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IP65 Military Ice Lake D-2796NT, 20C, 3.1Ghz, 200G Smart NIC MXM-GPU Server

  • Intel® XEON D-2796NT 20 Cores 2.0GHz Max Turbo 3.10GHz
  • 256GB RDIMM ECC DDR4-2933/512G LRDIMM DDR4-2933
  • Nvidia RTX A4500 5888 CUDA cores PCIe Gen 4.0 X 16
  • Nvidia ConnectX-6 100GbE Single-Port QSFP56
  • 2 x 1GBase-T, 2 x 10GBase-T LAN
  • 2 x 2TB 2.5” Swappable SATA Drive with AES function
  • Hardware Secure Erase(AES) button, Swappable CMOS battery
  • IP65 Sealed with External Cooling Blade
  • MIL-STD-810G Thermal, Shock, Vibration, Humidity
  • MIL-STD 18V~36V EMI DC Input
  • Extreme Temperature -20°C to 60°C

 Intel Gold

  • Technical Profile
  • Specifications
  • Ultra High Performance Intel® Xeon Ice Lake-D, D-2796NT (20xCores)
  • NVIDIA MXM-GPU Quadro RTX4500 5888 CUDA
  • MIL-STD 810 Thermal, Vibration, Shock, Humidity
  • 2 x 25GbE SFP28, 2x10GbE
  • Up to 512GB LRDIMM/256GB RDIMM 2 x NVMe PCIe Gen 4.0 U.2
  • Dual Removable Anti-Drop Solid-State Disk
  • Hardware Secure Erase (AES) by option
  • IP65 Sealed with External Cooling Blade
  • MIL-STD-810G Thermal, Shock, Vibration, Humidity
  • MIL-STD 461 EMI/EMC 18V~36V DC-IN(28VDC)
  • Extreme Temperature Support -20~+60°C
Ice Lake_X12SDV


AV800-D27 is 7STARLAKE ruggedized AI Inference platform specifically designed for Intel® Xeon® Ice Lake D-2796NT Processor(20 Cores, 2.0GHz Max Turbo 3.10GHz), NVIDIA MXM RTX A4500 and NVIDIA® ConnectX®-6 DX (200Gb/s, signal port)

With built-in acceleration Intel® Deep Learning Boost, AV800-D27 is able to deliver server-class  and high-end performance for rugged IoT devices. Combining stunning inference performance and high-bandwidth (200Gb/s) networks, AV800-D27 is the perfect HPC platform for versatile edge AI applications.

Designed with NVIDIA MXM RTX A4500(Ampere Architecture-Based 5888 CUDA cores, 46 RT Cores, and 184 Tensor Cores), AV800-D27 will help achieve powerful performance for data-intensive industries such as medical, defense, and transportation.

What’s more, with NVIDIA® ConnectX®-6 DX, AV800-D27 is capable of providing single port of 200Gb/s Ethernet connectivity and highly secure smart network interface card (SmartNIC), which accelerates performance, security, virtualization, SDN/NFV, big data, machine-learning for data center applications.


I.    Ultra-High Performance Intel® Xeon® D Processor ICELAKE-D HCC:


Intel® Xeon® processor D-2700 product family offers hardware and software scalability up to sixteen cores, making it the perfect choice for a broad range of high-performing, low-power solutions that will bring intelligence and Intel® Xeon® reliability, availability, and serviceability (RAS) to the edge. 




Enhanced performance per watt:

Intel® Xeon® processor D-2700 product family delivers exceptional value and unmatched performance density per watt. Its TDP of 100W, industry-leading 10 nm process technology and a compute-only design make it ideal for meeting the diverse needs of customers seeking mid-range low-power, high-density solutions.

II.    NVIDIA Quadro RTXA4500 MXM 

SR800-D27 supports 1 x NVIDIA Quadro RTXA4500 MXM Module; can power the planets most reliable mainstream workstations. Designed into a 115-watt package, RTXA4500 is powered by NVIDIA Ampere architecture, supplying innovative multi-precision performance to accelerate a vast range of modern applications. SR800-D27 w/ Quadro RTXA4500 GPU accelerates diverse cloud workloads. These include high-performance computing, data analytics, deep learning training and inference, graphics and machine learning. RTXA4500 MXM features multi-precision Turing Tensor Cores. It comes in a very compact MXM form factor, helping SR800-D27 deliver ground-breaking performance at scale.


MIL-STD Environment
  • Operating Temperature High: 50°C, MIL-STD-810G, Method 501.5, Procedure I
  • Operating Temp Low: 0°C, MIL-STD-810G, Method 502.5, Procedure I
  • Non-Operating Temperature High: 70°C, MIL-STD-810G, Method 501.5, Procedure II
  • Non-Operating Temperature Low: -40°C, MIL-STD-810G, Method 502.5, Procedure II
  • Operating Altitude: Up to 15,000 ft., MIL-STD-810G, Method 500.5
  • Non-Operating Altitude: Up to 45,000 ft., MIL-STD-810G, Method 500.5
  • Humidity: MIL-STD-810G, Method 507.5, Procedure Ib (Natural Cycle B3)
  • Shock: MIL-STD-810G, Method 516.6, 30 g’s, Saw-tooth, 11ms & MIL-DTL-901E, Grade A, Class II; Type B
  • Vibration: MIL-STD-167, Type I, Deck Mounted Equipment
  • EMI/EMC: MIL-STD-461F, RE101, RE102 (Shipboard Level 1), RS103, CE101, CE102, CS101, CS114, CS116
  • Airborne Noise: MIL-STD-740-1 compliance: 43.7dBA (Idle), 52.5dBA (50%), 54.6dBA (80%).

