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SR700 - M12 Connectors Rugged Computer

M12 Connectors Rugged Computer

Intel® QM87 MIL-STD Fanless Rugged System with Intel® Core™ i7-4700EQ Haswell Processor, IP65 protection, M12-Type Connectors ,9V to 36V DC-in, Wide Temp. -40°C to 70°C

  • Intel® Haswell BGA i7-4700EQ + Intel QM87 PCH(4 cores x 2.4GHz, 47W)
  • DDR3 XR-DIMM up to 8GB memory
  • Onboard SATAIII NAND Drive up to 64GB
  • 2 x mPCIe expansion slot (one co-lay with mSATA)
  • M12 Connectors applied
  • Full IP65 Classified
  • MIL-STD 810G compliant
  • 9V to 36V DC-in with power delay on/off
  • Extended operating temperature. -40°C to 70°C
  • Technical Profile
  • Specifications
  • CPU Performance
  • SSD Performance
  • Thermal Solution
  • Certification
  • Video

 Introduction

SR700, EBX rugged system is a powerful system driven by Intel® 4th generation Haswell CPU and chipset soldering onboard. Processor i7-4700EQ plus Intel® QM87 chipset supports clock speed 2.4 GHz, up to 3.4 GHz. Quad cores, turbo up to 8 cores to cope with enormous data computing. SR700 highlights on its extreme rugged design, high functionality, and specially installed MIL-STD M12 connectors. Full IP65 protection is guaranteed. What's even more impressive is the fact that SR700 can withstand vibration up to 10 Grms and shock up to 75G. It supports extended temperature operation from -40 to 70℃. 9V~36V DC input design can protect system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself. SR700 is the perfect solution to military purposes, such as defense, marine navigation and aviation technology. It also can withstand and survive in the harshest surroundings. Even in fields like mining and offshore drilling, SR700 can provide equally stunning performance.

SR700_07_0

SR700 Front SR700 Rear

Thermal solution for fanless system design

The unique design of STACKRACK's stack rack series integrate both horizontal and vertical placement. Dual-sided aluminum heat sink further secures extreme heat dissipation. STACKRACK incorporates exceptional heat radiating material with exceptional CNC cutting design. Fanless method relies heavily on the precise calculation of the efficiency of each heat dissipating component. Superior fanless design guarantees silent operation that enhances the flexibility of mobility and prevents the intrusion of dust and debris. SR700 supports -40°C up to 70°C extended temperature operation, achieving ultimate reliability and stability.

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MIL-STD 810G Compliant & Full IP65 Anti-water/dust protection

SR stands for Stack & Rack, which means that our SR series systems are capable of stacking and rack mount cabinet placement. With key components such as CPU, memory, and storage devices all soldered onboard, the possible risk of damages caused by sudden impact of vibration and bumping can be diminished to the minimum. MIL-STD tests are established by the US government to simulate how materials would hold up to harsh environments. SR700 has passed the tests concerning its resistance to extremely high & low temperature, humidity, shock, and vibration. SR700 has complete resistance to dust and water, making it even more ruggedized and reliable. SR700 can stand against the intrusion of dust, accidental contact, and water. Not just commercial grade waterproof and dustproof, it can reach Dust Tight level, which guarantees complete protection against ingression. Even the strong power of water jet won't post a threat to it, now this is true ruggedness embodied.

 

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Rugged Connectors (M12 & other MIL-STD variations)

Robust and reliable M12 connectors are implemented for SR700. Compact design meets rugged capability, M12 connectors can seal the connector area securely, operation can continue uninterrupted even under the most severe conditions. What makes SR700 stand out from standard commercial grade product is the fact that all the connectors can be customized to U.S. Military standard connectors (D38999 series) from the famous connector manufacturer Amphenol.

 

• D38999 Series

MIL-DTL-38999 is a high-performance cylindrical connector family designed for cable-to-panel I/O applications in military, aerospace and other demanding hazardous situations. Class D38999 connectors are capable of operation within a temperature range -65 to 200℃. They are lightweight and can stand up to environmental challenges. Made with removable crimp or fixed hermetic solder contacts, these connectors provide high-vibration characteristics and are suitable for severe wind and moisture problem areas.
 

• VG96912

Derived from MIL-D38999 Series, VG96912 incorporates lightweight, scoop proof and high contact density features. The plug and receptacle bodies are manufactured from aluminum alloy and protected by cadmium or nickel plating.

