THOR200 - 1U GPGPU (SWaP) Rugged Computer
MIL-STD IP65 Rugged System with Intel® Core™ i7-5650U Broadwell Processor, NVIDIA® GT730M GPU, 9V to 36V DC-in, Wide Temp. -40°C to 70°C
- Intel® Broadwell i7-5650U
- NVIDIA® GT730M GPU
- 2 x DDR3L XR-DIMM up to 16GB memory
- Onboard SATAIII NAND Drive up to 64GB
- Amphenol M12 connector applied
- IP65 classify
- Wide range 9V to 36V DC-in
- Extended operating temperature. -40°C to 70°C
Download
- Technical Profile
- Specifications
- CPU Performance
- SSD Performance
- Thermal Solution
Introduction
THOR200 is driven by Intel 5th generation Broadwell i7-5650U processor soldering onboard which is an extremely compact Core I-based fanless rugged system. Broadwell processor supports outstanding CPU and graphics performance, providing dual cores 3.2GHz clock speed while consuming low power consumption 9.5W. THOR200 highlight on its rugged design and high functionality, the system especially installed MIL-STD Amphenol type connector and full IP65 protection allow system withstand in any kind of harsh environment. THOR200 supports extended temperature from -40°C to 70°C and wide range 9V~36V DC input can protect system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself.
NVIDIA GT730M GPU, extraordinary graphic performance
THOR200 is installed with NVIDIA GT730M GPU (CUDA 384, Clock speed 719MHz) that generates excellent resolutions, supporting complex image processing. The system possess special dual-sided thermal design developed by STACKRACK, allowing heat dissipation from both bottom (heat from GPU) and upper (heat from CPU) sides and gives flexibility on an installation (The system can be held both vertically and horizontally). With its maximized ruggedness, minimized size and graphic performance, THOR200 can be used for navigation, radar, detection, sensor and laser systems on all maritime, ground, and aerial applications in both defense and industrial fields.
- System main board: EPIC OXY5638B SBC
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1. Intel Broadwell Core i7-5650U on board
THOR200 is based EPIC OXY5638B, powered by on Intel Broadwell Core i7-5650U and 64GB SSD on board. With CPU and SSD soldering onboard, there is less conduction of heat and high-density interconnection between the motherboard and the components, which reduces the motherboard from the crisis of overheating.
2. Wide voltage power input 9V~36V
To withstand under any kinds of application challenges, system with wide range designed is brings maximum reliability and stability. Wide voltage power input design (9~36V) can protect the system from damages caused by sudden surge of voltage, thus further secure the reliability of its critical components and the system itself.
System |
|
|---|---|
| CPU | Intel® Core™ Broadwell-U Processor Intel® Core™ i5-5350U (2C x 1.8/2.9 GHz), 3M Cache (15W) Intel® Core™ i7-5650U (4C x 2.2/3.1 GHz), 4M Cache (15W) |
| GPU |
GeForce GTX 730 M CUDA Cores 384 Memory Interface GDDR5 Standard Memory Config 1024 MB |
| Memory Type | 2 x XR-DIMM up to 16 GB |
| Expansion Slot | 2 x mPCIe (1 with mSATA supported) |
| Storage Device | Onboard uSSD SATAIII up to 64 GB |
| Ethernet Chipset | 1 x Intel® I210-IT 1 x Intel® I218-LM |
Front I/O |
|
| Power Button | Water Resistive Power Button with LED Backlight |
| X1 (COM) | 12-Pin A-code Female M12 Connector (Amphenol M12A-12PMMS-SF8001) |
| X2 (VGA) | 12-Pin A-code Female M12 Connector (Amphenol M12A-12PMMS-SF8001) |
| X3 (LAN) | 8-Pin A-code Female M12 Connector (Amphenol M12S-04BFFB-SL7001) |
| X4 (LAN) | 8-Pin A-code Female M12 Connector (Amphenol M12S-04BFFB-SL7001) |
| X5 (USB 2.0 x2) | 8-Pin A-code Female M12 Connector (Amphenol M12S-04BFFB-SL7001) |
Rear I/O |
|
| Gound Screw | 1 |
| DC-in | 4-Pin S-code Male M12 Connector (Amphenol M12S-04PMMS-SF8001) |
Display |
|
| Display Interface | VGA: M12 connectors; resolution up to 3840 x 2160 |
| Graphics Controller | NVIDIA GT730M(embedded on PCIe/104 form factor) |
OS support list |
|
| Windows | Windows 7 x32/x64、Windows 8 x32/x64、Windows 8.1 x32/x64、Windows 10 x32/x64 |
| Linux | Fedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04 |
Mechanical and Environment |
|
| Power Requirement | 9V to 36V DC-in, AT/ATX mode |
| Dimension | 220 x 380 x 56 mm |
| Ingress Protection | IP65 |
| Weight | 7.5 kg |
| Operating Temp. | -40°C to 70°C (ambient with air flow) |
| Storage Temp. | -40°C to 85°C |
| Relative Humidity | 5% to 95%, non-condensing |
Test Standard |
|
| MIL-STD-810G Test | Method 507.5, Procedure II (Temperature & Humidity) Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock) Method 516.6 Shock-Procedure I Operating (Mechanical Shock) Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration) Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) |
| EMC | CE and FCC compliance |
| Green Product | RoHS, WEEE compliance |
The THOR200 offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers' extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.
