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SR10M - Intel® Core™ i7 MIL-STD Fanless Rugged System

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Intel® QM87 MIL-STD Fanless Rugged System with Intel® Core™ i7 Haswell Processor, M12 connectors, 9V to 36V DC-in, Wide Temp. -40°C~70°C

  • Core-i7-4700EQ
  • XR-DIMM up to 8GB
  • mSATA Up to 512GB SSD
  • 3 Displays by 2 x DP, 1 x DVI-I
  • 2 x RJ45 Ethernet Ports
  • 2 x LAN ports by M12 connector
  • 4 x USB 3.0, 1 x COM port
  • 9V~36V DC-in with M12
  • Operating : -40°C to 70°C
  • Power bottom with Hand Screw type cover
  • Cold plate and conduction cooling design
  • Technical Profile
  • Specifications
  • CPU Performance
  • SSD Performance
  • Thermal Solution
  • Certification
  • Video

 Introduction

SR10M based on EBX form factor, which is powered by Intel® Haswell QM87 chipset, 4th generation Core™ i7/i5/i3 processor onboard, with Swissbit XR-DIMM up to 8GB. SR10M is design for reliability under demanding MIL-SID810G, it can operate effectively in harsh environment under temp range from -40°C to 70°C and is a perfect solution for military, transportation, factory automation and digital signage applications. SR10M with its feature have heavy-duty fully IP54 Rugged aluminum chassis with M12 connectors. Supports rich I/O : 4xUSB 3.0, 1xCOM, 4x LAN – 2 by M12 Rugged connector and 3 lockable video outputs.

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MIL-STD-810G standard and Conduction Cooling Design

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SR10M - an ultra slim size, which is a compact capable military grade fanless system. With dimension 262x 149x 76mm, SR10M is superior in its compact yet durable exterior design and highly functional interior structure, which allow system to apply in any limited space application usage. SR10M with its feature have heavy-duty fully IP54 Rugged aluminum chassis with M12 connectors. Supports rich I/O : 4xUSB 3.0, 1xCOM, 4x LAN – 2 by M12 Rugged connector and 3 lockable video outputs.

SR10M is designed to meet MIL-STD-810G standard for shock, vibration, humidity/ EMI/EMC conditions. MIL-STD-810G standard is considered the upmost principle, which guarantees the system achieves superior quality and stability when operate under extreme harsh environment. Moreover, SR10M designed with EBX form factor and stackable ability, STACKRACK have conducted the test with series of testing procedures for resistance to shock, vibration, dust, humidity, and extreme temperatures. Besides, featuring cold plate thermal design and conduction cooling, within all the benefits of fanless design, SR10M can ensure high reliability and stability while working under wide range temperature from -40°C to 70°C.

 

System main board: EBX SBC-OXY5737A

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1. Intel® Core i7 CPU soldering onboard

OXY5737A is based on EBX rugged single board computer, powered by Intel Ivy Bridge i7-4700EQ quad core processor plus QM87 chipset soldered onboard. With processor soldering on board can enhance the resistance of shock and vibration to allow product operates under every possible condition. With processor solder on board would lower resistance and inductance at the connection enhance effective transmission that could guarantee better and more high frequency performance for the system.

2. Wide range DC input from 9V~ 36V

For certain application such like transportation and military always challenge the risk of unstable power that might cause damage to the system. Wide range DC input becomes an indispensable element for those applications. SR10A supports Wide range 9V~ 36V DC-in to protect system from damage caused by sudden surge or peak voltage. This feature guarantees the system increasing migration path flexible and eliminates redesign of existing power architecture.

 

 

Operating Temp.
-40°C~70°C
System
CPU Intel® Core™ i7 Haswell , BGA type
Intel® Core i7-4700EQ (4C x 3.4/2.4 GHz GHz), 6M Cache (47W)
Chipset Intel® QM87 Chipset (Intel® DH82QM87 PCH)
Memory Type 1 x DDR3 1600 XR-DIMM up to 8 GB with ECC
Expansion Slot 1 x mPCIe (colay with mSATA) for GEN2
Storage Device mSATA up to 512 GB
Ethernet Chipset 2 x RJ45 : Intel® I210IT & i217LM GbE , 2 x M12 : Intel® I210IT
Front I/O
Power Button 1 with cover
Power LED 1
HDD LED 1
LAN LED 2 sets
USB 2 x USB 3.0
Rear I/O
Power Input 1 x 4-pin X-code M12 connector
DisplayPort 2 x 20-pin DP connector (female)
DVI-I 1 x 29-pin DVI-I connector (female)
Ethernet 2 x RJ45 ports
2 x 8-pin A-code M12 connector
Audio Mic-in, Line-out
COM 1x RS-232/422/485 ports, Jumper-selectable (DB9 male)
Serial Signals
RS232: DCD-, RXD, TXD, DTR-, GND, DSR-, RTS-, CTS-
RS422: TX-, RX+, TX+, RX-, GND
RS485- 4W: TxD+, TxD-, RxD+, RxD-, GND
RS485- 2W: DATA-, DATA+, GND
USB 2 x USB 3.0
Display
Display Interface DVI-I interface x 1: 29-pin DVI-I connectors(female); resolution up to 1920 x 1200@60 Hz;
DisplayPort interface x 2: 20-pin display port connectors (female); resolution up to 3840 x 2160@60 Hz
Graphics Controller Onboard Intel® HD 4600 graphics
OS support list
Windows Windows 7 x32/x64、Windows 8 x32/x64、Windows 8.1 x32/x64、Windows 10 x32/x64
Linux Fedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04
Mechanical and Environment
Power Requirement 9V to 36V DC-in, AT/ATX mode with power delay on
Dimension 262 x 149 x 76mm
Weight 2.98 Kg (6.57 lbs)
Operating Temp. -40°C to 70°C (ambient with air flow)
Storage Temp. -40°C to 85°C
Relative Humidity 5% to 95%, non-condensing
Test Standard
MIL-STD-810G Test Method 507.5, Procedure II (Temperature & Humidity)
Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6 Shock-Procedure I Operating (Mechanical Shock)
Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)
Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)
EMC CE and FCC certificated
Green Product RoHS, WEEE compliance