System main board: EBX SBC-OXY5737A
mainBoard_SR700

1. Intel ® Core i7 CPU soldering onboard

SR700 is based on EBX SBC—OXY5737A, powered by Intel Ivy Bridge i7-4700EQ quad core processor plus QM87 chipset soldered onboard. With CPU soldering onboard, there is less conduction of heat and high density interconnection between the motherboard and the components, which reduces the MB from the crisis of overheating. The all-in-one design rugged system guarantees CPU full speed operation at 70℃.

mainBoard_SR700

2. Wide voltage power input 9V~36V with power delay on/off

Wide voltage power input design (9~36V) can protect the system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself. Power delay on/off design allows selectable boot-up & shutdown voltage for low power protection. SR700 provides 8-level power on/off delay time, status of ignition and low voltage can also be detected.

 

mainBoard_SR700

3. Expandable by Extension Storage Module, the SK401

SR700 features stackable PCIe 104 and FPE expansion slot. Optional module connection can be achieved for a variety of devices. Stacking with the storage module – SK401, 2 x 2.5" SSD or HDD and 2 x mSATA can be supported. The SK401 suppports Win 7 OS, XP, Linux, and DOS.

 

 

System
CPU Intel® Core™ i7 Haswell , BGA type
Intel® Core i7-4700EQ (4C x 3.4/2.4 GHz), 6M Cache (47W)
Chipset Intel® QM87 Chipset (Intel® DH82QM87 PCH)
Memory Type 1 x DDR3 1600 XR-DIMM up to 8 GB with ECC
Expansion Slot 2 x mPCIe (1 x colay with mSATA) for GEN2
Storage Device 64GB Onboard SSD
1 x mSATA
1 x 2.5" HDD/SSD
1 x SatckPC Slot
Front I/O
Power Button Waterproof Power Button with LED backlight
Power Input 1 x DC input (4-pin Rugged M12 connector)
X1 2 x USB2.0 (8-pin Rugged M12 connector)
X2 1 x GbE LAN (8-pin Rugged M12 connector)
X3 1 x GbE LAN (8-pin Rugged M12 connector)
X4 1 x VGA (12-pin Rugged M12 connector)
X5 1 x RS232, 1 x RS485 (12-pin Rugged M12 connector)
OS support list
Windows Windows 8 x32/x64、Windows 8.1 x32/x64、Windows 10 x32/x64
Linux Fedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04、Open SUSE 12.2
Mechanical and Environment
Power Requirement 9V to 36V DC-in, AT/ATX mode supports
Dimension 350 x 230 x 76 mm
Weight 8.6 kg (18.9 lbs)
Operating Temp. -40°C to 70°C(ambient with air flow)
Storage Temp. -40°C to 85°C
Relative Humidity 5% to 95%, non-condensing
Test Standard
MIL-STD-810G Test Method 507.5, Procedure II (Temperature & Humidity)
Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6 Shock-Procedure I Operating (Mechanical Shock)
Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)
Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)
EMC CE and FCC compliance
MIL-STD 461F (With Optional Power Module)
Green Product RoHS, WEEE compliance
 Introduction

The SR700 offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers' extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.

SR700_08_0

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Device Model SR700-ET-i7-4700EQ
Tester Ian Huang
Test Result Pass
Test Temperature High 0~75°C / Low -40~0°C
Test Time 9 Hours / 1.5 Hours
Test Standard Reference IEC60068-2
Test Software Burnin test v6.0
Criteria After testing, system can't halt.

 

Test Configuration

Device

Configuration

CPU

Intel® Core i7-4700EQ 2.40GHz

PCH

Mobile Intel QM87 Express Chipset

Memory

Swissbit XR-DIMM 8 GB DDR3-1600

port3 SATAII

Innodisk 256G SATA SSD

port4 SATA II

Innodisk SATAIII 128GB mSATA

PCI Express Mini Card

Innodisk PCIeDOM 1ME3

LAN1

Intel(R) I210 Gigabit Network Connection

LAN2

Intel(R) I217-LM Ethernet Connection

Test Software

Burnin test v6.0、AS SSD Benchmark
Intel Extreme Tuning Utility 4.3.0.11

Chamber

KSON THS-b4t-150 Chipeng SMO-3

Thermal Measurement

STACKRACK provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus STACKRACK conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, STACKRACK is able to analyse the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5 hours which at each temperature point we burn in SR700-ET-i7-4700EQ for one hour, from +50 to +85°C.

