AV800-D27-A45

IP65 MILTARY ICE LAKE D-2733NT, Total 70GbE, Dual 25GSFP, Dual MXM A4500 GPU server

Design to meet MIL-810, MIL-461 EMC/EMI
Intel® Xeon D-2796NT 20 Cores 2.1GHz Max Turbo 3.2GHz
Dual Nvidia RTX A4500 5888 CUDA cores PCIe Gen 4.0 x16
2 x 25GbE SFP28 LAN Port + 2 x RJ45 10 GbE base-T ports
2 NVMe M.2 (R/W, 7150/5250 MB/sec)
3 NVMe U.3 (R/W, 7150/5250 MB/sec)
Hardware Secure Erase(AES) button, Swappable CMOS battery
Extreme Temperature -20°C to 60°C
Size: 405 x 316 x 195 mm.
IP65 Sealed with External Cooling Blade
MIL-STD-810G Thermal, Shock, Vibration, Humidity
Power 18V~36V DC Input

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Technical Profile
Specifications

MAIN FEATURE

Ultra High Performance Intel® Xeon Ice Lake-D, D-2796NT (20xCores)
NVIDIA MXM-GPU Quadro RTX4500 5888 CUDA
MIL-STD 810 Thermal, Vibration, Shock, Humidity
2 x 25GbE SFP28, 2x10GbE
Up to 512GB LRDIMM/256GB RDIMM 2 x NVMe PCIe Gen 4.0 U.2
Dual Removable Anti-Drop Solid-State Disk
Hardware Secure Erase (AES) by option
IP65 Sealed with External Cooling Blade
MIL-STD-810G Thermal, Shock, Vibration, Humidity
MIL-STD 461 EMI/EMC 18V~36V DC-IN(28VDC)
Extreme Temperature Support -20~+60°C

INTRODUCTION

AV800

Artificial intelligence (AI) is quickly becoming one of the most crucial elements of business success. Today, deploying powerful computing platforms that can accelerate and scale their AI-based products and services while adapting them to harsh environments has become vital for many successful military applications.

7Starlake is innovating to address the emerging high-throughput inference market driven by IoT devices which are generating huge amounts of data. The combination of NVIDIA Tensor RT and the new architecture-based GeForce Accelerator is an ideal combination for demanding and latency-sensitive workloads.

I. Ultra-High Performance Intel® Xeon® D Processor ICELAKE-D HCC:

Intel^® Xeon^® processor D-2700 product family offers hardware and software scalability up to sixteen cores, making it the perfect choice for a broad range of high-performing, low-power solutions that will bring intelligence and Intel® Xeon® reliability, availability, and serviceability (RAS) to the edge.

AV800

Enhanced performance per watt:

Intel^® Xeon^® processor D-2700 product family delivers exceptional value and unmatched performance density per watt. Its TDP of 100W, industry-leading 10 nm process technology and a compute-only design make it ideal for meeting the diverse needs of customers seeking mid-range low-power, high-density solutions.

II. NVIDIA Quadro RTXA4500 MXM

SR800-D27 supports 1 x NVIDIA Quadro RTXA4500 MXM Module; can power the planets most reliable mainstream workstations. Designed into a 115-watt package, RTXA4500 is powered by NVIDIA Ampere architecture, supplying innovative multi-precision performance to accelerate a vast range of modern applications. SR800-D27 w/ Quadro RTXA4500 GPU accelerates diverse cloud workloads. These include high-performance computing, data analytics, deep learning training and inference, graphics and machine learning. RTXA4500 MXM features multi-precision Turing Tensor Cores. It comes in a very compact MXM form factor, helping SR800-D27 deliver ground-breaking performance at scale.

MIL-STD Environment

Operating Temperature High: 50°C, MIL-STD-810G, Method 501.5, Procedure I
Operating Temp Low: 0°C, MIL-STD-810G, Method 502.5, Procedure I
Non-Operating Temperature High: 70°C, MIL-STD-810G, Method 501.5, Procedure II
Non-Operating Temperature Low: -40°C, MIL-STD-810G, Method 502.5, Procedure II
Operating Altitude: Up to 15,000 ft., MIL-STD-810G, Method 500.5
Non-Operating Altitude: Up to 45,000 ft., MIL-STD-810G, Method 500.5
Humidity: MIL-STD-810G, Method 507.5, Procedure Ib (Natural Cycle B3)
Shock: MIL-STD-810G, Method 516.6, 30 g’s, Saw-tooth, 11ms & MIL-DTL-901E, Grade A, Class II; Type B
Vibration: MIL-STD-167, Type I, Deck Mounted Equipment
EMI/EMC: MIL-STD-461F, RE101, RE102 (Shipboard Level 1), RS103, CE101, CE102, CS101, CS114, CS116
Airborne Noise: MIL-STD-740-1 compliance: 43.7dBA (Idle), 52.5dBA (50%), 54.6dBA (80%).

