Skip to main content

SR10A - Intel® 4 Gen. Core™ i7 Fanless Rugged Vibration Proof System

NEW_STYLE_products_SR10A

Intel® QM87 MIL-STD Fanless Rugged Vibration Proof System with Intel® Core™ i7 Haswell Processor, mPCIe expansion 9V to 36V DC-in, Wide Temp. -40°C~70°C

  • 4th Generation Intel® Core™ i7 Haswell processors (BGA)
  • DDR3 Up to 8GB XR-DIMM
  • mSATA Up to 256GB
  • Multi-Displays by 2 x DP, 1 x DVI-I
  • 1 x mPCIe Expansion slot - 2 x PCIe Intel® Gigabit Ethernet
  • 4 x USB 3.0, 1 x COM ports (RS232/422/485)
  • 9V~36V DC-in with power delay on/off
  • Extended Temperature -40 to 70 °C
  • Optional unique accessory bumper design for vibration resistence
  • Technical Profile
  • Specifications
  • CPU Performance
  • SSD Performance
  • Thermal Solution
 Introduction

The SR10A based on Intel® Haswell QM87 chipset, is powered by Intel® 4th generation Core™ i7/i5/i3 processor onboard. The SR10A can operate effectively in harsh environment under temp range from -40 to 70°C and is a perfect solution for military, transportation, factory automation and digital signage applications. SR10A is based on EBX form factor, Swissbit XR-DIMM up to 8GB. It supports triple-display, 2 DP and 1 DVI-I, 2 GIGA LAN port, 4 USB 3.0 and 1 COM port. SR10A supplies wide power voltage from 9 to 36V DC-in.

NEW_STYLE_products_SR10A_02

Unique Challenges

NEW_STYLE_products_SR10A_03

MIL-STD-810G standard designed for shock and vibration

SR10 is designed to meet MIL-STD-810G standard for shock and vibration. MIL-STD-810G standard is considered the upmost principle, which guarantees the system achieves superior quality and stability when operate under extreme harsh environment. We have conducted the test with series of testing procedures for resistance to shock, vibration, dust, humidity, and extreme temperatures. What’s more to make the system more rugged is SR10A designed with EBX form factor and stackable ability. With those two features can provide maximum exceeding solidity when stacking together to prevent loose from vibration. With key components- CPU and SSD soldering on board to enhance the capability of shock and vibration. With optional Bumper design, the level of vibration resistance increased.
 

Wire Rope Vibration Isolator Design for Higher Vibration Resistance

STACKRACK has especially design a Wire Rope Vibration Isolator for SR10A. The Wire Rope Vibration Isolator may sustain higher vibration resistance of the product itself. 

A Wire Rope Vibration Isolator is widely apply on supporting Military equipment because it may absorb and protect the object from vibration damage in any axes simultaneously, with the protection it may extended the product life operating under long hour vibration environment and vibration shock. The isolator is long life maintenance free tool and it may unload whenever required. Besides, Wipe Rope Vibration Isolators may survive under extreme temperature, corrosion, radioactivity, extreme dry or high humidity and UV Radiation environment.

 

System main board: EBX SBC-OXY5737A

1. Intel® Core i7 CPU soldering onboard
OXY5737A is based on EBX rugged single board computer, powered by Intel Ivy Bridge i7-4700EQ quad core processor plus QM87 chipset soldered onboard. With processor soldering on board can enhance the resistance of shock and vibration to allow product operates under every possible condition. With processor solder on board would lower resistance and inductance at the connection enhance effective transmission that could guarantee better and more high frequency performance for the system.

2. Expandable by Extension mPCIe x 2 slot
SR10A carries two mPCIe Slots, one co-lay with mSATA and one may for extra expansion.

3. Wide range DC input from 9V~ 36V
For certain application such like transportation and military always challenge the risk of unstable power that might cause damage to the system. Wide range DC input becomes an indispensable element for those applications. SR10A supports Wide range 9V~ 36V DC-in to protect system from damage caused by sudden surge or peak voltage. This feature guarantees the system increasing migration path flexible and eliminates redesign of existing power architecture.

