMC | CE and FCC certificated |
| Green Product | RoHS, WEEE compliance |
The rugged MIL-STD compliant system, SR10B is equipped with highly effectively heat conductive and heat convective thermal solutions to meet extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system via 8.0 mm copper heat pipes. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.
Content
|
Device Model |
SR10B |
|
Tester |
Ian Huang |
|
Test Result |
Pass |
|
Test Temperature |
High 0°C~70°C / Low -40°C~0°C |
|
Test Time |
8 Hours / 3 Hours |
|
Test Standard |
Reference IEC60068-2 |
|
Test Software |
Burnin test v7.1、 |
|
Criteria |
After testing, system can't halt. |
- Test Configuration
-
Device
Configuration
CPU
Intel® Core i7-4700EQ (4C x 2.4Ghz),
6M Cache (47W)PCH
Intel®QM87
Memory
8GB DDR3 1600 MHz XR DIMM
onboard SSD
Apacer 64G SATA SSD
mSATA PORT
Innodisk 256GB mSATA
Software
Burnin test v7.1、
Crystal DiskMARK3.03,
Intel Extreme Tuning Utility1Chamber
KSON THS-b4t-150 Chipeng SMO-3
- Thermal Measurement
-
STACKRACK provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus STACKRACK conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, STACKRACK is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5 hours which at each temperature point we burn in SR10A for one hour, from 50°C to 85°C.
SR10-01B - IO Performance
Point
-40°C
-20°C
25°C
40°C
45°C
50°C
55°C
60°C
65°C
70°C
CPU T-J
0
21
98
100
100
100
100
100
100
100
CPU Die
-17.3
7.4
81.5
84.2
92.1
93.5
95.5
97.3
97.7
100.6
Heatsink
-36.9
-16.1
61.3
64.3
69.4
72.4
76.2
79.8
83.5
87.2
Δ1=(TJ-Die)
17.3
13.6
16.5
15.8
7.9
6.5
4.5
2.7
2.3
-0.6
Δ2=(Die-Sink)
19.6
23.5
20.2
19.9
22.7
21.1
19.3
17.5
14.2
13.4
CPU Frenquency (GHz)
2.79
2.79
2.69
2.59
2.49
2.19z
2.00
1.70
1.20
0.90
Test Result
on board SSD (Read) MB/s
on board SSD (Write) MB/s
Innodisk 2.5" SATA SSD 3ME3 64GB (Read) MB/s
Innodisk 2.5" SATA SSD 3ME3 64GB SSD (Write) MB/s
Test Configuration
| Device | Configuration | Manufacturer | Part Number |
| CPU | Intel® Core i7-4700EQ (4C x 2.4Ghz), 6M Cache (47W) |
Intel | i7-4700EQ |
| PCH | Intel®QM87 | Intel | QM87 |
| Memory | 8GB DDR3 1600 MHz XR DIMM | Swissbit | SGV08G72B1BB2SA-DCWRT |
| onboard SSD | Apacer 64G SATA SSD | Apacer | 64GB-AP-USDC64GE429-BTM |
| mSATA PORT | Innodisk 256GB mSATA | Innodisk | SGV08G72B1BB2SA-DCWRT |
| Software | Burnin test v7.1、 Crystal DiskMARK3.03, Intel Extreme Tuning Utility1 |
||
| Chamber | KSON THS-b4t-150 Chipeng SMO-3 | KSON Chipeng | THS-b4t-150 SMO-3 |
Effective cooling solution for maximum heat dissipation
STACKRACK implements unique cooling solution with copper heat spreader, pure copper heat pipe and aluminum heat sink for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of copper and aluminum, the copper heat spreader touches the heat source - processor and chipset and absorbs the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, SR10B can ensure high reliability and stability while working under wide range temperature from -40 up to 70°C
Patent Designed Aluminum Heat Sink
The heat sink is made by heat radiating material, which is aim to lowering the temperature by dissipating heat into the surrounding air. 96 % of aluminum, 21 mm height and weighs 1039 g
Pure Copper Heat Pipe
The heat pipes are embedded in the heat sink to ensure 100% tight integration for superior heat dissipation. Especially adopts U shape copper heat pipe to fulfill utmost thermal conductivity, copper heat pipe transfers heat from the heat sources (e.g. CPU, chipset) to the heat sink over relatively long distance. Two-phase heat transfer involves the liquid-vapor phase change of a working fluid.
Copper Heat spreader
Copper heat spreader directly touches the power source area, which can absorb heat rapidly and transfer to heat pipe and allow the high efficiency heat pipe further bring out heat to upper heat sink enclosure
• 99.9% purity of copper, weigh 470 g
OXY5737A
EBX SBC is installed in the middle of the system, dividing segmentation type thermal design into upper and lower module. Lower thermal module decomposition is the same as upper module, which is explained above.
Wire Rope Vibration Isolator design may sustain higher vibration resistance of the product itself.
• 10Grms Vibration and 75Grms Vibration Shock proof with Wipe Rope Vibration Isolator.