System
Processor	Intel^® Xeon^® D-2733NT, 8 core, 16 thread, 15MB Cache, 2.1GHz Max Turbo up to 3.2GHz. Single socket FCBGA-2579 , up to 80W TDP
Memory type	256GB RDIMM ECC DDR4-2666/2400 MHz, 512G LRDIMM DDR4-2666/2400MHz in 4 DIMM Slot
Chipset	Intel^® SoC Integrated
GPU	2 x NVidia® RTX A4500, 5888 CUDA Cores, PCIe Gen4.0 x16
Display	VGA, Resolution up to 1920x1200@60Hz 32bpp
Chipset	Aspeed AST2600 BMC
Ethernet Controller	Dual LAN with 25G SFP28 LAN via SoC Dual LAN with 10G LAN via Intel® X550 Quad LAN with Gigabit LAN via Intel®i350
LAN	4 x 1GBase-T, 2 x 10GBase-T, lan, 2 x 25GBase SFP
Storage	2 x 2TB, 2.5” SSD hot-swap, with AES function 1 x 256GB, NVMe M.2 2280 by PCIe
Power Type	18V~36V DV Input
Dimension	405 mm x 316 mm x 195 mm (W x L x H)
Front I/O
X0	1 x USB 3.0 Amphenol USB3FTV7AZNF 312 Connector
X1 ( 2 x 10GbE Ethernet))	1x Amphenol TV07RW-13-35S (22PIN)
X2	1 x 1GBase-T TV07RW-13-98S connector
X3	1 x 1GBase-T TV07RW-13-98S connector
X4	1 x 1GBase-T TV07RW-13-98S connector
X5	DC In Connector
X6	1 x 10GBase-T M20 RJ45 CAT6A connector
X7	1 x 10GBase-T M20 RJ45 CAT6A connector
X8	1 x 25G Fiber Ethernet Amphenol FSI MPOFTV70ZNN
X9	1 x 25G Fiber Ethernet Amphenol FSI MPOFTV70ZNN
VGA	D-sub 15 connector with waterproof cap
Environmental
MIL-STD-810G Test	Method 500.5, Procedures I and II (Altitude, Operation): 12,192 M, (40,000 ft) for the initial cabin altitude (18.8 Kpa or 2.73 Psia) Method 500.5, Procedures III and IV (Altitude, Non-Operation): 15,240, (50,000 ft) for the initial cabin altitude (14.9 Kpa or 2.16 Psia) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) Method 507.5, Procedure II (Temperature & Humidity) Method 509.7 Salt Spray (50±5)g/L Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 4,Vibration) Method 514.6, Vibration Category 20/Operating (Category 20 & 24,Vibration) Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock) Method 516.6, Shock-Procedure I Operating (Mechanical Shock)
Reliability	Conduction Cooling. Designed & Manufactured using ISO 9001 Certified Quality Program
MIL-STD-461	CE102 basic curve, 10 kHz - 30 MHz RE102-4, (1.5 MHz) -30 MHz - 5 GHz RS103, 200 MHz - 3.2 GHz, 50 V/m equal for all frequencies EN 61000-4-2: Air discharge: 8 kV, Contact discharge: 6kV EN 61000-4-3: 10 V/m, EN 61000-4-4: Signal and DC-Net: 1 kV EN 61000-4-5: Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV CE and FCC
MIL-STD-1275	Steady State – 20V~33V, Surge Low – 18V/500ms, Surge High – 100V/500ms Emitted spikes Injected Voltage surges Emitted voltage surges Voltage ripple (2V) Voltage spikes Starting Operation Reverse polarity
Operating Temp.	-20 to +60°C
Storage Temp.	-40 to +85°C
Relative Humidity	5% to 95%, non-condensing
Operating System
Operating System	Windows 10 64Bit, Linux by option
RoHS	RoHS compliant