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THOR200 - 1U GPGPU (SWaP) Rugged Computer

MIL-STD IP65 Rugged System with Intel® Core™ i7-5650U Broadwell Processor, NVIDIA® GT730M GPU, 9V to 36V DC-in, Wide Temp. -40°C to 70°C

  • Intel® Broadwell  i7-5650U 
  • 2 x DDR3L XR-DIMM up to 16GB memory
  • Onboard SATAIII NAND Drive up to 64GB
  • Amphenol M12 connector applied
  • IP65 classify
  • Wide range 9V to 36V DC-in
  • Extended operating temperature. -40°C to 70°C
  • Technical Profile
  • Specifications
  • CPU Performance
  • SSD Performance
  • Thermal Solution


THOR200 is driven by Intel 5th generation Broadwell i7-5650U processor soldering onboard which is an extremely compact Core I-based fanless rugged system. Broadwell processor supports outstanding CPU and graphics performance, providing dual cores 3.2GHz clock speed while consuming low power consumption 9.5W. THOR200 highlight on its rugged design and high functionality, the system especially installed MIL-STD Amphenol type connector and full IP65 protection allow system withstand in any kind of harsh environment. THOR200 supports extended temperature from -40°C to 70°C and wide range 9V~36V DC input can protect system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself.

NVIDIA GT730M GPU, extraordinary graphic performance

THOR200 is installed with NVIDIA GT730M GPU (CUDA 384, Clock speed 719MHz) that generates excellent resolutions, supporting complex image processing. The system possess special dual-sided thermal design developed by STACKRACK, allowing heat dissipation from both bottom (heat from GPU) and upper (heat from CPU) sides and gives flexibility on an installation (The system can be held both vertically and horizontally). With its maximized ruggedness, minimized size and graphic performance, THOR200 can be used for navigation, radar, detection, sensor and laser systems on all maritime, ground, and aerial applications in both defense and industrial fields.



System main board: EPIC OXY5638B SBC

1. Intel Broadwell Core i7-5650U on board

THOR200 is based EPIC OXY5638B, powered by on Intel Broadwell Core i7-5650U and 64GB SSD on board. With CPU and SSD soldering onboard, there is less conduction of heat and high-density interconnection between the motherboard and the components, which reduces the motherboard from the crisis of overheating.


2. Wide voltage power input 9V~36V

To withstand under any kinds of application challenges, system with wide range designed is brings maximum reliability and stability. Wide voltage power input design (9~36V) can protect the system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself.




CPU Intel® Core™ Broadwell-U Processor
Intel® Core™ i5-5350U (2C x 1.8/2.9 GHz), 3M Cache (15W)
Intel® Core™ i7-5650U (4C x 2.2/3.1 GHz), 4M Cache (15W)

GeForce GTX 730 M

CUDA Cores 384

Memory Interface GDDR5

Standard Memory Config 1024 MB

Memory Type 2 x XR-DIMM up to 16 GB
Expansion Slot 2 x mPCIe (1 with mSATA supported)
Storage Device Onboard uSSD SATAIII up to 64 GB
Ethernet Chipset 1 x Intel® I210-IT
1 x Intel® I218-LM
Front I/O
Power Button Water Resistive Power Button with LED Backlight
X1 (COM) 12-Pin A-code Female M12 Connector (Amphenol M12A-12PMMS-SF8001)
X2 (VGA) 12-Pin A-code Female M12 Connector (Amphenol M12A-12PMMS-SF8001)
X3 (LAN) 8-Pin A-code Female M12 Connector (Amphenol M12S-04BFFB-SL7001)
X4 (LAN) 8-Pin A-code Female M12 Connector (Amphenol M12S-04BFFB-SL7001)
X5 (USB 2.0 x2) 8-Pin A-code Female M12 Connector (Amphenol M12S-04BFFB-SL7001)
Rear I/O
Gound Screw 1
DC-in 4-Pin S-code Male M12 Connector (Amphenol M12S-04PMMS-SF8001)
Display Interface VGA: M12 connectors; resolution up to 3840 x 2160
Graphics Controller NVIDIA GT730M(embedded on PCIe/104 form factor)
OS support list
Windows Windows 7 x32/x64、Windows 8 x32/x64、Windows 8.1 x32/x64、Windows 10 x32/x64
Linux Fedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04
Mechanical and Environment
Power Requirement 9V to 36V DC-in, AT/ATX mode
Dimension 220 x 380 x 56 mm
Ingress Protection IP65
Weight 7.5 kg
Operating Temp. -40°C to 70°C (ambient with air flow)
Storage Temp. -40°C to 85°C
Relative Humidity 5% to 95%, non-condensing
Test Standard
MIL-STD-810G Test Method 507.5, Procedure II (Temperature & Humidity)
Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6 Shock-Procedure I Operating (Mechanical Shock)
Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)
Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)
EMC CE and FCC compliance
Green Product RoHS, WEEE compliance


The THOR200 offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers' extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.



evice Model THOR200
Tester Robin Chang
Test Result Pass
Test Temperature High 0°C~70°C / Low -40°C~0°C
Test Time 15 Hours / 3 Hours
Test Standard Reference IEC60068-2
Test Software Burnin test v6.0
Criteria After testing, system can't halt.