| evice Model | THOR200 |
| Tester | Robin Chang |
| Test Result | Pass |
| Test Temperature | High 0°C~70°C / Low -40°C~0°C |
| Test Time | 15 Hours / 3 Hours |
| Test Standard | Reference IEC60068-2 |
| Test Software | Burnin test v6.0 |
| Criteria | After testing, system can't halt. |
- Test Configuration
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Device
Configuration
CPU Type
Intel® Core i7-5650U 2.2GHz
PCH
QM87
Memory
1 x DDR3 1600 XR-DIMM up to 4GB ECC
Memory
1 x DDR3 1333 XR-DIMM up to 4GB ECC
Graphic
NVIDIA GT730M
LAN1
Intel® I218 GbE LAN
LAN2
Intel® I210 GbE LAN
Test Software
Burnin test v6.0、AS SSD、 Intel Extreme Tuning Utility、
iperf GPU-Z、FurMark v1.9.2Chamber
KSON THS-b4t-150 Chipeng SMO-3
- Thermal Measurement
-
STACKRACK provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus STACKRACK conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, STACKRACK is able to analyses the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 12.5 hours which at each temperature point we burn in THOR200 for two hour, from 40°C to 70°C.
THOR200 MB HeatSink - IO Performance
Point -40°C -20°C 0°C 25°C 55°C 60°C 65°C 70°C 75°C 80°C 85°C CPU T-J 5 17 39 103 104 103 103 105 105 105 105 CPU Die -19.1 -8.8 10.1 66.4 82.4 86.7 90.3 97.2 107.3 113.2 121.8 Heatsink -21.8 -14.9 4.2 59.1 73.6 76.2 81.7 84.8 91.8 95.8 101.8 Δ1=(TJ-Die) 11.6 9.4 11 13.1 12.8 10.2 12.8 10.2 10.2 10.2 13.6 Δ2=(Die-HeatSink) 4.6 17 2.5 2.1 3.6 3.3 3.6 3.3 3.3 3.3 1.3 CPU Frenquency (GHz) 3.09 3.09 3.03 3.04 2.57 2.45 2.21 2.19 1.51 1.1 0.5
Test Result
Apacer 256G SSD ( Read ) MB/s
Apacer 256G SSD ( Write ) MB/s
THOR200 MB HeatSink - IO Performance
| Point | -40°C | 25°C | 40°C | 45°C | 50°C | 55°C | 60°C | 65°C | 70°C | 65°C | 70°C |
| Apcer 256G SSD ( Read ) MB/s | 283.38 | 284.92 | 279.46 | 282.16 | 296.01 | 298.17 | 296.75 | 292.06 | 293.93 | 272.98 | 220.93 |
| Apcer 256G SSD ( Write ) MB/s | 421.13 | 412.63 | 419.83 | 373.77 | 402.16 | 412.25 | 409.93 | 415.82 | 408.17 | 419.16 | 299.21 |
Effective cooling solution for maximum heat dissipation:
STACKRACK implements unique cooling solution with copper heat spreader, pure copper heat pipe and aluminum heat sink for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of copper and aluminum, the copper heat spreader touches the heat source - processor to absorbs the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, THOR200 can ensure high reliability and stability while working under wide range temperature from -40°C to 70°C
Patent Designed Aluminum Heat Sink
The heat sink is made by heat radiating material, which is aim to lower the temperature by dissipating heat into the surrounding air, using aluminum material AL6061.
Copper Heat Spreader for Graphic Card
The copper heat spreader directly touches heat sources from GPU-GT730M.
- 99.9 % purity of copper
- 9.0 mm height to fulfill the gap between graphic card and heat sink enclosure
- Nickel plated to prevent corrosion and rust after long-term use
- Tailor-made three bulges on heat spreader correspond to the placement of two chokes and GPU on SK210 graphic card.
Graphic Module - SK210
A high-end PCIe/104 (StackPC) graphic module featuring NVIDIA® GPU GT730M, which provides GPU clock up to 719 MHz, CUDA 384 cores and supports four independent DisplayPort outputs.
CPU Host Board – OXY5638B
Rugged Intel Broadwell SBC is installed in the middle of the system, dividing segmentation type thermal design into upper and lower module.
Upper thermal module is applied to cool down the heat generated from graphic card; while the lower thermal module is applied to cool down the heat from CPU module.
Copper Heat Spreader for CPU
The copper heat spreader directly touches heat sources from CPU and chipset.
Pure Copper Heat Pipe
The heat pipes are embedded in the heat sink to ensure 100% tight integration for superior heat dissipation. Copper heat pipe transfers heat from the heat sources CPU to the heat sink over relatively long distance. Two-phase heat transfer involves the liquid-vapor phase change of a working fluid. 8.0 mm diameter heat pipe, 99.9% purity of copper High heat conductivity coefficient up to 5000
Amphenol M12 Type
THOR200 all applied by rugged M12 type connectors. A waterproof power button is also incorporated for comprehensive military grade I/O protection.
- Field-wireable M12 connectors boast its convenience in reduction in wiring time. No extra tools are required for extra secure connection.
- M12 connectors highlight on robust joint, compact size, and reliability. Screw lock mechanism pushes security and reliability to the extreme.