 

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SR700 System - IO Performance

Point -40°C 25°C 40°C 45°C 50°C 55°C 60°C 70°C 75°C
CPU T-J 0 81 87 94 99 100 100 100 100
CPU Die -19.9 59.5 65.2 75.3 80.3 84.6 88.2 92.6 96.4
Heatsink -34.2 44.5 51.3 59.2 64.3 70.0 74.6 82.4 86.3
Δ1=(TJ-Die) 19.9 21.5 21.8 18.7 18.7 15.4 11.8 7.4 3.6
Δ2=(Die-Sink) 14.3 15.0 13.9 16.1 16.0 14.6 13.6 10.2 10.1
CPU Frenquency (GHz) 2.79 2.79 2.79 2.79 2.59 2.49 2.19 1.50 1.00

 

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Test Result

NEW_STYLE_products_SR100_SSD08 64GB SSD

NEW_STYLE_products_SR100_SSD092TB SSD

NEW_STYLE_products_SR100_SSD04Apacer 64GB SSD (Read) MB/s

NEW_STYLE_products_SR100_SSD05Apacer 64GB SSD (Write) MB/s

SR800Innodisk 2TB (Read) MB/s

SR800-lineInnodisk 2TB (Write) MB/s

SR700 System - IO Performance

Point -40°C 25°C 40°C 45°C 50°C 55°C 60°C 65°C 70°C 75°C
Innodisk 3ME3 mSATA 64GB (Write) MB/s 120.13 121.91 118.78 121.63 118.34 120.27 120.02 120.37 120.75 119.57
Innodisk 3ME3 mSATA 64GB (Read) MB/s 186.63 185.46 186.97 187.75 186.9 188.79 186.41 186.67 185.87 187.03
Apacer 64GB OnBoard SSD (Write) MB/s 81.79 131.13 133.69 134.25 134.04 134.01 104.91 95.66 135.97 129.68
Apacer 64GB OnBoard SSD (Read) MB/s 254.09 254.11 253.47 253.05 251.68 254.01 218.02 240.72 225.86 231.06
Innodisk PCIeDOM 1ME3 (Write) MB/s 65.56 68.68 71.24 72.95 68.39 65.56 71.81 72.04 71.53 70.27
Innodisk PCIeDOM 1ME3 (Read) MB/s 122.33 121.24 123.35 123.56 122.4 122.33 122.08 122.59 122.28 120.95

Effective cooling solution for maximum heat dissipation:

STACKRACK implements unique cooling solution with copper heat spreader, pure copper heat pipe and aluminum heat sink for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of copper and aluminum, the copper heat spreader touches the heat source - processor and chipset and absorbs the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, SR700 can ensure high reliability and stability while working under wide range temperature from -40°C up to 70°C.

SR700

Dual-Sided Patent Designed Heat Sink

The heat sink is made by heat radiating material which also combines with special CNC cutting, further forged into high efficient heat dissipation metal. For the benefit of achieving IP65 and fanless operation, the size of SR700 is slightly larger than the others in the SR series, this design allows the heat sink to cover larger surface, hence fully elevate heat dissipation efficiency. 96 % of aluminum, 21 mm in height and weighs 2.665. (each side)

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Copper Heat Spreader

The copper heat spreader touches the heat sources directly, instantly absorbs the heat, and transfers to heat pipe. 99.9 % purity of copper, 3.3 mm in height and weighs 80 g.

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CPU Host Board-OXY5737A

STACKRACK QM87 EBX SBC is installed in the middle of the system as a cutoff point, dividing segmentation type thermal design into upper and lower module. Lower thermal module decomposition is the same as upper module which is explained above.

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M12 Rugged Military Grade Connectors

SR700 provides 1 x VGA, 2 x LAN, 1 x COM (RS232), and 2 x USB 2.0, all by rugged M12 type connectors. A waterproof power button is also incorporated for comprehensive military grade I/O protection.

  • Fieldwireable M12 connectors boast its convenience in reduction in wiring time. No extra tools are required for extra secure connection.
  • M12 connectors highlight on robust joint, compact size, and reliability. Screw lock mechanism pushes security and reliability to the extreme.