 

Operating Temp.
-40°C~70°C  
System
CPU Intel® Core™ i7 Haswell , BGA type
Intel® Core i7-4700EQ (4C x 3.4/2.4 GHz GHz), 6M Cache (47W)
Chipset Intel® QM87 Chipset (Intel® DH82QM87 PCH)
Memory Type 1 x DDR3 1600 XR-DIMM up to 8 GB with ECC
Expansion Slot 2 x mPCIe (1 x colay with mSATA) for GEN2
Storage Device 1 x mSATA up to 512GB
Ethernet Chipset Intel® I210IT & i217LM GbE
Front I/O
Power Button 1 with backlight
Power LED 1
HDD LED 1
LAN LED 2 sets
USB 2 x USB 3.0
POWER 1 x Terminal Block
Rear I/O
DisplayPort 2 x 20-pin DP connector (female)
DVI-I 1 x 29-pin DVI-D connector (female)
Ethernet 2 x RJ45 ports
COM 1x RS-232/422/485 ports, Jumper-selectable (DB9 male)
Serial Signals
RS232: DCD-, RXD, TXD, DTR-, GND, DSR-, RTS-, CTS-
RS422: TX-, RX+, TX+, RX-, GND
RS485- 4W: TxD+, TxD-, RxD+, RxD-, GND
RS485- 2W: DATA-, DATA+, GND
USB 2 x USB 3.0
Display
Display Interface DVI-I interface x 1: 29-pin DVI-I connectors(female); resolution up to 1920 x 1200@60 Hz;
DisplayPort interface x 2: 20-pin DisplayPort connectors (female); resolution up to 3840 x 2160@60 Hz
Graphics Controller Onboard Intel® HD 4600 graphics
OS support list
Windows Windows 7 x32/x64, Windows 8 x32/x64, Windows 10 x32/x64
Linux Fedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04
Mechanical and Environment
Power Requirement 9V to 36V DC-in, AT/ATX mode with power delay on/off
Dimension 262 x 149 x 69 mm
Weight 3.81 Kg (8.39lbs)
Operating Temp. -40°C to 70°C(ambient with air flow)
Storage Temp. -40°C to 85°C
Relative Humidity 5% to 95%, non-condensing
Test Standard
MIL-STD-810G Test Method 507.5, Procedure II (Temperature & Humidity)
Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6 Shock-Procedure I Operating (Mechanical Shock)
Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)
Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)
EMC CE and FCC certificated
Green Product RoHS, WEEE compliance

 The rugged MIL-STD compliant system, SR10A is equipped with highly effectively heat conductive and heat convective thermal solutions to meet extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system via 8.0 mm copper heat pipes. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.

NEW_STYLE_products_SR10A_CPU01

Device Model SR10A
Tester Ian Huang
Test Result Pass
Test Temperature High 0°C~70°C / Low -40°C~0°C
Test Time 8Hours / 3Hours
Test Standard Reference IEC60068-2
Test Software Burnin test v7.1、
Crystal DiskMARK3.03,
Intel Extreme Tuning Utility1
Criteria After testing, system can't halt.

 

Test Standard

Device

Configuration

CPU

Intel® Core i7-4700EQ (4C x 2.4Ghz),
6M Cache (47W)

PCH

Intel®QM87

Memory

8GB DDR3 1600 MHz XR DIMM

onboard SSD

Apacer 64G SATA SSD

mSATA PORT

Innodisk 256GB mSATA

Software

Burnin test v7.1
Crystal DiskMARK3.03,
Intel Extreme Tuning Utility1

Chamber

KSON THS-b4t-150 Chipeng SMO-3

Thermal Measurement

The rugged MIL-STD compliant system, SR10A is equipped with highly effectively heat conductive and heat convective thermal solutions to meet extended temperature requirements. The heat conductive solutions uses an aluminum flat mass to place in direct contact with the processor and chipset, the heat from chips then transfers it to the case of the system via 8.0 mm copper heat pipes. In addition, the convective thermal solutions introduce airflow directed to move across the surface of a fin style heatsink placed on top of the processor and chipset. This can be done with the aid of an appropriately sized fan placed in top of the fin style heatsink. Alternately, enclosure airflow can be routed to flow across a fin style heatsink.