Test Configuration



CPU Type

Intel® Core i7-5650U 2.2GHz




1 x DDR3 1600 XR-DIMM up to 4GB ECC


1 x DDR3 1333 XR-DIMM up to 4GB ECC




Intel® I218 GbE LAN


Intel® I210 GbE LAN

Test Software

Burnin test v6.0、AS SSD、 Intel Extreme Tuning Utility、
iperf GPU-Z、FurMark v1.9.2


KSON THS-b4t-150 Chipeng SMO-3

Thermal Measurement

STACKRACK provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus STACKRACK conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, STACKRACK is able to analyses the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 12.5 hours which at each temperature point we burn in THOR200 for two hour, from 40°C to 70°C.


THOR200 MB HeatSink - IO Performance

Point -40°C -20°C 0°C 25°C 55°C 60°C 65°C 70°C 75°C 80°C 85°C
CPU T-J 5 17 39 103 104 103 103 105 105 105 105
CPU Die -19.1 -8.8 10.1 66.4 82.4 86.7 90.3 97.2 107.3 113.2 121.8
Heatsink -21.8 -14.9 4.2 59.1 73.6 76.2 81.7 84.8 91.8 95.8 101.8
Δ1=(TJ-Die) 11.6 9.4 11 13.1 12.8 10.2 12.8 10.2 10.2 10.2 13.6
Δ2=(Die-HeatSink) 4.6 17 2.5 2.1 3.6 3.3 3.6 3.3 3.3 3.3 1.3
CPU Frenquency (GHz) 3.09 3.09 3.03 3.04 2.57 2.45 2.21 2.19 1.51 1.1 0.5



Test Result

SR100Apacer 256G SSD ( Read ) MB/s

NEW_STYLE_products_SR100_SSD03Apacer 256G SSD ( Write ) MB/s

 THOR200 MB HeatSink - IO Performance

Point -40°C 25°C 40°C 45°C 50°C 55°C 60°C 65°C 70°C 65°C 70°C
Apcer 256G SSD ( Read ) MB/s 283.38 284.92 279.46 282.16 296.01 298.17 296.75 292.06 293.93 272.98 220.93
Apcer 256G SSD ( Write ) MB/s 421.13 412.63 419.83 373.77 402.16 412.25 409.93 415.82 408.17 419.16 299.21

Effective cooling solution for maximum heat dissipation:

STACKRACK implements unique cooling solution with copper heat spreader, pure copper heat pipe and aluminum heat sink for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of copper and aluminum, the copper heat spreader touches the heat source - processor to absorbs the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, THOR200 can ensure high reliability and stability while working under wide range temperature from -40°C to 70°C


Patent Designed Aluminum Heat Sink

The heat sink is made by heat radiating material, which is aim to lower the temperature by dissipating heat into the surrounding air, using aluminum material AL6061.


Copper Heat Spreader for Graphic Card

The copper heat spreader directly touches heat sources from GPU-GT730M.


  • 99.9 % purity of copper
  • 9.0 mm height to fulfill the gap between graphic card and heat sink enclosure
  • Nickel plated to prevent corrosion and rust after long-term use
  • Tailor-made three bulges on heat spreader correspond to the placement of two chokes and GPU on SK210 graphic card.

Graphic Module - SK210

A high-end PCIe/104 (StackPC) graphic module featuring NVIDIA® GPU GT730M, which provides GPU clock up to 719 MHz, CUDA 384 cores and supports four independent DisplayPort outputs.


CPU Host Board – OXY5638B

Rugged Intel Broadwell SBC is installed in the middle of the system, dividing segmentation type thermal design into upper and lower module.

Upper thermal module is applied to cool down the heat generated from graphic card; while the lower thermal module is applied to cool down the heat from CPU module.


Copper Heat Spreader for CPU

The copper heat spreader directly touches heat sources from CPU and chipset.


Pure Copper Heat Pipe

The heat pipes are embedded in the heat sink to ensure 100% tight integration for superior heat dissipation. Copper heat pipe transfers heat from the heat sources CPU to the heat sink over relatively long distance. Two-phase heat transfer involves the liquid-vapor phase change of a working fluid. 8.0 mm diameter heat pipe, 99.9% purity of copper High heat conductivity coefficient up to 5000


Amphenol M12 Type

THOR200 all applied by rugged M12 type connectors. A waterproof power button is also incorporated for comprehensive military grade I/O protection.


  • Field-wireable M12 connectors boast its convenience in reduction in wiring time. No extra tools are required for extra secure connection.
  • M12 connectors highlight on robust joint, compact size, and reliability. Screw lock mechanism pushes security and reliability to the extreme.