SR700-SG - M12 Connectors Rugged Computer
Intel® QM87 MIL-STD Fanless Rugged System with Intel® Core™ i7-4700EQ Haswell Processor, NVIDIA® GTX950M/GTX 1050 Ti GPU, IP65 protection, M12-Type Connectors ,9V to 36V DC-in, Wide Temp. -40°C to 70°C
- Intel® Haswell BGA i7-4700EQ + Intel QM87 PCH(4 cores x 2.4GHz, 47W)
- NVIDIA® GTX950M/GTX 1050 Ti GPU
- DDR3 XR-DIMM up to 8GB memory
- Onboard SATAIII NAND Drive up to 64GB
- 2 x mPCIe expansion slot (one co-lay with mSATA)
- M12 Connectors applied
- Full IP65 Classified
- MIL-STD 810G compliant
- 9V to 36V DC-in with power delay on/off
- Extended operating temperature. -40°C to 70°C
Download
- Technical Profile
- Specifications
- CPU Performance
- SSD Performance
- Thermal Solution
- Certification
- Video
Introduction
SR700-SG, EBX rugged system is a powerful system driven by Intel® 4th generation Haswell CPU and chipset soldering onboard. Processor i7-4700EQ plus Intel® QM87 chipset supports clock speed 2.4GHz, up to 3.4GHz. Quad cores, turbo up to 8 cores to cope with enormous data computing. Beside its extreme rugged design, high functionality, vibration endurance up to 10 Grms and shock up to 75G, and specially installed MIL-STD M12 connectors, SR700-SG highlights on its GPU installation. 9V~36V DC input design can protect system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself. SR700-SG is the perfect solution to military purposes, such as defense, marine navigation and aviation technology. It also can withstand and survive in the harshest surroundings with extended temperature operation from -40 to 70℃. Even in fields like mining and offshore drilling, SR700-SG can provide equally stunning performance.
- NVIDIA GTX950M GPU, Prominent Graphic Performance
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SR700-SG is installed with NVIDIA GTX950M GPU (CUDA 640, Clock speed 914MHz) that generates excellent resolution and supports high efficiency and fluency of image processing with competitive G3D Mark and low power consumption. Inherited the remarkable ruggedness and dual-sided thermal design of SR700, SR700-SG can efficiently dissipate the heat generated from both CPU and GPU, maintaining the stability of solution performance. The system possess great superiority for image computing utilization, including 2D/3D mapping and real-time image process for autonomous vehicle, surveillance system for command center, other navigation, radar, detection, sensor and laser systems on all maritime, ground, and aerial applications in both defense and industrial fields.
- Thermal solution for fanless system design
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The unique design of STACKRACK's stack rack series integrate both horizontal and vertical placement. Dual-sided aluminum heat sink further secures extreme heat dissipation. STACKRACK incorporates exceptional heat radiating material with exceptional CNC cutting design. Fanless method relies heavily on the precise calculation of the efficiency of each heat dissipating component. Superior fanless design guarantees silent operation that enhances the flexibility of mobility and prevents the intrusion of dust and debris. SR700-SG supports -40 up to 70°C extended temperature operation, achieving ultimate reliability and stability.
MIL-STD 810G Compliant & Full IP65 Anti-water/dust protection
SR stands for Stack & Rack, which means that our SR series systems are capable of stacking and rack mount cabinet placement. With key components such as CPU, memory, and storage devices all soldered onboard, the possible risk of damages caused by sudden impact of vibration and bumping can be diminished to the minimum. MIL-STD tests are established by the US government to simulate how materials would hold up to harsh environments. SR700-SG has passed the tests concerning its resistance to extremely high & low temperature, humidity, shock, and vibration. SR700-SG has complete resistance to dust and water, making it even more ruggedized and reliable. SR700-SG can stand against the intrusion of dust, accidental contact, and water. Not just commercial grade waterproof and dustproof, it can reach Dust Tight level, which guarantees complete protection against ingression. Even the strong power of water jet won't post a threat to it, now this is true ruggedness embodied.
Rugged Connectors (M12 & other MIL-STD variations)
Robust and reliable M12 connectors are implemented for SR700-SG. Compact design meets rugged capability, M12 connectors can seal the connector area securely, operation can continue uninterrupted even under the most severe conditions. What makes SR700-SG stand out from standard commercial grade product is the fact that all the connectors can be customized to U.S. Military standard connectors (D38999 series) from the famous connector manufacturer Amphenol.
• D38999 Series
MIL-DTL-38999 is a high-performance cylindrical connector family designed for cable-to-panel I/O applications in military, aerospace and other demanding hazardous situations. Class D38999 connectors are capable of operation within a temperature range -65 to 200℃. They are lightweight and can stand up to environmental challenges. Made with removable crimp or fixed hermetic solder contacts, these connectors provide high-vibration characteristics and are suitable for severe wind and moisture problem areas.
