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HORUS420 - 10GbE, Rackmount GPU Server Supporting 150W NVIDIA® GPU

10 GbE , Rackmount GPU Server, NVIDIA

2U  Rackmount Server with Intel® Skylake i7-6700, supporting 120W nVidia® 1080 GPU , 2x 10GbE, 2x 2.5" SSD Easy swap tray, 2x 12V DC-input, extended temp -40~+60 degree supports
NVIDIA® GTX950M (CUDA Cores: 640)GTX 1050 Ti(CUDA Cores: 768)/GTX1060(CUDA Cores: 1280)/GTX1080 (CUDA Cores: 2560) GPU

  • Intel® Skylake i7-6700 (4 cores, 4GHz)
  • 4 x XR-DIMM DDR4 up to 64GB
  • NVIDIA GTX950M/GTX 1050 Ti/ GTX1060M/GTX1080 graphic card
  • Dual 10 GbE
  • 4 x GbE, 6 x USB
  • 2 x 2.5" HDD/ SSD easy swap tray
  • 2 x 12V DC-in
  • Wide temperature -40~+60 Degree supports
  • NVIDIA® GTX950M (CUDA Cores: 640)/GTX1060(CUDA Cores: 1280)/GTX1080 (CUDA Cores: 2560) GPU
  • Technical Profile
  • Specifications
  • CPU Performance
  • SSD Performance
  • Thermal Solution

 Introduction

HORUS420 is designed with Intel 6th generation Skylake i7-6700 processor, Skylake i7-6700 processor presents outstanding CPU performance with quad cores up to 4GHz clock speed. System especially builds in NVIDIA GTX950M graphic card with CUDA cores 640 for high efficiency image processing. With dual 10 GbE ensures high efficiency transmission without any delay for massive data. HORUS420 highlights on it rugged design and high functionality, system especially designed with dual sided thermal solution, allow powerful system presents supreme performance under harsh environment. HORUS420 supports extended temperature from -40°C to 50°C and 2x 12V DC input, by reserving one extra 12V DC-in, user can select even more powerful graphic card for their application requirement and equip sufficient power source.

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Unique Features

Dual sided thermal solution ensures supreme system performance

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With combination of high end CPU computing and graphic GPU power generate numerous heat, STACKRACK emphasizes on providing exceeding thermal design guarantee superior system performance under critical environment. HORUS420 innovatively adopts dual sided thermal solution, with copper heat spreader directly touches the heat source components processor and graphic GPU to absorb the heat rapidly, heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid which can provide high efficiency heat transmission. The aluminum heat sink dissipates the heat into surrounding air promptly. One side thermal solution is mainly for Core i7-6700 65W processor and the other side is to dissipate the heat for graphic GTX950M GPU. With unique thermal design, HORUS420 can ensure high performance and reliability under harsh environment. By integrating optional active cooling fan kits ensures system CPU i7-6700 and GPU GTX950M run full speed without throttling while working under extended temperature environment -40°C to 50°C.

Dual 10 GbE offers high efficiency and stable transmission

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In an advanced and high technology society, people yearn for high speed. To achieve zero delay transmission is always challenging, STACKRACK HORUS420 offers dual 10 GbE allow system provide high-speed transmission without any delay and stable transmission. With 10 GbE, providing key improvements in terms of bandwidth, latency, scalability, reliability and application performance compare to traditional GbE.

Graphic card build in for up to 6 independent Display output

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HORUS420 builds in graphic card with NVIDIA GTX950M/ GTX1060M by user's requirement, system with GTX950M graphic card can support up to 5 independent display output; with NVIDIA GTX1060M graphic card can support up to 6 independent display output, By horizontal graphic card installation, HORUS420 is able to achieve slim size 2U despite of the add-on graphic module, which breaks the stereotype that can only apply cumbersome 4U rack mount with expansion slots in large-scale video wall application. The appeal of HORUS420A lies in its ability to provide creativity, scalability and functionality. It can flexibly match up different space allocation, no matter put in cabinet, machine room or control room.

 

System main board: ATX AB20
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1. Intel Skylake Core i7-6700 powerful processor

HORUS420 is based ATX formfactor AB20 motherboard, powered by Intel 6th generation Skylake Core i7-6700, Skylake processor presenting superior CPU and graphics performance, providing quad cores up to 4GHz clock speed over compact size 2U rackmount.

2.Rich I/O interface

AB20 equips extensive I/O interface to fulfill different application requirements. The board supports four XR-DIMM RAM up to 64GB, it offers 4x LAN, 10x USB and 6x COM for device connects ability, with 4x Mini PCIe slot, 1x PCIex8 and1x PCIex4 can add on extra feature for different demands. With MXM slot can integrate with graphic card for image processing usage.

