AV800-D27

IP65 Military Ice Lake D-2796NT, 20C, 3.1Ghz, 200G Smart NIC MXM-GPU Server

Intel^® XEON D-2796NT 20 Cores 2.0GHz Max Turbo 3.10GHz
256GB RDIMM ECC DDR4-2933/512G LRDIMM DDR4-2933
Nvidia RTX A4500 5888 CUDA cores PCIe Gen 4.0 X 16
Nvidia ConnectX-6 100GbE Single-Port QSFP56
2 x 1GBase-T, 2 x 10GBase-T LAN
2 x 2TB 2.5” Swappable SATA Drive with AES function
Hardware Secure Erase(AES) button, Swappable CMOS battery
IP65 Sealed with External Cooling Blade
MIL-STD-810G Thermal, Shock, Vibration, Humidity
MIL-STD 18V~36V EMI DC Input
Extreme Temperature -20°C to 60°C

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Technical Profile
Specifications

MAIN FEATURE

Ultra High Performance Intel® Xeon Ice Lake-D, D-2796NT (20xCores)
NVIDIA MXM-GPU Quadro RTX4500 5888 CUDA
MIL-STD 810 Thermal, Vibration, Shock, Humidity
2 x 25GbE SFP28, 2x10GbE
Up to 512GB LRDIMM/256GB RDIMM 2 x NVMe PCIe Gen 4.0 U.2
Dual Removable Anti-Drop Solid-State Disk
Hardware Secure Erase (AES) by option
IP65 Sealed with External Cooling Blade
MIL-STD-810G Thermal, Shock, Vibration, Humidity
MIL-STD 461 EMI/EMC 18V~36V DC-IN(28VDC)
Extreme Temperature Support -20~+60°C

INTRODUCTION

AV800

AV800-D27 is 7STARLAKE ruggedized AI Inference platform specifically designed for Intel® Xeon® Ice Lake D-2796NT Processor(20 Cores, 2.0GHz Max Turbo 3.10GHz), NVIDIA MXM RTX A4500 and NVIDIA® ConnectX®-6 DX (200Gb/s, signal port)

With built-in acceleration Intel® Deep Learning Boost, AV800-D27 is able to deliver server-class and high-end performance for rugged IoT devices. Combining stunning inference performance and high-bandwidth (200Gb/s) networks, AV800-D27 is the perfect HPC platform for versatile edge AI applications.

Designed with NVIDIA MXM RTX A4500(Ampere Architecture-Based 5888 CUDA cores, 46 RT Cores, and 184 Tensor Cores), AV800-D27 will help achieve powerful performance for data-intensive industries such as medical, defense, and transportation.

What’s more, with NVIDIA^® ConnectX®-6 DX, AV800-D27 is capable of providing single port of 200Gb/s Ethernet connectivity and highly secure smart network interface card (SmartNIC), which accelerates performance, security, virtualization, SDN/NFV, big data, machine-learning for data center applications.

AV800-D27

I. Ultra-High Performance Intel^® Xeon^® D Processor ICELAKE-D HCC:

Intel^® Xeon^® processor D-2700 product family offers hardware and software scalability up to sixteen cores, making it the perfect choice for a broad range of high-performing, low-power solutions that will bring intelligence and Intel® Xeon® reliability, availability, and serviceability (RAS) to the edge.

Enhanced performance per watt:

Intel^® Xeon^® processor D-2700 product family delivers exceptional value and unmatched performance density per watt. Its TDP of 100W, industry-leading 10 nm process technology and a compute-only design make it ideal for meeting the diverse needs of customers seeking mid-range low-power, high-density solutions.

II. NVIDIA Quadro RTXA4500 MXM

SR800-D27 supports 1 x NVIDIA Quadro RTXA4500 MXM Module; can power the planets most reliable mainstream workstations. Designed into a 115-watt package, RTXA4500 is powered by NVIDIA Ampere architecture, supplying innovative multi-precision performance to accelerate a vast range of modern applications. SR800-D27 w/ Quadro RTXA4500 GPU accelerates diverse cloud workloads. These include high-performance computing, data analytics, deep learning training and inference, graphics and machine learning. RTXA4500 MXM features multi-precision Turing Tensor Cores. It comes in a very compact MXM form factor, helping SR800-D27 deliver ground-breaking performance at scale.

MIL-STD Environment

Operating Temperature High: 50°C, MIL-STD-810G, Method 501.5, Procedure I
Operating Temp Low: 0°C, MIL-STD-810G, Method 502.5, Procedure I
Non-Operating Temperature High: 70°C, MIL-STD-810G, Method 501.5, Procedure II
Non-Operating Temperature Low: -40°C, MIL-STD-810G, Method 502.5, Procedure II
Operating Altitude: Up to 15,000 ft., MIL-STD-810G, Method 500.5
Non-Operating Altitude: Up to 45,000 ft., MIL-STD-810G, Method 500.5
Humidity: MIL-STD-810G, Method 507.5, Procedure Ib (Natural Cycle B3)
Shock: MIL-STD-810G, Method 516.6, 30 g’s, Saw-tooth, 11ms & MIL-DTL-901E, Grade A, Class II; Type B
Vibration: MIL-STD-167, Type I, Deck Mounted Equipment
EMI/EMC: MIL-STD-461F, RE101, RE102 (Shipboard Level 1), RS103, CE101, CE102, CS101, CS114, CS116
Airborne Noise: MIL-STD-740-1 compliance: 43.7dBA (Idle), 52.5dBA (50%), 54.6dBA (80%).