• VG96912
Derived from MIL-D38999 Series, VG96912 incorporates lightweight, scoop proof and high contact density features. The plug and receptacle bodies are manufactured from aluminum alloy and protected by cadmium or nickel plating.
- System main board: EBX SBC-OXY5737A
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1. Intel ® Core i7 CPU soldering onboard
SR700-SG is based on EBX SBC—OXY5737A, powered by Intel Ivy Bridge i7-4700EQ quad core processor plus QM87 chipset soldered onboard. With CPU soldering onboard, there is less conduction of heat and high density interconnection between the motherboard and the components, which reduces the MB from the crisis of overheating. The all-in-one design rugged system guarantees CPU full speed operation at 70℃.
2. Wide voltage power input 9V~36V with power delay on/off
Wide voltage power input design (9~36V) can protect the system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself. Power delay on/off design allows selectable boot-up & shutdown voltage for low power protection. SR700-SG provides 8-level power on/off delay time, status of ignition and low voltage can also be detected.
3. Expandable by Extension Storage Module, the SK401
SR700-SG features stackable PCIe 104 and FPE expansion slot. Optional module connection can be achieved for a variety of devices. Stacking with the storage module – SK401, 2 x 2.5" SSD or HDD and 2 x mSATA can be supported. The SK401 supports Win 7 OS, XP, Linux, and DOS.
System |
|
|---|---|
| CPU | Intel® Core™ i7 Haswell , BGA type Intel® Core i7-4700EQ (4C x 3.4/2.4 GHz), 6M Cache (47W) |
| Chipset | Intel® QM87 Chipset (Intel® DH82QM87 PCH) |
| GPU | NVIDIA GeForce GTX950M |
| Memory Type | 1 x DDR3 1600 XR-DIMM up to 8 GB with ECC |
| Expansion Slot | 2 x mPCIe (1 x colay with mSATA) |
| Storage Device | 64GB Onboard SSD 1 x mSATA 1 x 2.5" HDD/SSD |
Front I/O |
|
| Power Button | Waterproof Power Button with LED backlight |
| DC IN | 1 x DC input (4-pin Rugged M12 connector) |
| X1 | 2 x USB2.0 (8-pin Rugged M12 connector) |
| X2 | 1 x GbE LAN (8-pin Rugged M12 connector) |
| X3 | 1 x GbE LAN (8-pin Rugged M12 connector) |
| X4 | 1 x VGA (12-pin Rugged M12 connector) |
| X5 | 1 x RS232, 1 x RS485 (12-pin Rugged M12 connector) |
OS support list |
|
| Windows | Windows 7 x32/x64、Windows 8 x32/x64、Windows 8.1 x32/x64、Windows 10 x32/x64 |
| Linux | Fedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04、Open SUSE 12.2 |
Mechanical and Environment |
|
| Power Requirement | 9V to 36V DC-in, AT/ATX mode supports |
| Dimension | 350 x 230 x 76 mm |
| Weight | 8.6 kg (18.9 lbs) |
| Operating Temp. | -40°C to 70°C (ambient with air flow) |
| Storage Temp. | -40°C to 85°C |
| Relative Humidity | 5% to 95%, non-condensing |
Test Standard |
|
| MIL-STD-810G Test | Method 507.5, Procedure II (Temperature & Humidity) Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock) Method 516.6 Shock-Procedure I Operating (Mechanical Shock) Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration) Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) |
| EMC | CE and FCC compliance MIL-STD 461F (With Optional Power Module) |
| Green Product | RoHS, WEEE compliance |
The SR700-SG offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers' extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.
| Device Model | SR700-SG |
| Tester | Robin Chang |
| Test Result | Pass |
| Test Temperature | High 0°C~70°C / Low -40°C~0°C |
| Test Time | 15Hours / 3Hours |
| Test Standard | Reference IEC60068-2 |
| Test Software | Burnin test v6.0 |
| Criteria | After testing, system can't halt. |
- Test Configuration
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Device
Configuration
CPU Type
Intel® Core i7-4700EQ 2.4GHz
PCH
QM87
Memory
1 x DDR3 1600 XR-DIMM up to 8GB ECC
Graphic
NVIDIA GTX950M
LAN1
Intel® I217 GbE LAN
LAN2
Intel® I210 GbE LAN
Test Software
Burnin test v6.0、AS SSD、 Intel Extreme Tuning Utility、
iperf GPU-Z、FurMark v1.9.2Chamber
KSON THS-b4t-150 Chipeng SMO-3
- Thermal Measurement
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STACKRACK provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus STACKRACK conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, STACKRACK is able to analyses the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 12.5 hours which at each temperature point we burn in SR700-SG for two hour, from 40°C to 70°C.