NVIDIA® ConnectX®-6 DX is a highly secure and advanced smart network interface card (SmartNIC) that accelerates mission-critical cloud and data center applications, including security, virtualization, SDN/NFV, big data, machine learning, and storage. ConnectX-6 DX provides up to two ports of 100Gb/s or a single port of 200Gb/s Ethernet connectivity and is powered by 50Gb/s (PAM4) or 25/10 Gb/s (NRZ) SerDes technology. ConnectX-6 DX features virtual switch (vSwitch) and virtual router (vRouter) hardware accelerations delivering orders-of-magnitude higher performance than softwarebased solutions. ConnectX-6 DX supports a choice of single-root I/O virtualization (SR-IOV) and VirtIO in hardware, enabling customers to best address their application needs. By offloading cloud networking workloads, ConnectX-6 DX frees up CPU cores for business applications while reducing total cost-of-ownership.

Maximum total bandwidth 200Gb/s
Supported Ethernet speeds 10/25/40/50/100/ 200GbE
Number of network ports 1/2
Network interface technologies NRZ/PAM4
Host interface PCIe Gen4.0 x16, with NVIDIA Multi-Host™ technology
DPDK message rate Up to 215Mpps
Platform security Hardware root-oftrust and secure firmware update
Form factors PCIe HHHL, OCP2, OCP3.0 SFF
Network interfaces SFP+, QSFP+, DSFP




Military MXM-GPU System GPGPU AI Inference Computer with Intel® Xeon® ICELAKE-D D-2796NT Processor, IP65 rating, MIL-STD D38999 Connectors, 18V~36V DC-in, Extreme Rugged operating temperature -20~+60 °C


Military MXM-GPU System GPGPU AI Inference Computer with Intel® Xeon® ICELAKE-D D-2775TE Processor, IP65 rating, MIL-STD D38999 Connectors, 18V~36V DC-in, Extreme Rugged operating temperature -20~+60 °C



Intel® Xeon® ICELAKE-D D-2796NT Processor, 20Cores, 40Threads, Base Frequency 2.0GHz

Memory type

256GB RDIMM ECC DDR4-2933/512G LRDIMM DDR4-2933 in 4 DIMM Slot


Graphics Card

NVidia® RTX A4500 5888 CUDA Cores PCIe Gen4.0 x16



2 x NVMe PCIe GEN 4.0 x 4

Hardware Secure Erase (AES) by option

Front I/O


DC In connector


1 x USB3.0 Amphenol USB3FTV7AZNF312 connector


1 x 1GBase-T TV07RW-13-98S connector


1 x 1GBase-T TV07RW-13-98S connector


1 x 10GBase-T M20 RJ45 CAT6A connector


1 x 10GBase-T M20 RJ45 CAT6A connector


1 x 100G Fiber Ethernet Amphenol FSI MPOFTV70ZNN


1 x 10G (Amphenol LCFTV6MDGN)- Options

VGA D-sub 15 connector with waterproof cap

Side I/O

SSD tray

2 x Dual 2.5" HDD/SSD Easy Swap Tray

Power Button

1 x Power Button with LED backlight

Power Requirement

Power Input

MIL-STD-461 EMI power supply, 18V~36V DC-IN (300W)

Applications Military Platforms Requiring Compliance to MIL-STD-810 Where Harsh Temperature, Shock, Vibration, Altitude, Dust and MIL-461 EMI Conditions.
Operating System
Operating System Windows 10 64Bit, Linux by request.
Dimension 405mm x 316mm x 195mm (W x L x H)
Weight 10KGS
Chassis Aluminum Alloy, Corrosion Resistant
Finish Anodic aluminum oxide (Color Iron gray)
Cooling Intelligent Active Cooled
MIL-STD-810G Test

Method 500.5, Procedures I and II (Altitude, Operation):

12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia)

Method 500.5, Procedures III and IV (Altitude, Non-Operation):

15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia)

Method 501.5, Procedure I (Storage/High Temperature)

Method 501.5, Procedure II (Operation/High Temperature)

Method 502.5, Procedure I (Storage/Low Temperature)

Method 502.5, Procedure II (Operation/Low Temperature)

Method 503.5, Procedure I (Temperature shock)

Method 507.5, Procedure II (Temperature & Humidity)

Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24,Vibration)

Method 514.6, Vibration Category 20/Operating (Category 20 & 24,Vibration)

Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock)

Method 516.6, Shock-Procedure I Operating (Mechanical Shock)


Conduction Cooling.

Designed & Manufactured using ISO 9001 Certified Quality Program.


CE102 basic curve, 10kHz - 30 MHz

RE102-4, (1.5 MHz) -30 MHz - 5 GHz

RS103, 200 MHz - 3.2 GHz, 50 V/m equal for all frequencies

EN 61000-4-2: Air discharge: 8 kV, Contact discharge: 6kV

EN 61000-4-3: 10V/m

EN 61000-4-4: Signal and DC-Net: 1 kV

EN 61000-4-5: Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV

CE and FCC


Steady State – 20V~33V,

Surge Low – 18V/500ms,

Surge High – 100V/500ms

Emitted spikes

Injected Voltage surges

Emitted voltage surges

Voltage ripple (2V)

Voltage spikes

Starting Operation

Reverse polarity

Operating Temp. -20 to +60°C
Storage Temp. -40 to +85°C
Relative Humidity 5% to 95%, non-condensing.