NVIDIA CONNECTX-6 DX

NVIDIA^® ConnectX^®-6 DX is a highly secure and advanced smart network interface card (SmartNIC) that accelerates mission-critical cloud and data center applications, including security, virtualization, SDN/NFV, big data, machine learning, and storage. ConnectX-6 DX provides up to two ports of 100Gb/s or a single port of 200Gb/s Ethernet connectivity and is powered by 50Gb/s (PAM4) or 25/10 Gb/s (NRZ) SerDes technology. ConnectX-6 DX features virtual switch (vSwitch) and virtual router (vRouter) hardware accelerations delivering orders-of-magnitude higher performance than softwarebased solutions. ConnectX-6 DX supports a choice of single-root I/O virtualization (SR-IOV) and VirtIO in hardware, enabling customers to best address their application needs. By offloading cloud networking workloads, ConnectX-6 DX frees up CPU cores for business applications while reducing total cost-of-ownership.

PRODUCT SPECIFICATIONS
Maximum total bandwidth	200Gb/s
Supported Ethernet speeds	10/25/40/50/100/ 200GbE
Number of network ports	1/2
Network interface technologies	NRZ/PAM4
Host interface	PCIe Gen4.0 x16, with NVIDIA Multi-Host™ technology
DPDK message rate	Up to 215Mpps
Platform security	Hardware root-oftrust and secure firmware update
Form factors	PCIe HHHL, OCP2, OCP3.0 SFF
Network interfaces	SFP+, QSFP+, DSFP

Appearance

Dimension

ORDER INFORMATION

AV800-D27-20C

Military MXM-GPU System GPGPU AI Inference Computer with Intel® Xeon® ICELAKE-D D-2796NT Processor, IP65 rating, MIL-STD D38999 Connectors, 18V~36V DC-in, Extreme Rugged operating temperature -20~+60 °C

AV800-D27-16C

Military MXM-GPU System GPGPU AI Inference Computer with Intel® Xeon® ICELAKE-D D-2775TE Processor, IP65 rating, MIL-STD D38999 Connectors, 18V~36V DC-in, Extreme Rugged operating temperature -20~+60 °C

System
Processor	Intel® Xeon® ICELAKE-D D-2796NT Processor, 20Cores, 40Threads, Base Frequency 2.0GHz
Memory type	256GB RDIMM ECC DDR4-2933/512G LRDIMM DDR4-2933 in 4 DIMM Slot
GPU
Graphics Card	NVidia® RTX A4500 5888 CUDA Cores PCIe Gen4.0 x16
Storage
HDD/SDD	2 x NVMe PCIe GEN 4.0 x 4 Hardware Secure Erase (AES) by option
Front I/O
X1	DC In connector
X2	1 x USB3.0 Amphenol USB3FTV7AZNF312 connector
X3	1 x 1GBase-T TV07RW-13-98S connector
X4	1 x 1GBase-T TV07RW-13-98S connector
X5	1 x 10GBase-T M20 RJ45 CAT6A connector
X6	1 x 10GBase-T M20 RJ45 CAT6A connector
X7	1 x 100G Fiber Ethernet Amphenol FSI MPOFTV70ZNN
X8	1 x 10G (Amphenol LCFTV6MDGN)- Options
VGA	D-sub 15 connector with waterproof cap
Side I/O
SSD tray	2 x Dual 2.5" HDD/SSD Easy Swap Tray
Power Button	1 x Power Button with LED backlight
Power Requirement
Power Input	MIL-STD-461 EMI power supply, 18V~36V DC-IN (300W)
Applications
Applications	Military Platforms Requiring Compliance to MIL-STD-810 Where Harsh Temperature, Shock, Vibration, Altitude, Dust and MIL-461 EMI Conditions.
Operating System
Operating System	Windows 10 64Bit, Linux by request.
Physical
Dimension	405mm x 316mm x 195mm (W x L x H)
Weight	10KGS
Chassis	Aluminum Alloy, Corrosion Resistant
Finish	Anodic aluminum oxide (Color Iron gray)
Cooling	Intelligent Active Cooled
Environmental
MIL-STD-810G Test	Method 500.5, Procedures I and II (Altitude, Operation): 12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia) Method 500.5, Procedures III and IV (Altitude, Non-Operation): 15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) Method 507.5, Procedure II (Temperature & Humidity) Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24,Vibration) Method 514.6, Vibration Category 20/Operating (Category 20 & 24,Vibration) Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock) Method 516.6, Shock-Procedure I Operating (Mechanical Shock)
Reliability	Conduction Cooling. Designed & Manufactured using ISO 9001 Certified Quality Program.
MIL-STD-461	CE102 basic curve, 10kHz - 30 MHz RE102-4, (1.5 MHz) -30 MHz - 5 GHz RS103, 200 MHz - 3.2 GHz, 50 V/m equal for all frequencies EN 61000-4-2: Air discharge: 8 kV, Contact discharge: 6kV EN 61000-4-3: 10V/m EN 61000-4-4: Signal and DC-Net: 1 kV EN 61000-4-5: Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV CE and FCC
MIL-STD-1275	Steady State – 20V~33V, Surge Low – 18V/500ms, Surge High – 100V/500ms Emitted spikes Injected Voltage surges Emitted voltage surges Voltage ripple (2V) Voltage spikes Starting Operation Reverse polarity
Operating Temp.	-20 to +60°C
Storage Temp.	-40 to +85°C
Relative Humidity	5% to 95%, non-condensing.