 
Operating Temp.
-40°C to 70°C 
System
CPU Intel® Core™ Skylake-S
Intel® Core i3-6100 (2C x 3.7 GHz), 3M Cache (65W)
Intel® Core i5-6500 (4C x 3.2/3.6 GHz),6M Cache (65W)
Intel® Core i7-6700 (4C x 3.4/4.0 GHz), 8M Cache (65W)
Chipset Intel® Q170 Chipset
Memory Type 4 x DDR4 XR-DIMM up to 64 GB
Expansion Slot 4 x mPCIe (2 supported with mSATA)
Storage Device 2 x 2.5" HDD/SSD trays
Ethernet Chipset 3 x Intel® I210-IT
1 x Intel® I219-LM
1 x Intel® X540 (Optional)
Front I/O
Power Button 1 with backlight
USB 2 x USB 2.0
2.5" HDD/SSD Tray 2
Power Input 2 x 4-pin Terminal Block (1 for MXM)
DisplayPort 1 x DP++ from CPU
6 x DP++ from MXM Graphic Card
HDMI 1 x HDMI
10 Gigabit Ethernet 2 x RJ45
1 Gigabit Ethernet 4 x RJ45
USB 4 x USB 3.0
OS support list
Windows Windows 8.1 x32/ x64、Windows 10 x32/ x64
Linux Fedora 15, Ubuntu, Red Hat
Mechanical and Environment
Power Requirement 12V DC-in, AT/ATX
Dimension 430 x 279 x 88 mm
Weight 9.7 kg (21.8 lbs)
Operating Temp. -40°C to 50°C(ambient with air flow)
Storage Temp. -40°C to 85°C
Relative Humidity 5% to 95%, non-condensing
Test Standard
MIL-STD-810G Test Method 507.5, Procedure II (Temperature & Humidity)
Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6 Shock-Procedure I Operating (Mechanical Shock)
Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)
Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)
EMC CE, FCC compliant
Green Product RoHS, WEEE compliance

Ordering Information

HORUS420-950

2U 19” Rugged Rackmount with Intel® 6th gen Core i7-6700, NVIDIA GTX950M, Operating Temperature -40~+70°C

HORUS420-950-10GbE

2U 19” Rugged Rackmount with Intel® 6th gen Core i7-6700, NVIDIA GTX950M, Dual 10GbE, Operating Temperature -40~+50°C

HORUS420-1060-10GbE

2U 19” Rugged Rackmount with Intel® 6th gen Core i7-6700, NVIDIA GTX1060M, Dual 10GbE, Operating Temperature -40~+50°C

 

The ROC420 offers highly effectively heat conductive and heat convective thermal solutions to meet the demands of customers' extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.

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Device Model

HORUS420

Tester

Marc

Test Result

Pass

Test Temperature

High 0°C~50°C / Low -40°C~0°C

Test Time

8.5 Hours / 3 Hours

Test Standard

Reference IEC60068-2

Test Software

burn in test 8.0 AS SSD 1.9

Criteria

After testing, system can't halt.

 

Test Configuration
Device
Configuration

CPU

Intel® Core i7-6700 3.4GHz

PCH

Intel Q170

Memory SODIMM1

innodisk 8GB SOD DDR4 XR DIMM

Memory SODIMM2

innodisk 8GB SOD DDR4 XR DIMM

Test Software

Burnin test v6.0、AS SSD、 Intel Extreme
Tuning Utility、iperf
GPU-Z、FurMark v1.9.2

Chamber

KSON THS-b4t-150 Chipeng SMO-3

Thermal Measurement

STACKRACK provides real lab testing figures to show how CPU performance is with each tailor made thermal kits as important references and design guide for system engineers. For system integration, the crucial challenge is the operation performance under high temperature, thus STACKRACK conducts long time experiments to make sure the superior testing result for all critical missions. By revealing temperature at processor T junction, processor die and heat sink, STACKRACK is able to analyses the thermal solution we designed achieves maximum efficacy and observe CPU performance. The high temperature testing takes 5.5 hours which at each temperature point we burn in HORUS420 for two hour, from 40°C to 50°C.

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ROC420- IO Performance with FAN

Point
-40°C
-20°C
0°C
25°C
50°C

CPU T-J

38

42

53

76

87

CPU Die

18

20

30

60

75

Heatsink

4.6

13.7

24.3

56

73.2

Δ1=(TJ-Die)

20

22

23

16

12

Δ2=(Die-Sink)

13.4

6.3

5.7

4.5

5.5

CPU Frenquency (GHz)

3.69

3.69

3.69

3.68

2.99

 
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Test Result

HORUS420Innodisk 64GB SSD ( Read ) MB/s

HORUS420Innodisk 64GB SSD ( Write ) MB/s

 

 

HORUS420 MB HeatSink - IO Performance

Point
-40°C
-20°C
0°C
25°C
50°C
Innodisk 64GB SSD ( Read ) MB/s

523.57

505.88

505.19

518

505.77

Innodisk 64GB SSD ( Write ) MB/s

191.27

192.8

192.89

195.17

193.81

 

 Effective cooling solution for maximum heat dissipation:

With HORUS420, it's all about the incorporation of different heat dissipating part to create an almighty thermal conduction power. HORUS420 adopts dual sided thermal solution, with copper heat spreader directly touches the heat source components processor and graphic GPU to absorb the heat rapidly, the heat then transfer to heat pipe, the aluminum heat sink dissipates the heat into surrounding air promptly. With unique thermal design, HORUS420 can ensure high performance and reliability while working under extended range temperature from -40°C up to 50°C.

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Dual Sided High Efficiency Thermal solution

HORUS420 adopts dual sided thermal solution, with copper heat spreader directly touches heat source components processor and graphic GPU to absorb the heat rapidly, the heat then transfer to heat pipe, aluminum heat sink dissipates the heat into surrounding air promptly. One side thermal solution is mainly for Core I processor and the other side is to dissipate the heat for graphic GPU

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Active cooling fan kits (By option)

By integrating active cooling fan kits ensures system CPU i7-6700 and GPU GTX950M run full speed without throttling even under harsh environment -40°C~50°C

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Motherboard AB20

ATX AB20 powered by Intel 6th generation Skylake Core i7-6700 CPU, Skylake processor offers superior CPU and graphics performance, providing quad cores up to 4 GHz clock speed

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2x 2.5" Easy swap SSD/ HDD

HORUS420 supports 2x 2.5" Easy swap SSD/ HDD allow user to access storage easily