NEW_STYLE_products_SR10A_CPU02

SR10A - IO Performance

Point -40°C -20°C 25°C 40°C 45°C 50°C 55°C 60°C 65°C 70°C
CPU T-J 2 20 98 100 100 100 100 100 100 100
CPU Die -9.7 8.5 81.5 84.2 92.1 93.5 95.5 97.3 97.7 100.6
Heatsink -33.7 -16.2 61.3 64.3 69.4 72.4 76.2 79.8 83.5 87.2
Δ1=(TJ-Die) 11.7 11.5 16.5 15.8 7.9 6.5 4.5 2.7 2.3 -0.6
Δ2=(Die-Sink) 24 24.7 20.2 19.9 22.7 21.1 19.3 17.5 14.2 13.4
CPU Frenquency (GHz) 2.79 2.79 2.69 2.59 2.49 2.19 2.00 1.70 1.20 0.90

NEW_STYLE_products_SR10A_SSD01

Test Result

SR100On board SSD (Read) MB/s

NEW_STYLE_products_SR100_SSD03On board SSD (Write) MB/s

NEW_STYLE_products_SR100_SSD08_02mSATA (Read) MB/s

NEW_STYLE_products_SR100_SSD09_02mSATA (Write) MB/s

SR10-01A - IO Performance

Point -40°C -20°C 25°C 40°C 45°C 50°C 55°C 60°C 65°C 70°C
On board SSD (Read) MB/s 257.63 254.78 254.37 262.22 254.9 254.97 255.05 255.32 256.13 261.31
On board SSD (Write) MB/s 132.99 128.61 94.96 127.99 125.3 127.96 126.09 121.98 121.34 125.34
mSATA (Read) MB/s 188.6 201.8 199.7 192.5 198.6 200.6 206.6 193.5 199.4 199.8
mSATA (Write) MB/s 155.3 160.2 159.7 160.6 147.52 152.3 160.4 149 151.5 149.1

Effective cooling solution for maximum heat dissipation:

STACKRACK implements unique cooling solution with copper heat spreader, pure copper heat pipe and aluminum heat sink for maximum heat dissipation. With the aluminum heat sink enclosure allows dual-sided heat dissipation. We especially adopt the physical property of copper and aluminum, the copper heat spreader touches the heat source - processor and chipset and absorbs the heat rapidly, the heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid, the aluminum heat sink dissipates the heat into surrounding air promptly. With the benefits of fanless design, SR10A can ensure high reliability and stability while working under wide range temperature from -40°C to 70°C

NEW_STYLE_products_SR10A_Thermal01

Patent Designed Aluminum Heat Sink

The heat sink is made by heat radiating material, which is aim to lowering the temperature by dissipating heat into the surrounding air. 96 % of aluminum, 21 mm height and weighs 1039 g

 

Pure Copper Heat Pipe

The heat pipes are embedded in the heat sink to ensure 100% tight integration for superior heat dissipation. Especially adopts U shape copper heat pipe to fulfill utmost thermal conductivity, copper heat pipe transfers heat from the heat sources (e.g. CPU, chipset) to the heat sink over relatively long distance. Two-phase heat transfer involves the liquid-vapor phase change of a working fluid.

• 8.0 mm diameter heat pipe, 225 mm length of each heat pipe, 99.9% purity of copper
• High heat conductivity coefficient up to 5000

 

Copper Heat spreader

Copper heat spreader directly touches the power source area, which can absorb heat rapidly and transfer to heat pipe and allow the high efficiency heat pipe further bring out heat to upper heat sink enclosure

• 99.9% purity of copper, weigh 470 g

 

OXY5737A

EBX SBC is installed in the middle of the system, dividing segmentation type thermal design into upper and lower module. Lower thermal module decomposition is the same as upper module, which is explained above.

 

Wire Rope Vibration Isolator design may sustain higher vibration resistance of the product itself.

• 10Grms Vibration and 75Grms Vibration Shock proof with Wipe Rope Vibration Isolator.