 The SR10M offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers' extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.

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Content

Device Model SR10M
Tester Robin Chang
Test Result Pass
Test Temperature High 0°C~70°C / Low -40°C~0°C
Test Time 15 Hours / 3 Hours
Test Standard Reference IEC60068-2
Test Software Burnin test v6.0
Criteria After testing, system can't halt.

 

Test Configuration

Device

Configuration

CPU Type

Intel® Core i7-4700EQ 2.4GHz

PCH

QM87

Memory

1 x DDR3 1600 XR-DIMM up to 8GB ECC

Graphic

Intel® HD 4600

LAN1

Intel® I217 GbE LAN

LAN2

Intel® I210 GbE LAN

Software

Burnin test v6.0、AS SSD、 Intel Extreme Tuning Utility、
iperf GPU-Z、FurMark v1.9.2

Chamber

KSON THS-b4t-150 Chipeng SMO-3

Thermal Measurement

STACKRACK provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus STACKRACK conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, STACKRACK is able to analyses the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 12.5 hours which at each temperature point we burn in SR10M for two hour, from 40°C to 70°C.

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SR10M - IO Performance

Point -40°C -20°C 25°C 40°C 45°C 50°C 55°C 60°C 65°C 70°C
CPU T-J 2 20 98 100 100 100 100 100 100 100
CPU Die -9.7 8.5 81.5 84.2 92.1 93.5 95.5 97.3 97.7 100.6
Heatsink -14.6 3 76.2 78.9 84.9 86.8 89.8 92.3 94.7 97.4
Δ1=(TJ-Die) 11.7 11.5 16.5 10 12.8 9.2 6.3 9.2 6.3 2.5
Δ2=(Die-Sink) 4.9 5.5 5.3 7.7 7.5 9.3 5.2 9.3 5.2 6.2
CPU Frenquency (GHz) 2.79 2.79 2.69 2.59 2.49 2.19 2.00 1.70 1.20 0.90

 

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Test Result

SR10Mon board SSD (Read) MB/s

SR10Mon board SSD (Write) MB/s

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 SR10M MB HeatSink - IO Performance

Point -40°C -20°C 25°C 40°C 45°C 50°C 55°C 60°C 65°C 70°C
on board SSD (Read) MB/s 257.63 254.7 8 254.37 262.22 254.9 254.97 255.05 255.32 256.13 261.31
on board SSD (Write) MB/s 132.99 128.61 94.96 127.99 125.3 127.96 126.09 121.98 121.34 125.34

Effective cooling solution for maximum heat dissipation:

STACKRACK implements unique cooling solution with copper heat spreader, pure copper heat pipe, aluminum heat sink and cold plate for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of copper and aluminum, the copper heat spreader touches the heat source - processor and chipset and absorbs the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, SR10A can ensure high reliability and stability while working under wide range temperature from -40°C to 70°C.

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Patent Designed Aluminum Heat Sink

The heat sink is made by heat radiating material, which is aim to lowering the temperature by dissipating heat into the surrounding air. 96 % of aluminum, 21 mm height and weighs 1039 g

CPU Host Board-OXY5737A

STACKRACK QM87 EBX SBC is installed in the middle of the system as a cutoff point, dividing segmentation type thermal design into upper and lower module. Upper thermal module is applied to cool down the heat generated from graphic card; while the lower thermal module is applied to cool down the heat from CPU module.

M12 Rugged Military Grade Connectors

SR10M provides 2 x LAN by rugged M12 type connectors. A power button by hand Screw type cover is also incorporated for rugged level enhancement.

Cold Plate Cooler

The direct contact allows the heat to be efficiently conducted to the thermoelectric (Peltier) modules. This not only keeps the system operating efficiently and also improves the stability of thermal resistance.

Pure Copper Heat Pipe

The heat pipes are embedded in the heat sink to ensure 100% tight integration for superior heat dissipation. Especially adopts U shape copper heat pipe to fulfill utmost thermal conductivity, copper heat pipe transfers heat from the heat sources (e.g. CPU, chipset) to the heat sink over relatively long distance. Two-phase heat transfer involves the liquid-vapor phase change of a working fluid.

• 8.0 mm diameter heat pipe, 225 mm length of each heat pipe, 99.9% purity of copper
• High heat conductivity coefficient up to 5000​​​​