SR700-SG System - IO Performance
Point -40°C 25°C 40°C 45°C 50°C 55°C 60°C 65°C 70°C 75°C CPU T-J 0 81 87 94 99 100 100 100 100 100 CPU Die -19.9 59.5 65.2 75.3 80.3 84.6 88.2 91.6 92.6 96.4 Heatsink -34.2 44.5 51.3 59.2 64.3 70 74.6 79.2 82.4 86.3 Δ1=(TJ-Die) 11.6 9.4 11 13.1 12.8 10.2 12.8 10.2 10.2 13.6 Δ2=(Die-Sink) 4.6 17 2.5 2.1 3.6 3.3 3.6 3.3 3.3 1.3 CPU Frenquency (GHz) 2.79 2.79 2.79 2.79 2.59 2.49 2.19 1.9 1.5 1.0
Test Result
Apacer 64GB Onboard SSD ( Write ) MB/s
Apacer 64GB Onboard SSD ( Read ) MB/s
SR700-SG System - IO Performance
| Point | -40°C | 25°C | 40°C | 45°C | 50°C | 55°C | 60°C | 65°C | 70°C | 75°C |
| Apacer 64GB Onboard SSD ( Write ) MB/s | 81.79 | 131.13 | 133.69 | 134.25 | 134.04 | 134.01 | 104.91 | 95.66 | 135.97 | 129.68 |
| Apacer 64GB Onboard SSD ( Read ) MB/s | 254.09 | 254.11 | 253.47 | 253.05 | 251.68 | 254.01 | 218.02 | 240.72 | 225.86 | 231.06 |
Dual-Sided Patent Designed Heat Sink
The heat sink is made by heat radiating material which also combines with special CNC cutting, further forged into high efficient heat dissipation metal. For the benefit of achieving IP65 and fanless operation, the size of SR700-SG is slightly larger than the others in the SR series, this design allows the heat sink to cover larger surface, hence fully elevate heat dissipation efficiency. 96 % of aluminum,21 mm in height and weighs 2.665. (each side)
Copper Heat Pipe
The heat pipes are embedded in the heat sink to ensure 100% tight integration for efficient dissipation. Heat pipe transfers heat from the heat sources to the heat sink over relatively long distance. Two-phase heat transfer involves the liquid-vapor phase change of a working fluid.
- 2 heat pipes of 8.0 mm width diameter, and 225mm length; each contains 56-61% purity of copper.
- U shape design reaches the utmost efficiency.
- High heat conductivity coefficient up to 5000
Copper Heat Spreader for CPU
The copper heat spreader directly touches heat sources from CPU and chipset.
- 99.9 % purity of copper, weighs 80 g and consumes 36 cm2
- 3.4 mm height to fulfill the gap between OXY5737A and heat sink enclosure
- Nickel plated to prevent corrosion and rust after long-term use
- Tailor-made two bulges on heat spreader correspond to the placement of CPU and chipset on OXY5737A.
CPU Host Board-OXY5737A
STACKRACK QM87 EBX SBC is installed in the middle of the system as a cutoff point, dividing segmentation type thermal design into upper and lower module. Upper thermal module is applied to cool down the heat generated from graphic card; while the lower thermal module is applied to cool down the heat from CPU module.
SK220 with MXM Graphic Card
NVIDIA® GTX950M StackPC/PCIe104 Graphic Module
PCIe/104(StackPC) carrier module is designed to offer up to 6 independent displays by MXM interface under extended temperature from -40°C ~ 85°C. SK220 is equipped with 6 x miniDP, 1 x VGA (2 x 5 pin header) which can support most MXM graphic cards from NVIDIA.
Copper Heat Spreader for Overall System
The copper heat spreader directly touches heat source which is generated from power voltage transferring.
- 99.9 % purity of copper, weighs 470 g and consumes 113.9 cm2
- 15.5 mm height to fulfill the gap between motherboard and heat sink.
- The tailor made design help to transfer the heat directly to uppers aluminum heat sink
Copper Heat Spreader for Graphic Card
The copper heat spreader directly touches heat sources from GPU-GTX950M.
- 99.9 % purity of copper, weighs 180 g and consumes 30 cm2
- 9.0 mm height to fulfill the gap between graphic card and heat sink enclosure
- Nickel plated to prevent corrosion and rust after long-term use
- Tailor-made three bulges on heat spreader correspond to the placement of two chokes and GPU onSK220 graphic card
M12 Rugged Military Grade Connectors
SR700-SG provides 1 x VGA, 2 x LAN, 1 x COM (RS232), and 2 x USB 2.0, all by rugged M12 type connectors. A waterproof power button is also incorporated for comprehensive military grade I/O protection.
- Field-wireable M12 connectors boast its convenience in reduction in wiring time. No extra tools are required for extra secure connection.
- M12 connectors highlight on robust joint, compact size, and reliability. Screw lock mechanism pushes security and reliability to the extreme.